An aspect of the invention provides a device, comprising: a laser machining head configured to deflect laser radiation onto an optical system comprising a substrate, the device being configured to carry out a method for separating the substrate using the optical system, the optical system being configured to provide the laser radiation, a thickness of the substrate not exceeding 2 mm in a region of a separating line, the method comprising: applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate using the optical system, the substrate material being transparent at least in part to a laser wavelength of the pulsed laser radiation, the pulsed laser radiation being focused using the optical system at an original focal depth (f1), an intensity of the pulsed laser radiation leading to a modification of the substrate along a beam axis (Z) of the pulsed laser radiation.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

Cutting a wafer having devices, such as glass optical waveguides, into die by cutting into both sides of the wafer to reduce or eliminate micro-cracks and defects in the die. The wafer can be cut by simultaneously cutting the wafer from both sides using separate lasers at a controlled depth. The wafer can also be sequentially cut by cutting into one side of the wafer, flipping the wafer, and then cutting into the other side of the wafer. A processor controls the power of each laser to select the depth of each cut, such that each cut may be 50% into the wafer, or other depths such as 30% for one cut and 70% for the other cut. The wafer may be cut into the bottom surface of the wafer first, and then cut into the top surface of the wafer having the optical waveguides.

Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

According to one embodiment, an optical machining apparatus includes a first light source, and a second light source. The first light source is configured to radiate a first beam onto a first position of a surface of a work in such a manner as to transfer heat at a temperature lower than a melting temperature of the work from the first position of the work to a second position of a surface of the work on an opposite side to the first position. The second light source is configured to radiate a second beam onto the second position such that a temperature of the work exceeds the melting temperature of the work, in a state in which a temperature of the second position is raised by the transfer of the heat.

A double-side synchronous laser shock peening (LSP) method for leading edges of turbine blades employs two laser beams with the same diameter and different pulse energy to synchronously shock the front and back sides of each point within 8-10 mm range of the leading edge of the blade, wherein the laser pulse energy on the front side is greater than the laser pulse energy on the back side, and wherein, the laser power density on the front side is used to generate dynamic plastic deformation on the entire laser-shock spot area, while the laser power density on the back side is used to balance off excessive shock-wave pressure in the central area of laser-shock spot on the front side and avoid macroscopic deformation of the blade in the central area of laser-shock spot on the front side, and an optimal strengthening effect is achieved finally.

A first optical member including a reflection mirror and a lens forms a first optical path of laser light. A second optical member including a reflection mirror, a lens, and a reflection mirror forms a second optical path of laser light. A motion mechanism moves a cutting edge of a cutting part relative to the first optical path and the second optical path. A controller causes the motion mechanism to move the cutting edge relative to the first optical path to machine a flank face of the cutting edge with laser light passing through the first optical path. The controller further causes the motion mechanism to move the cutting edge relative to the second optical path to machine a rake face of the cutting edge with laser light passing through the second optical path.

A hollow glass body comprises a cylindrical main body portion having a first inside diameter, and a first end opening and a second end opening on opposite ends of the hollow glass body. The hollow glass body has a second inside diameter at the second end opening. The second inside diameter is smaller than the first inside diameter. A difference between the first inside diameter and the second inside diameter is at most 100 μm.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A double-side synchronous laser shock peening (LSP) method for leading edges of turbine blades employs two laser beams with the same diameter and different pulse energy to synchronously shock the front and back sides of each point within 8-10 mm range of the leading edge of the blade, wherein the laser pulse energy on the front side is greater than the laser pulse energy on the back side, and wherein, the laser power density on the front side is used to generate dynamic plastic deformation on the entire laser-shock spot area, while the laser power density on the back side is used to balance off excessive shock-wave pressure in the central area of laser-shock spot on the front side and avoid macroscopic deformation of the blade in the central area of laser-shock spot on the front side, and an optimal strengthening effect is achieved finally.