Provided is a method of producing an electronic part holding jig, including applying laser light to an elastomer sheet to form a holding hole for holding an electronic part in the elastomer sheet, wherein the applying of the laser light is performed by passing the laser light emitted from a laser oscillator through a mask pattern having a transmission hole corresponding to a shape of the holding hole to be formed, and condensing the light with a lens, followed by the applying of the light to the elastomer sheet.

A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation and increasing the filament length.

Provided herein is an apparatus that includes a first and second laser source. The first and second laser sources are each operable to cut a substrate and are each independently movable with respect to one another. Further, the first and second laser sources are included within a multitude of laser sources that are arranged in a circular array.

A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.

A side trimming apparatus including a cutting unit which is installed on at least one side of a steel plate being transferred and trims a side of the steel plate by mechanical cutting and a laser processing unit which is installed in front of the cutting unit and emits a laser beam to a portion of the steel plate to be cut to form a groove at the portion to be cut or preheat the portion to be cut, and a side trimming method using the same are provided.

A laser engraving device includes a carrier substrate, a position detecting module, and a laser engraving module. The carrier substrate is used to carry at least one wafer, and the at least one wafer has a first engraving area formed thereon. The position detecting module includes a first transmitting component and a first receiving component. The laser engraving module includes a first laser generator to provide a first laser light source. The position detecting module can provide a first position signal of the first engraving area by matching the first transmitting component and the first receiving component. Therefore, the light from the first laser light source generated by the first laser generator can be precisely projected onto the first engraving area of the at least one wafer according to the first position signal so as to form a first predetermined pattern on the first engraving area.

An optical communication cable and related systems and methods are provided. The optical cable includes a plurality of wrapped core elements, and the outer surfaces of adjacent wrapped core elements are joined together by discrete bond sections. The discrete bonds sections may be structures such as laser welds, ultrasonic welds, or adhesive material. The discrete bonds hold the wrapped core elements together in the wrapped pattern, such as an SZ stranding pattern.

A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.

A method of slitting a film material of a biosensor test strip is disclosed. The film material includes a working surface and an opposed bottom surface. The film material is moved relative to a bottom laser beam directed against the bottom surface of the film material, and relative to a working surface laser beam directed against the working surface of the film material. The bottom laser cuts partially into the bottom surface of the film material to a first depth. The working surface laser cuts into the working surface of the film material to a second depth. The bottom and working surface laser cuts are aligned and cooperate to define first and second portions of the film material on opposite sides of cuts. The bottom and working surface laser cuts either intersect and thereby separate the first and second portions, or are closely adjacent, leaving a connecting bridge which is subsequently severed into two portions.

There is described a method of forming a cooling hole in a component having a wall comprising a first surface and a second surface, the method comprising: directing a first laser beam onto the first surface of the component wall at an oblique angle so as to drill a first hole extending from the first surface towards the second surface; directing a second laser beam onto the second surface of the component wall at an oblique angle so as to drill a second hole extending from the second surface towards the first surface, the first and second holes intersecting to form a cooling hole passing through the component wall between the first and second surfaces.