A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.

An apparatus calibrates a laser processing machine and includes an imaging sensor and a controller. The controller directs output of a beam from the machine’s low power pointer laser and directs an actuator at measurement conditions. Images of the beam are obtained by an imaging sensor, and the controller measures a parameter of at least one of the machine’s optical components. The controller then outputs an indication of the machine indicative of the measured parameter. For example, the controller can calculate a focus position of the beam from the laser head so the Z-position of the laser head can be adjusted for any discrepancies. In other examples, the controller can determine an offset of the fiber tip of the head so adjustments to operations can be made, or the controller can determine centering of the beam in the head’s nozzle so adjustments can be made.

An alignment adjuster includes a first holder made of a first material and configured to support an optical element, a first adjuster including a first expandable/contractable section made of a second material different from the first material and configured to rotate the first holder and the optical element around a first axis by adjusting the length of the first expandable/contractable section with the first expandable/contractable section being in contact with the first holder, and a first support member made of the second material and configured to support the first adjuster, and the first adjuster is configured to be capable of adjusting the position where the first expandable/contractable section and the first holder are in contact with each other to be located in a first plane containing a first end section of the first support member and the first axis.

Laser apparatus (10) includes at least: a laser oscillator that emits laser light (LB); reflection mirrors (M1), (M2) that are disposed on an optical path of laser light (LB) and change the optical path; actuators (ACT1), (ACT2) that are respectively coupled to reflection mirrors (M1), (M2) and displace reflection mirrors (M1), (M2); optical axis deviation detector (16) that is disposed to surround the optical path of laser light (LB) and detects an optical axis deviation of laser light (LB); and a controller that drives actuators (ACT1), (ACT2) on the basis of a detection result of optical axis deviation detector (16) to displace reflection mirrors (M1), (M2) and correct the optical axis deviation of laser light (LB).

A marking system for decorating one or more workpieces includes a plurality of marking stations that can mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof, a control system that can select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations, and a robotic manipulator that can transport a blank workpiece to the selected marking station under the control of the robotic manipulator. The selected marking station can mark the product image the blank workpiece based on the product image data which produces a product workpiece. The robotic manipulator can remove the product workpiece from the selected one of the plurality of marking stations.

The present invention discloses that a multi-laser cutting method and system, which is applied to a substrate to form a primary substrate having a pattern of rounded corners and a line, the throughput could be improved because CO.sub.2 laser cannot cut the round corner at the high speed, but the substrate strength could be kept due to the high cutting quality of the lines by CO.sub.2 laser. The poor quality of the cutting edges of the round corners will not affect on the substrate strength but the round corner cutting by the second laser unit will speed up the cutting process. The present invention applies the method by the 2 different laser machines to balance the throughput. Because at the same speed, for example 150 mm/sec, the cycle time per 1 substrate will be different due to the different length of the cutting lines.

A method for comparing laser machining systems is provided, wherein a laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising: detecting radiation emitted from a light source by means of the photodiode and generating a corresponding intensity signal, wherein the radiation is guided from the light source to the photodiode by at least one optical element in the laser machining head and/or by at least one optical element of the sensor module; aligning the laser machining head and the light source with one another so that the intensity signal assumes a maximum value; and comparing the intensity signal with at least one predetermined reference value. A method for monitoring a laser machining process and an associated laser machining system are also provided.

A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.

A laser apparatus includes a plurality of laser modules each generating a laser line in a working plane. The laser modules are juxtaposed so that the laser lines generated by the modules combine into a single laser line. Each of the laser modules includes at least one laser line generator. The laser line generator includes two linear arrays of strips of laser diodes each emitting a focused laser beam. The two linear arrays are arranged parallel to each other so that the strips are staggered. The two sets of parallel laser beams generated by the two linear arrays of strips, respectively, are merged into a single laser line by a set of mirrors. The linear arrays of strips of laser diodes and the mirrors are arranged so that the two sets of laser beams trace optical paths of the same length before being merged into a single laser line.

A device for aligning a processing optical assembly of a laser processing machine includes an entrance region for receiving a processing laser beam, a focus zone forming region for forming a measurement focus zone by the received processing laser beam along a target axis, and an imaging unit having a lens and a detector surface. The lens is configured to image measurement laser radiation that leaves the focus zone forming region after the measurement focus zone has been formed, along an imaging axis predefined by the target axis, onto the detector surface. The processing optical assembly is configured to shape a laser beam in the laser processing machine and to focus it along an incident beam axis so that a processing laser beam forms a preset Bessel beam focus zone in a workpiece to be processed.