Patent classifications
B22F2007/047
SINTER BONDING SHEET
Provided is a sinter bonding sheet including a sinter bonding layer that includes: sinterable particles containing a conductive metal; and an organic binder, in which a maximum size among sizes of cavities observed in an observation image of a surface of the sinter bonding layer at a magnification of 100 times is 100 m or less.
Method for producing silver nanoparticles, silver nanoparticles, and silver coating composition
The present invention provides silver nano-particles with excellent stability and conductivity by low-temperature calcining, a producing method for same, and a silver coating composition. A method for producing silver nano-particles comprising: preparing an amine mixture liquid comprising: an aliphatic hydrocarbon monoamine (A) with an aliphatic hydrocarbon group and one amino group, the aliphatic hydrocarbon group having 6 or more carbon atoms in total; an aliphatic hydrocarbon monoamine (B) with an aliphatic hydrocarbon group and one amino group, the aliphatic hydrocarbon group having 5 or less carbon atoms in total; and an aliphatic hydrocarbon diamine (C) with an aliphatic hydrocarbon group and two amino groups, the aliphatic hydrocarbon group having 8 or less carbon atoms in total; mixing a silver compound and the amine mixture liquid to form a complex compound; and thermally decomposing the complex compound by heating to form silver nano-particles.
Workpiece comprising a laminate to protect against an impact stress
A method for applying a protective layer to protect against an impact stress includes mixing a sealing alloy in a powder form with a binder and water to form a pasty compound, applying the pasty compound on a surface to be protected, drying the applied pasty compound, and heating the dried applied pasty compound to a temperature of at least 800 C.
Metal particle dispersion, article and sintered film using metal particle dispersion, and method for producing sintered film
The present invention is to provide a metal particle dispersion which has low viscosity and excellent dispersibility and dispersion stability, and in which the precipitation of the metal particles is inhibited. Disclosed is a metal particle dispersion comprising metal particles, a dispersant and a solvent, wherein the metal particles contain one or more selected from the group consisting of gold, silver, copper, nickel, platinum, palladium, molybdenum, aluminum, antimony, tin, chromium, lanthanum, indium, gallium and germanium, and wherein the dispersant is a graft copolymer having at least one constitutional unit represented by the following general formula (I) and at least one constitutional unit represented by the following general formula (II), and in which at least part of nitrogen sites of the constitutional units represented by the general formula (I) each form a salt with at least one selected from the group consisting of a halogenated hydrocarbon, an acidic phosphorus compound represented by the following general formula (V), and a sulfonic acid compound represented by the following general formula (VI): ##STR00001##
(symbols shown in the general formulae (I), (II), (V) and (VI) are as described in the Description.)
SLIDING MEMBER AND MANUFACTURING METHOD THEREFOR
First, in a primary sintering step, a manufacturing system 1 for a sliding member 2 laminates and thereby forms a sintered alloy layer 4 on back metal 3. Subsequently, a large number of indents 5 are formed on a front surface of the sintered alloy layer 4 by an indent-forming mechanism 14. Next, the back metal 3 and sintered alloy layer 4 are rolled by a reduction roll 15 and a secondary sintering process is applied to the sintered alloy layer 4. Consequently, the sliding member 2 is manufactured with the large number of indents 5 provided on a front surface. Since the indents 5 are formed on the sintered alloy layer 4 after the primary sintering step, it is possible to inhibit work hardening from occurring in the indents 5 and surrounding areas.
HYBRID ARTICLE, METHOD FOR FORMING HYBRID ARTICLE AND METHOD FOR CLOSING APERTURE
A hybrid article is disclosed including a coating disposed on and circumscribing the lateral surface of a core having a core material. The coating includes about 35% to about 95% of a first metallic material having a first melting point, and about 5% to about 65% of a second metallic material having a second melting point lower than the first melting point. A method for forming the hybrid article is disclosed including disposing the core in a die, forming a gap between the lateral surface and the die, introducing a slurry having the metallic materials into the gap, and sintering the slurry, forming the coating. A method for closing an aperture of an article is disclosed including inserting the hybrid article into the aperture. Closing the aperture includes brazing the hybrid article to the article, welding the aperture with the hybrid article serving as weld filler, or a combination thereof.
Method for treating Cu thin sheet
A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D.sub.50 of both DBA and RM employed fall within 0.1 to 100 m, the median diameter D.sub.50 of DBA is larger than the median diameter D.sub.50 of RM, and both the distribution ratio D.sub.90/D.sub.10 of DBA and the distribution ratio D.sub.90/D.sub.10 of RM are 4.0 or less.
Sintering Materials and Attachment Methods Using Same
Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
DOWNHOLE TOOLS WITH LOW DILUTION ZONE BEARING CLADDING AND CLADDING PROCESSES
The present disclosure relates to downhole tools containing bearings with cladding on their surfaces. The cladding contains a low dilution zone. In specific embodiments, the downhole tools may be roller cone drill bits, also sometimes referred to as rotary cone drill bits. The present disclosure further relates to processes for applying cladding to bearings.
BONDING MATERIAL AND BONDING METHOD USING SAME
A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300 C., a viscosity of 2,000 to 10,000 mPa.Math.s at 20 C. and at least one methyl group, such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.