Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.

The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles. Specifically, the disclosure relates to methods and systems for sintering ink compositions with metal nanoparticles using an illumination source comprising an array of pulsed light emitting diodes (LEDs)

A method for producing a catalyst or catalyst precursor is described including: applying a slurry of a particulate catalyst compound in a carrier fluid to an additive layer manufactured support structure to form a slurry-impregnated support, and drying and optionally calcining the slurry-impregnated support to form a catalyst or catalyst precursor. The mean particle size (D50) of the particulate catalyst compound in the slurry is in the range 1-50 m and the support structure has a porosity 0.02 ml/g.

A method for producing a catalyst or catalyst precursor is described including: applying a slurry of a particulate catalyst compound in a carrier fluid to an additive layer manufactured support structure to form a slurry-impregnated support, and drying and optionally calcining the slurry-impregnated support to form a catalyst or catalyst precursor. The mean particle size (D50) of the particulate catalyst compound in the slurry is in the range 1-50 m and the support structure has a porosity 0.02 ml/g.

A method includes providing a joining material between a surface of a component and a surface of an electronic component. A plurality of spacer elements is embedded in the joining material. The spacer elements are coated with a coating material. The coating material includes sinter particles. A dimension of the sinter particles is greater than 1 nanometer and smaller than 1000 nanometers. The method further includes forming interconnects from the coating material. The interconnects are arranged between the spacer elements and the surface of the component, and between the spacer elements and the surface of the electronic component.

Disclosed is a method of manufacturing a three-dimensional multi-layer electronic device, the method including: a unit forming process of forming a multi-layer unit including an electronic component and a circuit wiring by three-dimensional lay-out forming; and a unit lay-out process of manufacturing a three-dimensional multi-layer electronic device by laying out and integrating the multi-layer unit in a vertical direction.

A power module substrate with a heat sink (10) includes a power module substrate (20) provided with an insulating substrate (21), a circuit layer (22) provided on one surface of the insulating substrate (21) and a metal layer (23) provided on the other surface of the insulating substrate (21); and a heat sink (40) bonded via a bonding layer (30) to a surface on an opposite side to the insulating substrate (21) of the metal layer (23) of the power module substrate (20), in which the bonding layer (30) is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and has a thickness in a range of 10 m or more and 500 m or less.

A heat transfer surface with a convective cooling layer includes a metal substrate and a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate. The porous metal foam layer includes a plurality of high melting temperature (HMT) particles and a plurality of micro-channels. A first TLP intermetallic layer is positioned between, and TLP bonds together, adjacent HMT particles to form the porous metal foam layer. A second TLP intermetallic layer is positioned between and TLP bonds a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate. The plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid may be wicked through the plurality of micro-channels to the surface of the metal substrate.

A heat transfer surface with a convective cooling layer includes a metal substrate and a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate. The porous metal foam layer includes a plurality of high melting temperature (HMT) particles and a plurality of micro-channels. A first TLP intermetallic layer is positioned between, and TLP bonds together, adjacent HMT particles to form the porous metal foam layer. A second TLP intermetallic layer is positioned between and TLP bonds a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate. The plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid may be wicked through the plurality of micro-channels to the surface of the metal substrate.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).