This laser irradiation mechanism includes a control unit which has a function allowing the focal point of a laser beam to describe a circle, performs control such that the focal point describes a spiral, and performs control such that the central axis of the spiral moves along a curved surface.

A process head for processing a substrate using a laser beam, comprising: an optical unit including at least one optical element for directing the laser beam; a plurality of Bernoulli air bearings arranged to surround an optical axis of the optical element and configured to eject a first fluid flow for producing an attractive force between said Bernoulli air bearing and said substrate by the Bernoulli principle, so as to maintain a substantially constant spacing between said optical element and said substrate.

According to a method for measuring the distance between a workpiece and a machining head of a laser machining apparatus, a machining head is provided, which has a housing that has an interior and an opening for emergence of the laser radiation from the machining head. The laser radiation is directed on to the workpiece, after it has passed through the interior and the opening. An object beam is directed on to the workpiece by a light source of an optical coherence tomograph in such a manner that the object beam passes through the interior and the opening before being incident upon the workpiece. In addition to the object beam, a measuring beam passes through the interior. The measuring beam is used to compensate falsifications of the measured distance that have been caused by pressure fluctuations in the interior. The measuring beam in this case may be reflected at a reflective face that is formed on an inner face of an outlet nozzle that comprises the opening, which inner face delimits the interior.

A method of processing structurally identical workpieces using a numerically controlled workpiece processing apparatus includes processing a first workpiece according to a first desired tool path specified for a tool of the numerically controlled workpiece processing apparatus by closed-loop controlling a working distance between the tool and the workpiece to achieve a defined desired distance, such that when processing the first workpiece, the tool is moved along a distance-controlled actual tool path. The method further includes optimizing the first desired tool path for a second workpiece based on the distance-controlled actual tool path of the first workpiece to provide a second desired tool path and processing the second workpiece according to the second desired tool path.

A method and an apparatus for joining two workpieces by means of a processing beam by forming a weld seam along a lap joint, wherein a gap formed at the lap joint between the two workpieces is filled during welding. The processing beam performs a spatial oscillatory movement parallel and/or perpendicular to the joint during welding. The oscillation parameters of said oscillation, the feed rate, the power of the processing beam and the angle of incidence of the processing beam onto the surfaces of the workpieces are adjusted dynamically during the welding process such that the upper sheet is fused in line with demand and the melt flows from the upper sheet down to the lower sheet thus closing the gap. The gap height is measured permanently during welding and the process parameters are adjusted such that a reliable closing of the gap is made possible.

Methods of liquid and solid materials analysis by laser induced ablation spectroscopy are disclosed. The liquid and solid materials are analyzed in an instrument having one pulsed laser to produce emissive plasma plumes and ablate solid material. Liquid phase samples are aerosolized before streaming to an analysis zone where they are dissociated into a plasma plume. A large number of sites within solid phase sample structures and be analyzed using a movable x-y-z stage and displayed in a chemical map.

A laser processing head includes: a housing; an entrance portion; an adjustment portion; and a condensing portion. A distance between a third wall portion and a fourth wall portion facing each other in a second direction is shorter than a distance between a first wall portion and a second wall portion facing each other in a first direction. The housing is configured to be attached to an attachment portion of a laser processing apparatus, with at least one of the first wall portion, the second wall portion, the third wall portion, and a fifth wall portion disposed on the side of the attachment portion. The condensing portion is disposed on a sixth wall portion, and is offset toward the fourth wall portion in the second direction.

The invention relates to a sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point, said device comprising a holding device and at least two sensors, wherein the holding device is formed by a matrix- or honeycomb-shaped arrangement of sleeves, consisting of individual sleeves whose sleeve axes intersect at a point of intersection (P) outside the holding device, and the at least two sensors each being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis. The holding device advantageously is a monolithic component produced in a generative manufacturing process.

The present invention provides a cutting method and equipment of auxiliary packaging containers for testing. The method includes: step S001, material feeding; step S002, laser cutting; performs circumferential cutting of the part of the packaging container to be cut by the laser cutting device on the equipment body; step S003, waste gas treatment; step S004, material unloading; the equipment includes an equipment body and a clamping and positioning device and a laser cutting device, the clamping and positioning device is provided on the lower side of the laser cutting device and can be rotated relative to the laser cutting device; the equipment body is equipped with a waste gas discharge device; the cutting method and equipment of auxiliary packaging containers for testing provided by the present invention overcomes the defects of poor cutting effect, narrow application range, inconvenient cutting and low efficiency of the existing cutting methods of packaging containers.

A laser processing apparatus includes a condensing lens configured to form a condensing point of an applied laser beam and form a focus of a camera; a focus adjusting unit configured to adjust a height of the focus of the camera by moving a base to which the camera and the condensing lens are fixed in a height direction perpendicular to a holding surface of a chuck table; a condensing point adjusting unit disposed between a laser oscillator and the condensing lens, and configured to shift a height of the condensing point of the laser beam without changing a height of the condensing lens; and a control unit including a registering section configured to register the heights of the condensing point and the focus, the control unit being configured to control the focus adjusting unit and the condensing point adjusting unit on the basis of information of the registering section.