Methods, computer program products, and apparatuses for reducing sticking during a lithography process are disclosed. An exemplary method of reducing sticking of an object to a modified surface that is used to support the object in a lithography process can include controlling a light source to deliver light to a native surface thereby causing ablation of at least a portion of the native surface to increase the roughness of the native surface thereby forming the modified surface. The increased roughness reduces the ability of the object to stick to the modified surface.

A laser machining system includes: a laser irradiation device that irradiates a workpiece with a laser beam; a workpiece moving device that moves the workpiece; a laser irradiation controller that controls the laser irradiation device to control an irradiation position of the laser beam; and a workpiece move controller that controls the workpiece moving device to control at least one of the position and the posture of the workpiece. The workpiece move controller transmits information about at least one of the position and the posture of the workpiece to the laser irradiation controller. The laser irradiation controller compensates for the irradiation position of the laser beam based on the information received from the workpiece move controller.

Provided is a laser machining method with which strain occurring in a workpiece can be reduced even when a large number of through-holes are formed. The laser machining method includes: a gas supply step (S3) of making a gas pressure on the back surface side of a workpiece 1 higher than a gas pressure on the front surface side of the workpiece 1; a deep hole machining step (S5) of irradiating the workpiece 1 from the front surface side with a pulsed laser having a first repetition frequency f1, thereby forming through-holes A in the workpiece 1; and a hole finishing step (S7) of irradiating the inner surface of the through-holes A with a pulsed laser having a second repetition frequency f2 that is lower than the first repetition frequency f1.

A grinding apparatus conveys a wafer from a first rough grinding unit and a first finish grinding unit to a first laser beam irradiation unit by a turntable. Thus, in one grinding apparatus, the wafer can be ground and damage of the wafer caused due to the grinding can be repaired easily and rapidly. Therefore, it is possible to execute the grinding of the wafer and the repair of the damage efficiently and favorably.

A laser welding optical apparatus includes: a laser beam source; a collimation optical unit collimating the provided laser beam; a beam splitter splitting the collimated laser beam into partial beams, the beam splitter having a first setting facility, which variably sets the splitting of the collimated laser; and a focusing optical unit focusing the partial beams onto the welding workpiece The laser beam source has a multiclad fiber having a core and ring fiber, and a second setting facility, which variably splits an input laser beam at an end of the multiclad fiber between the core and ring fiber. A second end of the multiclad fiber provides the laser beam for the collimation optical unit. The beam splitter splits the collimated laser beam among two leading and trailing partial beams. The first setting facility sets the energy distribution between the leading and the trailing partial beams.

Disclosed is a laser welding method for a secondary battery, in which a first electrode substrate tab and a second electrode substrate tab are laser-welded onto a first electrode uncoated region of a first electrode plate and a second electrode uncoated region of a second electrode plate, respectively, wherein the first electrode substrate tab and the second electrode substrate tab are fusion-bonded with a laser beam so as to have a preset welding pattern at welding portions thereof.

A first resin member including a first contact surface and formed of laser beam-transmissive resin and a second resin member including a second contact surface, which contacts the first contact surface, and formed of laser beam-absorbing resin are arranged one upon the other. A laser welding apparatus includes a clamping unit abutting the second resin member and applying clamping force to the second resin member, a laser emitter emitting laser beam, a laser controller controlling output of the laser beam, a displacement sensor measuring displacement of the second contact surface in stacking direction of the resin members, and a control unit controlling the clamping unit to adjust the clamping force corresponding to displacement amount of the second contact surface continuously or intermittently obtained from the displacement sensor.

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.

Features are applied to a mathematical model to produce a cutting pattern for opening a container. The cutting pattern specifies which of one or more cutting tools is to be used and the location of where cuts are to be made on the container. The cutting pattern is sent to a container opening machine. The container opening machine is operated and the container cut and opened by the container opening machine according to the cutting pattern.

An apparatus for emitting an incident laser beam that is a linearly polarized laser beam at a predetermined intensity, includes: an intensity changing optical element (polarization beam splitter) disposed on the optical path of the incident laser beam, for changing the intensity of an outgoing laser beam by allowing a transmission of a component of the incident laser beam polarized in a predetermined variable transmission direction and to rotate around the optical axis of the incident laser beam within a range of at least 90° with respect to a predetermined reference angle; and a polarization direction changing optical element (concave lens) disposed upstream the optical path of the incident laser beam with respect to the intensity changing optical element, and for changing the polarization direction of the incident laser beam and to emit the incident laser beam, the change direction being variable.