A cleaning apparatus includes a spinner table for holding a workpiece thereon, a cleaning nozzle for supplying cleaning water to the workpiece held on the spinner table, an ultrasonic vibrator for applying ultrasonic vibrations to the cleaning water supplied from the cleaning nozzle to the workpiece, a water layer forming unit for forming a layer of the cleaning water in a clearance between the cleaning nozzle and the workpiece, the water layer forming unit having a cover surrounding the cleaning nozzle, and a drain unit for draining the cleaning water out of the cleaning apparatus, the drain unit having a flow channel for allowing the cleaning water supplied from the cleaning nozzle to the workpiece to flow therethrough.

An apparatus for cleaning a semiconductor wafer comprises a chuck (106), an ultra or mega sonic device, an actuator (113), at least one dispenser (108, 209) and a rotating driving mechanism (111). The chuck (106) holds the semiconductor wafer (105). The actuator (113) drives the ultra or mage sonic device to a position above the surface of the semiconductor wafer (105) and a gap is formed between the ultra or mega sonic device and the surface of the semiconductor wafer (105). The at least one dispenser (108, 209) sprays cleaning liquid on the surface of the semiconductor wafer (105). The rotating driving mechanism drives the chuck (106) to rotate at a spin speed lower than a set spin speed for ensuring that the gap between the ultra or mega sonic device and the surface of the semiconductor wafer (105) is fully and continuously filled with the cleaning liquid (104), making the ultra or mega sonic energy be stably transferred to the entire surface of the semiconductor wafer (105) through the cleaning liquid (104). A method for cleaning a semiconductor wafer is also disclosed.

Embodiments herein relate to part separation and cleaning devices. In an embodiment, a part separation and cleaning apparatus is included having a liquid holding tub defining an interior volume. The liquid holding tub can include a bottom pan defining a center aperture and an outer perimeter, a perimeter wall attached to the bottom pan adjacent to the outer perimeter thereof and a center sleeve attached to the bottom pan over the central aperture and extending upward away from the bottom pan. The apparatus can further include a motor and a drive shaft. An indexing plate within the liquid holding tub can be connected to the drive shaft. The indexing plate can rotate and can include a plurality of discrete compartments. A control circuit can be configured to cause the drive unit to initiate an indexing movement in response to a received signal. Other embodiments are also included herein.

In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.

A flowback tank cleaning system and method is described. A flowback tank includes a self-cleaning system. A flowback tank cleaning method may include moving solid debris collected at a bottom of a collection section of a flowback tank towards a lift auger using a cleaning auger or a conveyer belt extending along a length of the collection section, the bottom of the collection section including an angled trough, funneling solid debris towards the cleaning auger or conveyor belt by placing the cleaning auger or conveyor belt at a base of the angled trough, spraying fluid downward through a series of fluid outlets, removing the sand so moved by the cleaning auger or conveyer belt from the flowback tank using the lift auger, and removing the fluid from the flowback tank using a drain manifold below the cleaning auger or conveyer belt.

An apparatus for disinfecting products is disclosed herein. The apparatus comprises a tank for holding a liquid for receiving microorganisms from the products. The tank comprises a barrier separating the tank to provide two regions of liquid, the two regions of liquid comprising a first region and a second region, wherein the first region is arranged to provide an open channel for the liquid through the tank to enable a product to be carried into, along, and out of a flowpath through the channel; and the second region holds liquid adjacent to at least one ultrasonic transducer for providing ultrasonic energy to the product via the liquid in the second region and through the barrier.

A painting plant may include: a painting booth; at least one overspray removal unit; a cleaning unit; and a conveyor. The painting plant may be further configured so that an air stream, when exiting the painting booth, passes through the at least one overspray removal unit. The at least one overspray removal unit may include a purification chamber configured to contain cleaning elements. The purification chamber may include an inlet for the air stream with the overspray, an outlet for the air stream after the air stream has passed through at least part of the cleaning elements, and a discharge outlet. The discharge outlet may be configured to discharge at least a portion of the cleaning elements from the purification chamber to the cleaning unit. The conveyor may be configured to transport at least a portion of the cleaning elements from the cleaning unit back to the purification chamber.

An example method to clean a continuous substrate involves applying a high pressure, low flow spray of a first cleaning fluid at the continuous substrate from one or more nozzles to remove particulate matter from the continuous substrate; an agitator, comprising at least one of a megasonic transducer or an ultrasonic transducer, and configured to direct energy at the continuous substrate; and drying the continuous substrate.

Provided is an endless metal ring manufacturing method for manufacturing an endless metal ring by carrying out a barrel polishing step for polishing the endless metal ring by using a barrel of a resin material, a rolling step for rolling the endless metal ring which was cleaned, and a nitriding step for nitriding the endless metal ring which was rolled, wherein after the barrel polishing step and before the rolling step, provided is a resin removing step for removing resin that has adhered to the endless metal ring.

Provided is an endless metal ring manufacturing method for manufacturing an endless metal ring by carrying out a barrel polishing step for polishing the endless metal ring by using a barrel of a resin material, a rolling step for rolling the endless metal ring which was cleaned, and a nitriding step for nitriding the endless metal ring which was rolled, wherein after the barrel polishing step and before the rolling step, provided is a resin removing step for removing resin that has adhered to the endless metal ring.