Using a transmission fiber for transmitting laser beams of multiple wavelengths oscillated by a DDL module, and a laser processing machine for cutting a sheet metal with a processing head that condenses the laser beams of multiple wavelengths and irradiates them onto the sheet metal, a mild steel plate or an aluminum plate is cut, and by cutting a mild steel plate with a thickness greater than or equal to 1 mm and less than or equal to 5 mm, a surface roughness (Ra) of a cut surface of the cut mild steel plate is less than or equal to 0.4 μm, and when an aluminum plate with a thickness greater than or equal to 1 mm and less than or equal to 5 mm is cut, a surface roughness (Ra) of a cut surface of the cut aluminum plate is less than or equal to 2.5 μm.

A laser welding system is provided including a laser source configured to produce at least one laser beam, beam modifying means configured to split the at least one laser beam, directing means, and controlling means configured to control the directing means. The controlling is configured to control the directing means to cause the split laser beam to form at least two heat source points on the target, the heat source points maintaining a linear profile, and move the at least two heat source points in a travel direction along the target, wherein the linear profile forms a predetermined, oblique angle relative to the travel direction.

An apparatus for irradiating semiconductor material is disclosed having, a laser generating a primary laser beam, an optical system and a means for shaping the primary laser beam, comprising a plurality of apertures for shaping the primary laser beam into a plurality of secondary laser beams. Wherein the shape and/or size of the individual apertures corresponds to that of a common region of a semiconductor material layer to be irradiated. The optical system is adapted for superposing the secondary laser beams to irradiate said common region. Further, the use of such an apparatus in semiconductor device manufacturing is disclosed.

A power control method for a laser system comprising laser diodes arranged in diode banks is provided. Each diode bank comprises at least one of the laser diodes and has a maximum power. The method comprises operating a first diode bank of the diode banks to output a first power; and concurrently operating other of the diode banks to output other powers, at least one of the other powers being different than the first power.

A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

Systems and methods for laser processing using a modified laser beam having a non-Gaussian energy distribution are described herein In some embodiments, a laser processing system includes a laser source that outputs a laser beam having a Gaussian energy distribution, and a beam modifier positioned in a path of the output beam. The beam modifier controllably modifies the Gaussian energy distribution of the output laser beam along at least one axis perpendicular to the beam's axis of travel. In various embodiments, the laser processing system includes a beam delivery sub-subsystem that operates in a raster mode. In such embodiments, the subsystem can raster the modified beam across a material to form raster lines for transferring an image or pattern to the material.

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

A laser apparatus includes a plurality of laser modules each generating a laser line in a working plane. The laser modules are juxtaposed so that the laser lines generated by the modules combine into a single laser line. Each of the laser modules includes at least one laser line generator. The laser line generator includes two linear arrays of strips of laser diodes each emitting a focused laser beam. The two linear arrays are arranged parallel to each other so that the strips are staggered. The two sets of parallel laser beams generated by the two linear arrays of strips, respectively, are merged into a single laser line by a set of mirrors. The linear arrays of strips of laser diodes and the mirrors are arranged so that the two sets of laser beams trace optical paths of the same length before being merged into a single laser line.

An invisible laser system and an optical path visualization method thereof are disclosed. The invisible laser system comprises an invisible laser light generator for generating invisible laser light; a visible light generator for generating visible light; and an optical path visualization component arranged in optical paths of the invisible and visible light, and comprising a first and second incident end and a first outgoing end. The invisible laser light is incident on the first incident end, and the visible light is incident on the second incident end. All of the invisible laser light and at least part of the visible light are emitted in parallel with each other at the first outgoing end. All of the invisible laser light is present in a direction parallel with the optical path of the visible light, and no invisible laser light is present in other directions, so radiation risks are eliminated.