Patent classifications
B08B3/123
DIE-PRESSING PRODUCTION DEVICE AND METHOD FOR FLAVORED DRIED BEAN CURD
The present disclosure relates to a die-pressing production device and method for flavored dried bean curd. The die-pressing production device includes a die-pressing apparatus and an intermittent fabric operation apparatus located on a side of the die-pressing apparatus; the die-pressing apparatus includes a frame body on which two parallel wrapping mechanisms for wrapping a to-be-pressed material are disposed, and a cover plate for downwards pressing the wrapping mechanisms and a jacking plate for upwards jacking the wrapping mechanisms are respectively disposed on the top and bottom of the frame body; and the intermittent fabric operation apparatus includes a rack and a roller set disposed on the rack, and the roller set is wound with a rotary fabric belt passing through a space between the two wrapping mechanisms.
Cleaning and Sanitizing in the Meat Packing Industry
A cleaning system for a meat-packing plant includes a tank with a potassium-based cleaner disposed in the tank. A track has a gambrel disposed on the track. The track includes a dip over the tank to dip the gambrel into the potassium-based cleaner as the gambrel moves along the track. A processed animal carcass is removed from the gambrel prior to the gambrel being dipped into the potassium-based cleaner. A fresh animal carcass is disposed on the gambrel after the gambrel is dipped into the potassium-based cleaner.
Systems including and methods of use of ultrasonic devices
A method of using an ultrasonic system includes positioning at least one component to a ultrasonic system, the ultrasonic system including: an ultrasonic device, comprising a plurality of ultrasonic transducers coupled to a flexible body; a power supply coupled to the ultrasonic device; a fluid vessel configured to supply fluid to the at least one component; and a waste vessel configured to collect the fluid supplied to the ultrasonic device from the fluid vessel. The method includes applying, via the power supply, a current to a plurality of ultrasonic transducers to dislodge a plurality of contaminants from the at least one component. The method includes flushing, via fluid from the fluid vessel, the plurality of contaminants dislodged from the at least one component.
Ultrasonic cleaning apparatus and ultrasonic cleaning system
An ultrasonic cleaning apparatus capable of cleaning large-sized objects includes: a casing having a bottom surface that forms a tilted surface to oppose the object to be cleaned and having an ultrasonic transducer provided at an inner lower surface; a cleaning liquid supply device configured to supply cleaning liquid to a casing bottom surface; and a flow-speed accelerator that ejects the cleaning liquid by accelerating the flow speed of the cleaning liquid from the cleaning liquid supply device. The casing is formed by a main body including an upper plate, a projected part attached to a lower part of the upper plate, an outer lateral face extended from the projected part in a downward direction, and the bottom surface connected integrally at a lower end part of the outer lateral face. The bottom surface is formed to be tilted at a prescribed angle with respect to a horizontal plane.
Method for cleaning substrate and cleaning device
According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
Cleaning apparatus and system
The present application discloses a cleaning apparatus and system, including: a transmission assembly; a drive assembly, connected to the transmission assembly and located lower than the transmission assembly; a cleaning assembly, located higher than the transmission assembly; and a waterproof structure, located between the drive assembly and the cleaning assembly.
Methods and apparatus for cleaning substrates
A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate (20010) being cleaned.
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate (20010) being cleaned.
SUBSTRATE CLEANING DEVICE AND METHOD OF CLEANING SUBSTRATE
A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.
METHOD FOR DECONTAMINATING LOW-TEMPERATURE ARTICLE AND A PASS BOX USED IN SAME
A method for decontaminating a low-temperature article to accomplish decontaminating a surface of the such article, and to reduce duration of operations to increase efficiency of decontamination, and a pass box used in such method.
The method includes an applying step of applying a decontamination agent to external surfaces of the article, and a drying step of irradiating the article with agent thereon with ultrasonic waves and drying the surface. In the applying step, a gas, fog or mist of the decontamination agent is supplied to a target surface to form a condensed film of the agent on the target surface. In the drying step, dry air is supplied to the target surface.