A extrusion process and apparatus for the deposition of precise, usually small amounts of extrudate (4) for adhesion to a substrate (1) comprising an extruder (2) positioned close to the substrate (1) and a jet of hot gas (6) directed onto the extrudate (1) between the extruder (2) and the substrate (1) in order to retain the adhesive properties between the extrudate (4) and the substrate (1).

The present disclosure provides a curved surface coating device. The curved surface coating device includes a bracket having a first and second ends. The curved surface coating device includes a glue coating portion connected with the first end of the bracket. The curved surface coating device includes a transmission member connected between the first and second ends of the bracket and its distance from the first end of the bracket is adjustable. The curved surface coating device includes a first driving mechanism connected with the transmission member for driving the bracket to rotate about the transmission member as a center of rotation. The curved surface coating device includes a second driving mechanism connected with the bracket for driving the bracket to move on a line where the first end and the second end are located.

A liquid photocurable adhesive coating device, a method for coating a liquid photocurable adhesive with a liquid photocurable adhesive coating device, and a method for coating a liquid photocurable adhesive are provided. The liquid photocurable adhesive coating device, including: a coating head, configured to coat a liquid photocurable adhesive; a precuring light source, fixed on the coating head and configured to precure the liquid photocurable adhesive coated by the coating head while the coating head is coating the liquid photocurable adhesive.

The present disclosure provides a method and system by which a precise amount of a viscous fluid sealing compound can be dispensed at required locations through computer vision-based observation of the fluid deposited, its rate and amount of deposition and location; and that the dispensed fluid may be accurately shaped through robotic or other special purpose mechanism motion. The invention enables instant quality inspection of the dispensing process in terms of the locations, amounts and shapes of newly created seals.

In an example, a method of sealing a bond cavity is described. The method comprises placing an adhesive around a perimeter of a first structure to be joined to a second structure. The method also comprises positioning the first structure relative to the second structure such that the adhesive is disposed between the first structure and the second structure. The method also comprises merging the first structure and the second structure until the first structure and the second structure are separated by a desired gap for bonding. The method also comprises heating the perimeter to at least partially cure the adhesive to form a leak-proof bond cavity perimeter between the first structure and the second structure.

The application relates to a device for applying a bead of material. The device comprises a flexible nozzle body which defines a flow-through volume through which a material can flow for the bead of material, which is at least partially delimited by a walling formed by the nozzle body, having a feed opening for feeding the material into the flow-through volume. The nozzle body defines a mouth region through which the material can exit from the volume. Furthermore, the device comprises an actuator system, which is arranged on the nozzle body and is set up to change a cross section of the mouth region while deforming the nozzle body. The walling forms a barrier between the flow-through volume and the actuator system. The application further relates to a method for using the device.

A sealant discharging nozzle includes a nozzle body, a flat surface, a nozzle positioning portion, and a locating pin. The flat surface is provided on the nozzle body and is formed on a discharge port side of a through hole that extends along a central axis of the nozzle body. The nozzle positioning portion includes a pair of tapered surfaces disposed on both sides of the flat surface in a width direction of the flat surface. The locating pin is formed between the pair of tapered surfaces.

An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.

A sealant dispenser comprising a chassis adapted to carry a supply of sealant dispensable through a nozzle; at least one drive wheel to directionally propel said chassis; and a detection system carried by said chassis to determine a location to dispense sealant through said nozzle and controlling direction of said at least one drive wheel to position said nozzle.

A liquid agent application apparatus includes an application nozzle that is movable up and down and in a horizontal plane direction with respect to a board, an application valve that switch between a first state in which supply of a liquid agent to the application nozzle is performed and a second state in which the supply of the liquid agent to the application nozzle is stopped, and a control device that controls these. The control device performs control such that the application nozzle is lowered, the application valve is switched to the second state by standing by a predetermined time after switching the application valve to the first state at a predetermined supply start timing, and the application nozzle is raised after a timing at which a tip end of the application nozzle reaches a lowering end and the application valve is switched to the second state.