An optical combiner includes: first optical input portions each including a first optical input waveguide; and an optical output portion to which the first optical input portions are connected and that includes a first core that allows light to propagate therethrough, and a cladding layer disposed outside of the first core and that has a refractive index lower than a refractive index of the first core. The first optical input portions are connected to a connection end face of the optical output portion such that the first optical input waveguide of at least one of the first optical input portions is optically coupled to the first core of the optical output portion.

A laser machining device includes: a broadband light source, which generates a broadband laser beam; a first lens unit to which the broadband laser beam is incident and having a first effective focal length; a second lens unit spaced apart from the first lens unit in a first direction and having a second effective focal length; a beam splitter disposed between the first lens unit and the second lens unit, and which is movable in the first direction and a direction opposite to the first direction within the first effective focal length from the first lens unit, and splits the broadband laser beam passing through the first lens unit into a plurality of sub-laser beams; and a focusing lens spaced apart from the second lens unit in the first direction, and which focuses the sub-laser beams passing through the second lens unit on a substrate.

A system includes a first group of optic lenses within a focusing unit positioned along the propagation direction of a collimated laser beam, the first group of optic lenses separated by a predetermined fixed distance. The first group of optic lenses in conjunction cause the collimated beam to form as an annular beam as it passes through the first group of optic lenses. An axicon lens located distal from the first group of optic lenses along the propagation direction, the axicon lens operable to bifurcate the annular beam into two deflected collimated beam sections, and the axicon lens having a focus that causes the two deflected collimated beam sections to merge at a distance distal from the axicon lens to create an interference pattern region.

An irradiation system includes: a first beam source configured to output a first laser beam and a second beam source configured to output a second laser beam, in which the second laser beam has a higher beam quality higher than that of the first laser beam;

optics arranged to focus the first and second laser beams; and a beam guiding system including a first beam path along which the first laser beam is guided, and a second beam path along which the second laser beam is guided, in which the beam guiding system includes a beam combiner to superimpose the first and second laser beams, the first beam source is a pump laser, the second beam source is a laser resonator, and the beam guiding system further includes a beam switch adapted to feed the first laser beam into a pump laser beam path and/or into the first beam path.

For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.

A thermal processing apparatus and method in which a first laser source, for example, a CO.sub.2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO.sub.2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

The disclosure relates to processing machines and methods for producing three-dimensional components by irradiating powder with a processing beam, the machines including a container with a moveable support for the powder, as well as an irradiating device with a scanner device for aligning the processing beam on a processing field at an opening of the container. The irradiating device includes a heating device that includes a heating radiation source for generating a heating beam for heating the powder from above and including a beam shaping optical unit configured to convert a first beam profile of the heating beam into a second beam profile, e.g., a ring-shaped beam profile, of the heating beam.

An object of the present invention is to provide a technique capable of easily manufacturing a desired optical device at the inside of a transparent board. An optical device according to the present invention is manufactured by denaturing the vicinity of a hollow structure at the inside of the transparent board and deforming the shape of the hollow structure

An ultra-high speed laser cladding device and a process based on the dual suppression of magnetic force and centrifugal force are provided, including a laser generator, a spectrometer, a powder device, a rotary tool and a magnetic field generator. The substrate is installed in the rotary tooling, through the driving device to rotate it. The magnetic field generator is used to generate a magnetic field in the rotary cylinder. The laser generator produces the first laser beam and the second laser beam with different energy through the spectrometer. They are both focused on the surface of the substrate. The powder conveyed by the powder device is sprayed to the surface of the substrate, laser cladded by the first laser beam and the second laser beam. The gas can quickly escape to ensure the density of the cladding layer and reduce the porosity.

The present invention discloses an optical path/beam splitting unit and a coaxial-wire-feed cladding head thereof. The optical path/beam splitting unit includes an adjustable mirror and at least one stage of beam splitter. Several adjustable mirrors are distributed around the beam splitter. The beam splitter splits an incident laser beam into a plurality of split beams perpendicular to the incident laser beam. The split beams all are focused to a point through the adjustable mirrors. The coaxial-wire-feed cladding head includes a cladding head mirror cavity provided therein with the optical path/beam splitting unit and a wire feeding tube. The wire feeding tube is coaxially arranged with the collimated laser beam. The wire feeding tube extends out of the cladding head mirror cavity. A wire passes through the wire feeding tube and the wire feeding nozzle in order. The adjustable mirrors adjust the focusing of the split beams onto the wire.