Provided is an endless metal ring manufacturing method for manufacturing an endless metal ring by carrying out a barrel polishing step for polishing the endless metal ring by using a barrel of a resin material, a rolling step for rolling the endless metal ring which was cleaned, and a nitriding step for nitriding the endless metal ring which was rolled, wherein after the barrel polishing step and before the rolling step, provided is a resin removing step for removing resin that has adhered to the endless metal ring.

According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.

A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency. The first and second frequencies may be different from each other, such that vibration at the second frequency causes additional debris or particles to be removed from the surface of the part.

An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.

A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

An installation is provided for cleaning a plate used in an additive manufacturing process performed using a powder. The installation includes an entry lock, an exit lock, a dry cleaner, a wet cleaner, and a conveyor system. The entry lock is structured to accept into the installation a plate that is to be cleaned. The exit lock is structured to allow the plate to be extracted from the installation after cleaning. The dry cleaner is structured to clean the plate using vibrations and shocks in a first confinement enclosure. The wet cleaner is structured to clean the plate using at least one liquid in a second confinement enclosure. The conveyor system is structured to transport the plate between the dry cleaner, the wet cleaner, and the exit lock.

Ultrasonic wash boxes, processing lines, and related methods are provided herein. A wash box can include a housing having a first side wall, a second side wall, a first end wall and a second end wall. The housing can have an opening formed between the side wall and the end walls. The wash box can include a first ultrasonic field generator secured to a first side wall of the housing and a second ultrasonic field generator secured to the second side wall of the housing. The wash box can also include a fabric guide carriage insertable within the opening of the housing between the first and second side walls.

A vibration cleaning device, method and system are provided. The vibration cleaning device includes a cleaning module configured to clean an object through a cleaning solution; a cleaning solution delivering module configured to deliver the cleaning solution to the object when the cleaning module performs a cleaning process on the object; a vibrating module configured to vibrate, move and drive the cleaning module to vibrate the object at a predetermined vibration frequency, so that the cleaning module performs vibration cleaning on the object through the cleaning solution; a cleaning tank configured to accommodate the object and the cleaning solution after cleaning the object; a transfer module configured to transfer the uncleaned object to the cleaning tank and transfer the cleaned object out of the cleaning tank; and a control module configured to control working states of the cleaning solution delivering module, the vibrating module and the transfer module.

The present disclosure provides a wafer cleaning apparatus and a cleaning method. The wafer cleaning apparatus includes a tank and a wafer holder. The tank includes a bottom wall, a lateral wall, and a partition wall. The lateral wall is connected to the bottom wall. The partition wall is movably mounted on the lateral wall and divides a cleaning space defined by the bottom wall and the lateral wall into a first compartment and a second compartment. A passage communicating with the first compartment and the second compartment is formed when the partition wall is moved away from the bottom wall and immersed in a cleaning fluid received in the cleaning space. The wafer holder is adapted to be immersed in the cleaning fluid and to move between the first compartment and the second compartment. The present disclosure further provides a method is of cleaning the wafer.

A cleaning device is provided with a three-dimensional circulation route for circulating workpiece holding tools that hold a workpiece, and this three-dimensional circulation route is formed by an endless conveyor chain bendable in various directions being disposed within a rectangular parallelepiped space following along the upper and lower sides thereof. The conveyor chain circulates from an upper side horizontal transport path portion via a falling side transport path portion, a lower side horizontal transport path portion, and a rising side transport path portion, and the workpiece held in the workpiece holding tools is treated by ultrasonic cleaning, shower cleaning, steam cleaning, drying and the like. Thus, it is possible to suitably dispose a workpiece transport route in a limited rectangular parallelepiped space, and carry out cleaning operations for the workpiece efficiently.