The disclosure relates to methods and systems for deep welding a workpiece, a surface of the workpiece being irradiated by a first laser beam and a second laser beam. In a workpiece surface plane (OE) a first beam width B1 of the first laser beam is larger than a second beam width B2 of the second laser beam and in at least the workpiece surface plane (OE) the second laser beam lies inside the first laser beam. The intensity of the first laser beam alone is sufficient to produce a keyhole in the workpiece. The keyhole produced in the workpiece has a width KB in the workpiece surface plane (OE), KB substantially equaling B1, and B20.75*KB. The methods and systems provide good seam quality, high penetration depth, and high welding speed.

Laser processing device (1) includes: laser-beam switching apparatus (70) that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (11), the second optical path including second fiber (21) that has a core diameter that is larger than a core diameter of first fiber (11); and processing head (80) that illuminates a same processed point on workpiece (900) with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus (70) switches from the first optical path to the second optical path.

A laser cutting machine for cutting a workpiece having a first thickness (using a first processing laser beam having a first laser beam characteristic and a workpiece having a different second thickness using at least a second processing laser beam having a different second laser beam characteristic includes a laser source for producing a unprocessed laser beam having a laser wavelength of less than 4 m, a device which forms from the unprocessed laser beam the processing laser beams, and a control unit which controls the device in dependence on the thickness of the workpiece to be cut.

Systems and methods for laser processing systems and associated methods for using and manufacturing such systems are disclosed herein. In some embodiments, a laser processing system includes a controller, a laser source, a material support, and a beam delivery subsystem operably coupled to the controller. The beam delivery subsystem comprises an optical carriage assembly configured to receive and modify a laser beam from the laser source, and direct the laser beam toward a material to be processed carried by the material support. The optical carriage assembly is further configured to focus the laser beam within a material processing field to obtain an adjustable power density within a material processing plane and achieve an optimal selected condition for the material to be processed.

An additive manufacturing device includes: an inner light beam radiation device of radiating an inner light beam; an outer light beam radiation device of radiating an outer light beam; and a control device. when a molten pool is irradiated with the outer light beam, the control device controls a power density of the outer light beam representing an output per unit area such that a cooling rate of the molten pool representing a temperature drop per unit time is 540? C./s or less at a freezing point of a carbide binder included in the molten pool, the molten pool being formed by irradiating a material including a hard material and a carbide binder with the inner light beam to melt the material. According to the present disclosure, the additive manufacturing device can prevent cracking and additively manufacture a high-quality shaped object with a simple configuration.

A laser beam machine includes a number of laser modules that each generate a laser beam and a combiner that collects a plurality of laser beams generated from the laser modules to output one laser beam. The laser beam machine further includes a plurality of driving power supplies that supply power to the laser modules, respectively, a calculation device that calculates a driving condition for each of the laser modules according to a received machining condition, and a power-supply control apparatus that causes the driving power supplies to supply power to the laser modules in accordance with the driving condition. The calculation device controls the power-supply control apparatus to reduce differences in integrated laser-output times of the laser beams generated by the laser modules.

A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

A power control method for a laser system comprising laser diodes arranged in diode banks is provided. Each diode bank comprises at least one of the laser diodes and has a maximum power. The method comprises operating a first diode bank of the diode banks to output a first power; and concurrently operating other of the diode banks to output other powers, at least one of the other powers being different than the first power.

Systems and techniques for processing materials using wavelength beam combining for high-power operation in concert with interferometry to detect the depth or height of features as they are created.

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.