A hybrid article is disclosed including a coating circumscribing the lateral surface of a hollow core having a core material and a channel disposed within the lateral surface. The coating includes about 35% to about 95% of a first metallic material, and about 5% to about 65% of a second metallic material with a lower melting point than the first metallic material. A method for forming the hybrid article is disclosed including disposing the hollow core in a die, forming a gap between the lateral surface and the die, introducing a slurry having the metallic materials into the gap, and sintering the slurry, forming the coating. A method for closing an aperture of an article is disclosed including inserting the hybrid article into the aperture, and brazing the hybrid article to the article, welding the aperture with the hybrid article serving as weld filler, or a combination thereof.

Particles for joining material are such that an organic protective film is formed on the surface of copper nanoparticles, and have a BET specific surface area in a range of 3.5 m.sup.2/g to 8 m.sup.2/g, and a BET diameter in a range of 80 nm to 200 nm, wherein the organic protective film is included in a range of 0.5% to 2.0% by mass with respect to the particles for joining material. When the particles for joining material are analyzed by using the Time-Of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) method, respective detected amounts of C.sub.3H.sub.3O.sub.3.sup.− ions and C.sub.3H.sub.4O.sub.2.sup.− ions are in a range of 0.05 times to 0.2 times a detected amount of Cu.sup.+ ions, and a detected amount of ions of C.sub.5 or more is in a range less than 0.005 times the detected amount of Cu.sup.+ ions.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

A metal paste for low temperature bonding at temperatures 600° C. or lower, the metal paste comprising: a metal particle with an average particle size of 1 to 100 μm; a metal nanoparticle with an average particle size of 1 to 500 nm; a stress relieving material; and a dispersion medium to disperse the metal particle, metal nanoparticle, and the stress relieving material.

An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.

An object of the present disclosure is to provide a method for manufacturing a conductive laminate having an excellent steady contact between a conductive layer and an overcoat layer. The present disclosure provides a method for manufacturing a conductive laminate 10 including a substrate 11, a conductive layer 12, and an overcoat layer 13 being laminated, the method including the following Steps: Step A: forming the conductive layer 12 on the substrate 11 using a conductive ink containing a metal nanoparticle and a first ink resin; and Step B: forming the overcoat layer 13 on the conductive layer 12 using an overcoat layer-forming composition, the overcoat layer-forming composition containing an overcoat layer resin and an overcoat layer solvent, the overcoat layer solvent having an SP value, where a difference between the SP value and an SP value of the first ink resin is 1.0 or less in absolute value.

Grain-oriented electrical steel sheet excellent in magnetic properties and excellent in adhesion of the primary coating to the steel sheet is provided. The grain-oriented electrical steel sheet according to the present invention is provided with a base metal steel sheet containing a chemical composition containing, by mass %, C: 0.005% or less, Si: 0.5 to 7.0%, Mn: 0.05 to 1.00%, a total of S and Se: 0.005% or less, sol. Al: 0.005% or less, and N: 0.005% or less and having a balance comprised of Fe and impurities and with a primary coating formed on a surface of the base metal steel sheet and containing Mg.sub.2SiO.sub.4as a main constituent, wherein a peak position of Al emission intensity obtained when performing elemental analysis by glow discharge optical emission spectrometry from a surface of the primary coating in a thickness direction of the grain-oriented electrical steel sheet is arranged within a range of 2.0 to 12.0 μm from the surface of the primary coating in the thickness direction, and a number density of Al oxides of a size of 0.1 μm or more in terms of a circle equivalent diameter based on the area at the peak position of Al emission intensity is 0.03 to 0.2/μm.sup.2.

The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles. Specifically, the disclosure relates to methods and systems for sintering ink compositions with metal nanoparticles using an illumination source comprising an array of pulsed light emitting diodes (LEDs).

This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.

This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.