The wafer chuck apparatus has a chuck body that includes an interior and a top surface. A plurality of micro-channel regions is formed in the top surface. Each micro-channel region is defined by an array of micro-channel sections that are in pneumatic communication with each other. The micro-channel regions are pneumatically isolated from each other. One or more vacuum manifold regions are defined in the interior of the chuck body and are in pneumatic communication with corresponding micro-channel regions through respective vacuum holes. The configuration of the micro-channel regions makes the wafer chuck apparatus particularly useful in chucking wafers that have a substantial amount of warp.

Disclosed is an apparatus for supporting a substrate. The substrate support unit includes a support plate having a plurality of absorption holes, in which a vacuum pressure is formed, on an upper surface thereof to absorb the substrate, and a vacuum absorption unit configured to apply the vacuum pressure to the absorption holes, and the vacuum absorption unit includes a pressure measuring member configured to measure internal pressures of the absorption holes, an intake unit configured to intake and discharge gas in the absorption holes and adjust a suction force for suctioning the gas in the absorption holes, and a controller configured to control the intake unit to adjust the suction force according to the internal pressures measured by the pressure measuring member.

A substrate supporting apparatus includes a rotatable chuck, a first mass flow controller, a second mass flow controller, a plurality of locating pins and guiding pillars, and a motor in which the rotatable chuck defines a plurality of first injecting ports and second injecting ports, the first injecting ports are connected with a first gas passage for supplying gas to the substrate and sucking the substrate by Bernoulli effect, the second injecting ports are connected with a second gas passage for supplying gas to the substrate and lifting the substrate, the first and the second mass flow controllers are respectively installed on the first and the second gas passages, the plurality of locating pins and guiding pillars are disposed at the top surface of the rotatable chuck and every guiding pillar protrudes to form a holding portion, and the motor is used for rotating the rotatable chuck.

A collet (230) for holding a contact lens mold half (240) during machining of a surface of the mold half (240) having a disc (235) having a face and defining: a central structure (250a), at the center of the face, for receiving a head portion (240a) of the mold half (240), and an elongate recess (250b), in the face, for receiving a tail portion (240b) of the mold half (240), the elongate recess (250b) extending from the central structure (250a) along a radius of the disc (235).

A vacuum chuck includes an adsorption plate including porous materials, a housing including an accommodation part, a plurality of adsorption grooves, and a vacuum opening formed in the accommodation part. The adsorption plate is disposed in the accommodation part, and the plurality of adsorption grooves each have an arc shape and is formed in a surface of the accommodation part. The vacuum chuck further includes a vacuum line configured to supply vacuum pressure to the vacuum opening.

A temporary part is mounted onto the chuck of the diamond turning machine. A diamond turning tip of the diamond turning machine is used to form a reference surface on the temporary part, registering a baseline for a motion control system of the diamond turning machine. While the temporary part remains mounted to the diamond turning machine, a workpiece is mounted onto the temporary part, and the diamond tip is controlled relative to the reference surface to diamond turn a surface profile on the workpiece. Because the baseline established by the reference surface compensates for positional variations from mounting parts directly onto the chuck of the diamond turning machine, the length of the workpiece can be shaped to a designated length with a high degree of accuracy.

In a suction nozzle, a tip portion of an air pipe includes an opening portion having an area larger than that of a flow path of the air pipe, and a slit which is formed on the tip portion of the air pipe is provided in a portion of a circumferential contact surface contacting the component. In the suction nozzle, since air supplied from the air pipe flows out through the slit, the suction state of the component is canceled from the position of the slit as a base point.

An end effector comprises a plurality of vacuum ports. The plurality of vacuum ports is formed from a plurality of hollow protrusions extending from a face of the end effector. The plurality of vacuum ports is connected to a vacuum chamber receiving a vacuum from a vacuum source interface.

A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction pad 8 including: a pad main body 37 having a lower surface adhered to a stage 5 of a substrate holder 2; and a plurality of circular arc-shaped substrate holding convexities 38, provided on a top surface of the pad main body 37, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body 37, wherein the substrate holding convexities 38 are arranged concentrically with the circular pad main body 37, and width W1 in a radial direction of the substrate holding convexity 38 located on a radially outer side among the plurality of substrate holding convexities 38 is narrower than width W2 in the radial direction of the substrate holding convexity 38 on a radially inner side.

A vacuum chuck adapted for mounting on a lower turret assembly. The lower turret assembly is part a sealant liner applicator. The sealant liner applicator includes an upper turret assembly and a sealant gun, under computer control. The sealant gun is used for applying a sealant around a periphery of an inside of a can or jar lid. The vacuum chuck includes in one embodiment an impeller, with spiral vanes, for creating vacuum air. The impeller is mounted on top of a lower chuck. A top portion of the impeller is adapted for receiving the can lid and held thereon using the vacuum air produced when the impeller and the lower chuck are spun at high speeds, in a range of 1000 to 4000 rpm, on a lower turret assembly.