B23K26/0622

Laser processing method and laser processing apparatus

A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

METHOD OF MANUFACTURING DIAMOND SUBSTRATE

A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.

Timepiece Component, Timepiece, And Method For Manufacturing Timepiece Component
20230008589 · 2023-01-12 ·

A method for manufacturing a timepiece component includes: forming a first processed surface having a predetermined pattern by irradiating a surface of a receiving plate with a femtosecond laser; and forming a second processed surface having a surface roughness smaller than that of the first processed surface by irradiating at least a part of the first processed surface with a nanosecond laser.

LASER CLEANING BATTERY COMPONENTS
20230011238 · 2023-01-12 ·

A battery pack including a supporting structure, a battery cell housed within the supporting structure, a sleeve partially surrounding the battery cell, a bus bar, and a wire. The sleeve extends over a portion of a first end of the battery cell and has a laser-cut cutaway portion exposing a laser-cleaned first bonding area of the first end of the battery cell. The laser-cleaned first bonding area is positioned adjacent to an outer perimeter of the first end of the battery cell. The bus bar has a laser-cleaned second bonding area. The wire is bonded to the first and second laser-cleaned bonding areas to electrically connect the battery cell to the bus bar.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING APPARATUS AND SEMICONDUCTOR DEVICE
20230215819 · 2023-07-06 · ·

A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING APPARATUS AND SEMICONDUCTOR DEVICE
20230215819 · 2023-07-06 · ·

A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.

Methods for removing interstitial material from superabrasive materials of cutting elements using energy beams

A method of forming a cutting element for an earth-boring tool may include directing at least one energy beam at a surface of a volume of polycrystalline superabrasive material including interstitial material disposed in regions between inter-bonded grains of polycrystalline superabrasive material. The method includes ablating the interstitial material with the at least one energy beam such that at least a portion of the interstitial material is removed from a first region of the volume of polycrystalline superabrasive material without any substantial degradation of the inter-bonded grains of superabrasive material or of bonds thereof in the first region.

Methods for removing interstitial material from superabrasive materials of cutting elements using energy beams

A method of forming a cutting element for an earth-boring tool may include directing at least one energy beam at a surface of a volume of polycrystalline superabrasive material including interstitial material disposed in regions between inter-bonded grains of polycrystalline superabrasive material. The method includes ablating the interstitial material with the at least one energy beam such that at least a portion of the interstitial material is removed from a first region of the volume of polycrystalline superabrasive material without any substantial degradation of the inter-bonded grains of superabrasive material or of bonds thereof in the first region.

ADDITIVE MANUFACTURING METHOD AND DEVICE

The invention relates to an additive manufacturing method in which a component (10, 42, 43, 44, 45) is produced in layers using an energy beam (8, 41, 58) which solidifies a starting material (4) and is irradiated by energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61) while the starting material (4) is held by a base surface (3, 15, 30, 36, 52) arranged on a base element (2, 16, 29, 35, 51). While the starting material (4) is being irradiated with the energy beam (8, 41, 58), the base element (2, 16, 29, 35, 51) is moved by a rotational component which has a base element rotational axis, wherein the starting material (4) is held on the base surface (3, 15, 30, 36, 52) by a centrifugal acceleration generated by the rotational component. The invention is characterized in that a rotational movement is produced for at least some of the energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61). Analogously, at least one energy beam rotational axis (46) is proposed for rotating at least some of the energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61) in an additive manufacturing device in which the starting material (4) is held on a base surface (3, 15, 30, 36, 52) by a centrifugal acceleration.

METHOD FOR MACHINING A MATERIAL
20230211438 · 2023-07-06 ·

A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.