An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

A universal ultrasound device having an ultrasound probe includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.

An example of a method for a multi-frequency transducer array can include forming a first comb structure with a first sub-element having a first resonance frequency, forming a second comb structure, complementary in geometry to the first comb structure with a second sub-element having a second resonance frequency, combining the first and second comb structures to form an interdigitated structure, forming a third acoustic stack by coupling the interdigitated structure to a base package, and coupling the third acoustic stack to a matching layer block and a backing layer block to form a plurality of multi-frequency transducers.

A high frequency ultrasound array having a number of transducer elements that are formed in sheet of piezoelectric material. A frame having a coefficient of thermal expansion that is similar to that of the piezoelectric material surrounds the piezoelectric material and is separated from the piezoelectric material by a filling material. Kerf cuts that define the individual elements in the sheet of piezoelectric material extend across a full width of the sheet. In some embodiments, sub-dice kerf cuts that divide a single transducer element into two or more sub-elements also extend all the way across the width of the sheet. A lens positioned in front of the transducer elements can have a radius machined therein to focus ultrasound signals.

A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

The present disclosure relates to an ultrasound transducer and a control method thereof. More particularly, the present disclosure is related to an ultrasound transducer for facilitating waste clearance of the brain lymphatic system and a control method thereof. A transducer according to the present disclosure includes: an oscillator including a plurality of Piezoelectric materials, and a polymer encompassing the plurality of Piezoelectric materials, and irradiating an ultrasound using at least one of the plurality of Piezoelectric materials and the polymer; a lens having a first space where at least a part of the oscillator is inserted, and focuses the applied ultrasound; and a housing supporting connection between the oscillator and the lens, wherein a height of the oscillator is longer than a height of the first space, a first height difference between the height of the oscillator and the height of the first space is inverse proportion to overall height of the lens, and a width of the oscillator is smaller than a width of the first space.

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.

A system and method from improving the image quality achievable with an ultrasound transducer by using a composite aperture for receiving ultrasound echoes. By using two receive cycles per vector, twice as many transducers may be used for receiving ultrasound imaging data than there are physical channels available in the ultrasound probe. An ultrasound probe utilizing a composite aperture can achieve high image quality from a system have reduced power, size, cost and complexity.

An ultrasound probe of the present disclosure includes an ultrasound element unit 1, to which a flexible substrate 7 is connected, the flexible substrate 7 including lamination of a ground layer 7e and a signal layer 7a via an insulation layer 7c. The flexible substrate 7 includes a bending part and a flat part. The signal layer 7a includes a linear first signal line and a linear second signal line that are adjacent to each other. The ground layer 7e at the bending part includes a linear first ground line and a linear second ground line that are adjacent to each other. The first signal line and the first ground line are opposed to each other, and the second signal line and the second ground line are opposed to each other.