A processing method of a workpiece used when the workpiece is processed is provided. The processing method of a workpiece includes a disposing step of disposing the workpiece in a gas containing a substance that generates an active species that reacts with the workpiece, a measurement step of measuring the distribution of the thickness of the workpiece disposed in the gas, and a laser beam irradiation step of irradiating the workpiece in the gas with a laser beam of which the power is adjusted based on the distribution of the thickness measured in the measurement step. In the laser beam irradiation step, the removal amount by which a region irradiated with the laser beam in the workpiece is removed by the active species is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.

The invention provides an apparatus for creating a hole in a glass container with a medium stored therein, comprising: a laser system configured to focus laser pulses with a wavelength in the ultraviolet regime onto the glass container such as to create a hole in the glass container by laser ablation preferably without creating significant amounts of glass particles inside and outside the glass container.

The invention provides an apparatus for creating a hole in a glass container with a medium stored therein, comprising: a laser system configured to focus laser pulses with a wavelength in the ultraviolet regime onto the glass container such as to create a hole in the glass container by laser ablation preferably without creating significant amounts of glass particles inside and outside the glass container.

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

The invention relates to a method for manufacturing a hollow glass article including a step of marking the hollow glass article thus formed by laser, the surface of the hollow glass article being at a temperature between 400° C. and 600° C. The marking step consists in making filiform decorations by producing at least one continuous and shiny groove on the surface of the hollow glass article.

The invention relates to a method for manufacturing a hollow glass article including a step of marking the hollow glass article thus formed by laser, the surface of the hollow glass article being at a temperature between 400° C. and 600° C. The marking step consists in making filiform decorations by producing at least one continuous and shiny groove on the surface of the hollow glass article.

An element chip manufacturing method includes a step of preparing a substrate including a semiconductor layer and a wiring layer formed on the semiconductor layer and having a plurality of element regions and a dicing region defining the element regions, a laser grooving step of irradiating a laser beam to the wiring layer at the dicing region, to form an aperture exposing the semiconductor layer, and an individualization step of etching the semiconductor layer exposed from the aperture, with plasma, to divide the substrate into a plurality of element chips. The laser grooving step including a step of irradiating a first laser beam, to form a first groove exposing the semiconductor layer in the dicing region, and a step of irradiating a second laser beam, with a beam center positioned outside a side wall of the first groove, to widen the first groove into the aperture.

An element chip manufacturing method includes a step of preparing a substrate including a semiconductor layer and a wiring layer formed on the semiconductor layer, the substrate having element regions and a dicing region defining the element regions, a laser grooving step of irradiating a laser beam to the wiring layer at the dicing region, to form an aperture exposing the semiconductor layer, and a step of etching the semiconductor layer exposed from the aperture, with plasma, to divide the substrate into a plurality of element chips. The laser grooving step includes a step of irradiating a first laser beam having a first pulse width, to remove the wiring layer in an edge portion of the dicing region, and a step of irradiating a second laser beam having a second pulse width which is longer than the first pulse width, to remove the wiring layer inside from the edge portion.

A cutting method for a display panel, wherein the cutting method includes: cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam; and severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads.

The present specification relates to a joint body of different materials, and a method of manufacturing the same. The joint body includes a metal layer; and a resin layer provided on and in contact with one surface of the metal layer. The metal layer comprises two or more etching grooves and two or more burrs provided on a surface of the metal layer adjacent to the etching grooves.