Patent classifications
B06B1/0651
PICK AND PLACEMENT OF SEMICONDUCTOR CHIPS BASED ON NOZZLELESS SELF-FOCUSING ACOUSTIC DROPLET EJECTOR
A device for picking and placing semiconductor chips includes a liquid having a first surface and a second surface and a layer of semiconductor chips disposed over the first surface. Characteristically, the first surface is a liquid-air interface. The device also includes a focused ultrasonic transducer positioned to focus acoustic wave on the layer of semiconductor chips such that a droplet including at least one semiconductor chip is ejected through the liquid-air per each actuation of the focused ultrasonic transducer through droplet ejection. The focused ultrasonic transducer includes a piezoelectric substrate having a top face and a bottom face, a Fresnel acoustic lens including a plurality of annular rings of air cavities disposed on the top face, and a first patterned circular electrode disposed over the top face and a second patterned circular electrode disposed over the bottom face. The first patterned circular electrode overlaps the second patterned circular electrode.
INDUCTIVE COUPLING BASED VIBRATION HEADS FOR AN AEROSOL GENERATOR
The present invention relates to a vibration head (210) for an aerosol generator (200), the vibration head (210) comprising: a membrane (8); a vibration generating element (4); and a secondary coil (220) configured for providing an inductive coupling with a primary coil (320) being connected with a controller (100) of the aerosol generator (200), the inductive coupling driving the vibration generating element (4) to vibrate the membrane (8) for generating the aerosol.
ULTRASONIC ATOMIZATION PIECE AND MANUFACTURING PROCESS THEREOF
An ultrasonic atomization piece and manufacturing process thereof relate to the technical field of ultrasonic atomization. The piece comprises a piezoelectric ceramic sheet and at least one composite plate. The composite plate is fixed on one side of the piezoelectric ceramic sheet and includes a substrate and a conductive layer, the conductive layer is in contact with the piezoelectric ceramic sheet, the substrate is provided with atomizing apertures, and the substrate is a polymer film. Compared with the traditional stainless steel thin sheet, the polymer film is used as the substrate material; the force for the piezoelectric ceramic sheet to generate deformation requires being lower, so the piezoelectric ceramic sheet can pull the polymer film to generate deformation with less energy. The difficulty of drilling apertures is reduced, and metal residues splashing will not occur, thereby eliminating the adverse effect of metal residues on the passage efficiency of liquid.
MANUFACTURING PROCESS FOR ULTRASONIC ATOMIZATION PIECE
A manufacturing process for ultrasonic atomization piece relates to the atomization piece technical field and includes: S1. cutting a press-thermosetting conductive adhesive film into a shape matched with a piezoelectric ceramic sheet; S2. placing the press-thermosetting conductive adhesive film on a composite plate, wherein the composite plate includes a substrate and a conductive layer, the press-thermosetting conductive adhesive film is placed on the conductive layer, and the substrate is a polymer film; S3. placing the piezoelectric ceramic sheet on the press-thermosetting conductive adhesive film; S4. pressing the piezoelectric ceramic sheet and the composite plate in S3 together by a press machine. The press-thermosetting conductive adhesive film for connecting the piezoelectric ceramic sheet and the composite plate can be cured in a short time under high pressure and heating and has excellent adhesion, which is a thin film material with excellent plasticity and can be easily cut into various shapes.
Ultrasonic Transducer and Method of Fabricating an Ultrasonic Transducer
An ultrasonic transducer that includes a delay line, an active piezoelectric element, and interposing metal conductive layer between the delay line and active piezoelectric element. The delay line and active piezoelectric element are joined so that ultrasonic waves may be coupled from the active piezoelectric element into the delay line or from the delay line into the active piezoelectric element. A via is formed, using a milling operation, in the active piezoelectric element to expose the edge of the interposing metal conductive layer between the delay line and active piezoelectric element. A conductive layer makes electrical contact between the interposing metal conductive layer and the surface of the active piezoelectric element to allow an electrical connection to be made from the surface of the active piezoelectric element to the interposing metal conductive layer.
Method and System for Increasing the Gas-Dissolution Rate of a Bubble in a Liquid Media via Non-Invasive Resonant Acoustic Pressure
An acoustic technique designed to increase the gas-dissolution rate of a bubble in a liquid media is proposed. Increased gas-dissolution rate is achieved by increasing the bubble's surface-to-volume ratio via bubble fragmentation. This is achieved by attaching an electroacoustic transducer to the system or load in which bubbles travel and exciting the transducer at the frequency of resonance. The electric resonance of the transducer attached to the system corresponds in frequency to the mechanical resonance of the system or load which allows for achieving such state without the use of an internally placed hydrophone to certify the resonance state. The acoustic bubble fragmentation technique increased the dissolution rate 4 to 5 times of bubbles with initial diameters between 150 and 550 μm in distilled water and in medical grade saline solution.
Pulse train excitation for capacative micromachined ultrasonic transducer
Aspects of this disclosure relate to driving a capacitive micromachined ultrasonic transducer (CMUT) with a pulse train of unipolar pulses. The CMUT may be electrically excited with a pulse train of unipolar pulses such that the CMUT operates in a continuous wave mode. In some embodiments, the CMUT may have a contoured electrode.
Ultrasonic stepping motor device for generating ultra-fine single droplet
An ultrasonic stepping motor device for generating ultra-fine single droplet includes a valve housing, a valve core, and a spring. The valve core and the spring are installed inside the valve housing, and the valve core abuts against a liquid inlet of the valve housing under an elastic force of the spring. The valve housing is connected with a injector through a catheter, and the catheter is driven for linear operation by the inverse piezoelectric effect of piezoelectric ceramics through an ultrasonic linear motor. A right end of the catheter is equipped with a rubber piston, and the rubber piston is arranged in a cavity of the injector and matched with the injector. Since the piezoelectric vibrator driven catheter can produce nano feed length, and the volume of droplets overflowed each time can reach micron level, which can meet the requirements of producing micro droplets.
PIEZOELECTRIC FILM INTEGRATED DEVICE, MANUFACTURING METHOD THEREOF, AND ACOUSTIC OSCILLATION SENSOR
A piezoelectric film integrated device include a substrate; a first electrode provided on the substrate; a second electrode provided on the substrate; a first monocrystalline piezoelectric film provided on the first electrode; a second monocrystalline piezoelectric film provided on the second electrode and having a crystal structure different from a crystal structure of the first monocrystalline piezoelectric film; a third electrode provided on the first monocrystalline piezoelectric film; and a fourth electrode provided on the second monocrystalline piezoelectric film.
Vibration apparatus
A vibration apparatus includes a vibrating body that has a tubular shape and includes first and second opening end portions, an outside surface, and an inside surface, a light transmissive body connected to the second opening end portion of the vibrating body, and a piezoelectric vibrator provided in the vibrating body. The vibrating body includes a flange portion extending from the outside surface of the vibrating body toward an outside. The vibration apparatus further includes a driving circuit that vibrates a connection body of the light transmissive body and the vibrating body in a vibration mode of light transmissive body vibration or a vibration mode of flange portion vibration and that alternately switches between the vibration mode of the light transmissive body vibration and the vibration mode of the flange portion vibration.