An electromagnetic radiation system for directing an electromagnetic radiation beam (11) at a target (28) having a first arrangement (12) in which the radiation beam (11) is directed along a marking beam path that is within a marking range of the electromagnetic radiation system and a second arrangement (12, 15) in which the radiation beam (27) is directed along a different beam path (27) that is not within the marking range of the electromagnetic radiation system, wherein a positional relationship between the marking beam path (11) and the different beam path (27) satisfies a predetermined condition at the target (28) when the electromagnetic radiation system is at a predetermined distance (29) from the target (28).

A method and a device for detecting a focal position of a laser beam, particularly a machining laser beam in a laser machining head, includes an optical element which is arranged in the laser beam converging toward the focal point and which is designed to outcouple a reflection from the laser beam path, and a sensor arrangement which is designed to detect beam characteristics of said laser beam in the region of the focal point in the laser extension direction, and which measures the outcoupled reflection of the laser beam at at least two locations that are offset to one another in the extension direction, in order to determine the current focal position.

A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam S deviates from a laser beam L. In performing laser welding in the optical axis deviation direction, an irradiation position of the measurement beam S is changed so that the irradiation position of the measurement beam S is moved to a rear side of the center of the optical axis of the laser beam L in the welding direction.

A three-dimensional laser machine includes a machine head, a controller for positioning the machine head and controlling an orientation of a nozzle, and a sensor for detecting a distance between a workpiece and the nozzle. The controller is capable of performing a profile control of correcting the position of the machine head based on the detected distance. When the machine head has reached a predetermined position part way through an approach process of moving the machine head from an approach start position to a machining start position while controlling the pose of the nozzle, the controller performs the profile control to move the machine head to the machining start position.

A laser processing machine 100 includes: a laser processing unit 1 configured to process a workpiece W by using a laser beam L; an imaging device configured to image the workpiece W irradiated with the laser beam L; and a control device configured to control the laser processing unit 1 in accordance with a processing condition 51c for processing the workpiece W. The control device controls operation of the laser processing unit 1 such that size OIS of an optical image OI and a peak value PV of light intensity LI of the optical image OI observed from image information obtained by imaging the workpiece W with the imaging device approach preset reference values 60.

An apparatus for removing a portion of a coating system present in a multi-glazed window including: a decoating component to focus a laser source at a focus distance; two motors to move the decoating component along the X and Y axis; one optical system to detect on which interface the coating system is localized, and to estimate a distance between the decoating component and the detected interface; a third motor to control the position of the decoating component along a Z axis; and a displacement control unit of the third motor to displace the decoating component of a displacement distance equal to the difference between the estimated distance and said the distance in order to focus the decoating component on the detected interface.

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.

An apparatus calibrates a laser processing machine and includes an imaging sensor and a controller. The controller directs output of a beam from the machine’s low power pointer laser and directs an actuator at measurement conditions. Images of the beam are obtained by an imaging sensor, and the controller measures a parameter of at least one of the machine’s optical components. The controller then outputs an indication of the machine indicative of the measured parameter. For example, the controller can calculate a focus position of the beam from the laser head so the Z-position of the laser head can be adjusted for any discrepancies. In other examples, the controller can determine an offset of the fiber tip of the head so adjustments to operations can be made, or the controller can determine centering of the beam in the head’s nozzle so adjustments can be made.

A method of processing a substrate is provided. The method includes mounting a substrate on a concave mounting surface of a mounting table and deforming a surface of the substrate into a concave shape; detecting, by a height sensor, a height of the surface of the substrate in a vertical direction; determining positions of a plurality of first focus points based on height data of the surface of the substrate, detected by the height sensor; and forming a first modification layer in the substrate by irradiating the plurality of first focus points with a laser beam.

A laser module includes a laser source and at least one air knife. The laser source is configured to be coupled to a robotic arm of a robotic device, and emit a laser beam for processing a workpiece having a workpiece surface. The air knife is configured to be coupled to the robotic arm, and discharge an airflow sheet in a direction toward a laser spot where the laser beam impinges the workpiece surface, for clearing contaminants generated by impingement of the laser beam.