A laser micro/nano processing system (100, 200, 300, 400) comprises: a laser light source used to provide a first laser beam having a first wavelength and a second laser beam having a second wavelength different from the first wavelength, with the pulse width of the first laser beam being in the range from a nanosecond to a femtosecond; an optical focusing assembly used to focus the first laser beam and the second laser beam to the same focal point; and a micro mobile platform (21) controlled by a computer. Also disclosed are a method for micro/nano-processing photosensitive materials with a laser and a method for fabricating a device with a micro/nano structure using laser two-photon direct writing technology. In the system and methods, spatial and temporal overlapping of two laser beams is utilized, so as to obtain a micro/nano structure with a processing resolution higher than that of a single laser beam, using an average power lower than that of a single laser beam.

The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L1, a second laser light source 102 for emitting a second pulsed laser light L2, half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed 1. When the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates 104, 105 are varied by a light intensity controller 121 in the laser processing apparatus 100, the ratios of the pulsed laser light L1, L2 polarization-separated by the polarization beam splitters 106, 107 are altered, whereby the respective intensities of the pulsed laser light L1, L2 are adjusted.

A laser device has a plurality of semiconductor lasers, a driving device that supplies a driving electric current to the semiconductor laser, a trigger generation circuit that sends a trigger signal to the driving device in order to output the driving electric current, and a wave-combining device that wave-combines laser light emitted from the semiconductor lasers at the combined-wave end, and at least any one of a signal transmitting time, an electric current transmitting time and a light transmitting time is adjusted so as to be the time set respectively for transmitting paths; wherein the signal transmitting time in which the trigger signal transmits over the signal path, the electric current transmitting time in which the laser light transmits over the electric current path, a light transmitting time in which the laser light transmits over the optical path.

The invention discloses a device for laser material machining, with at least two laser beam sources (2a-2c) which emit laser beams (5a-5c) of different wavelengths, with associated beam imaging means (3a-3c), to configure appropriately the beam paths of each associated laser beam (5a-5c), a beam superposition device (6), to overlay the laser beams (5a-5c) on each other, and imaging optics (8), to image the overlaid laser beams (5a-5c) onto a workpiece (12) so that respective focal points are associated with the laser beams (5a-5c) in the focus of the imaging optics (8) on the workpiece (12), wherein the beam imaging means image the laser beams (5a-5c) onto the respective focal points in a predefined arrangement which can be varied by means of the beam imaging means (3a-3c). According to the invention, electronic control devices (4a-4c) are provided which are able to vary each of the outputs of the laser beams (5a-5c) with a high frequency to vary the intensities of the respective focal points at the focus of the imaging optics (8) in a predefined manner. In this way, a high frequency control of the parameters of laser material machining which can be combined with conventional modulation techniques is implemented.

Provided is a laser processing device capable of performing high-power laser processing while preventing reduction of life duration of a light source for excitation light. By collecting the light emitted from single emitters of a plurality of single emitter LDs onto one end face of an optical fiber cable, high-power excitation light is transmitted to a marking head through the optical fiber cable. Excitation light emitted from the other end face of the optical fiber cable is separated into first excitation light and second excitation light. The first excitation light excites a first laser medium to generate laser light. The generated laser light enters a second laser medium. The second excitation light enters the second laser medium. With this, the second laser medium is excited, and the laser light that has entered the second laser medium from the first laser medium is amplified.

A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90). Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

A processing apparatus using a plurality of lasers includes a plurality of laser generators that generate multiple laser beams, a plurality of beam modifiers that maintain a shape of each laser beam or modify the shape in real time, beam combiners that combine multiple laser beams modified by the plurality of beam modifiers, and a control unit that changes an irradiation condition of each laser beam based on a processing condition of an object to be processed to control driving of each laser generator and the beam modifier in real time, thereby irradiating laser beams having different wavelengths to a single object to be processed or an object to be processed in which the same or different materials are stacked to process the single object to be processed or the object to be processed.

A machining system for laser machining a workpiece includes a laser beam source for providing a plurality of coherent laser beams, a phase adjustment unit for adjusting a respective phase difference between the plurality of coherent laser beams, an amplifier for amplifying the plurality of coherent laser beams to form respective amplified coherent laser beams, a processing optic for combining the amplified coherent laser beams to form a machining laser beam and for applying the workpiece with the machining laser beam, a feed unit for controlling a position and/or an orientation and/or a movement status of the workpiece relative to the machining laser beam, a detection unit for determining a status of the feed unit, and a control unit configured to control the phase adjustment unit according to the status of the feed unit as determined by the detection unit.

Apparatus for laser processing a material (29), which apparatus comprises at least one first laser (15), at least one second laser (16), an optical combiner (3), and a multicore fibre (10), wherein: each first laser (15) is connected to the optical combiner (3) via a first feed fibre (1); each second laser (16) is connected to the optical combiner (3) via a second feed fibre (2); the optical combiner (3) connects the first feed fibre (1) to a first core (11) of the multicore fibre (10), and the second feed fibre (2) to a second core (12) of the multicore fibre (10); the optical combiner (3) provides a first optical path (41) from the first laser (15) to the first core (11) of the multicore fibre (10); the optical combiner (3) provides a second optical path (42) from the second laser (16) to the second core (12) of the multicore fibre (10); and the optical combiner (3) comprises a fibre bundle (4) that is tapered along its length.

Disclosed is a method and device for generating additive manufacturing control data. The control data are generated such that the energy beam has an intensity distribution, at the area of incidence on the build field, in a see tion plane running perpendicularly to the beam axis of the energy beam, which intensity distribution has at least one local minimum in a middle region along at least one secant of the intensity distribution in the section plane and has an intensity profile curve, running along the edge of the intensity distribution, which intensity profile curve has, at least at one point, a maximum value, and, at least at one point in a region opposite the maximum value on the intensity profile curve, a minimum value.