The invention relates to a method for washing/cleaning granular material from slag and for washing/cleaning bottom/boiler ash from a thermal waste treatment. In the method, the granular material is added to a process liquid and is subjected to ultrasound therein. According to the invention, it is proposed that the process liquid is located in an upright cleaning channel with an upper feeding end and a lower extraction end, that the granular material is introduced into the cleaning channel from the feeding end, and moves downwards towards the extraction end due to the force of gravity, and is subjected to ultrasound during the sinking movement.

A device for cleaning items comprises an enclosure defining a wash chamber, a rotor positioned within the wash chamber and selectively rotatable about an axle, a motor for selectively rotating the axle, a dispenser, and a drain. The rotor comprises a plurality of holders spaced about the axle and adapted to selectively receive and hold a respective item to be cleaned. The dispenser at least one liquid input and at least one liquid output and is positioned such that the at least one liquid output directs cleaning fluid at one of the items to clean material out of the cavities. The drain is for draining the cleaning fluid out of the chamber. The rotor is selectively rotatable at a predefined rotational speed for a predefined amount of time to expel cleaning fluid from the cavities of each item to be cleaned.

A wafer cleaning apparatus includes a wafer roller rotating a wafer around a first direction parallel to a normal direction of a first surface of the wafer, a first brush facing the first surface of the wafer, a second brush facing a second surface of the wafer opposite to the first surface, a first cleaning tank disposed apart from the first brush and movable to accommodate at least a portion of the first brush, and a second cleaning tank disposed apart from the second brush and movable to accommodate at least a portion of the second brush. The first and second cleaning tanks include a first solution injection member connected to a first solution supply pipe and a second solution injection member connected to a second solution supply pipe, respectively. Each of the first and second solution injection members includes a bubble generating filter having a plurality of through-holes.

A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5/N for each rotation of the chuck, where is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5n during the cleaning process, where is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.

A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit, which may be arranged in the listed order. Each of the units may be configured to utilize hot liquid or water to clean the part being processed. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency. The first and second frequencies may be different from each other, such that vibration at the second frequency causes additional debris or particles to be removed from the surface of the part that were not, or could not be, removed from exposure to vibration at the first frequency. The apparatus and method may further include a drying and/or inspection unit for the part after being processed in the cleaning apparatus.

A process and device for removing a solid ink mask printed onto a substrate is disclosed. The substrate is bent around a bar set perpendicular to the substrate, causing the mask to flake off the substrate. The process permits fast removal of solid ink masks.

An apparatus for removing a film coated on a substrate includes a film removing body including a liquid supply device which discharges removing liquid through a discharge opening to a removal portion of a film coated on a substrate, and a collection device which collects a discharged removing liquid through a collection opening, and an adjustment device that adjusts a distance between a surface of the substrate to a bottom surface of the film removing body at a position between the discharge opening and the collection opening.

A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5/N for each rotation of the chuck, where is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5n during the cleaning process, where is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.

There is provided a system for cleaning a material. The system may include a tank, a plurality of ultrasonic transducer disposed within the tank. The material may be placed within the tank, which may be at least partially filled with a liquid. A computing device may be configured to activate the ultrasonic transducers so as to create constructive interference which generates ultrasonic shockwaves within a target zone within the tank to dislodge contaminants from a material located in the target zone.

A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit, which may be arranged in the listed order. Each of the units may be configured to utilize hot liquid or water to clean the part being processed. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency. The first and second frequencies may be different from each other, such that vibration at the second frequency causes additional debris or particles to be removed from the surface of the part that were not, or could not be, removed from exposure to vibration at the first frequency. The apparatus and method may further include a drying and/or inspection unit for the part after being processed in the cleaning apparatus.