Systems and methods for laser processing systems and associated methods for using and manufacturing such systems are disclosed herein. In some embodiments, a laser processing system includes a controller, a laser source, a material support, and a beam delivery subsystem operably coupled to the controller. The beam delivery subsystem comprises an optical carriage assembly configured to receive and modify a laser beam from the laser source, and direct the laser beam toward a material to be processed carried by the material support. The optical carriage assembly is further configured to focus the laser beam within a material processing field to obtain an adjustable power density within a material processing plane and achieve an optimal selected condition for the material to be processed.

A laser processing device including a laser light source that outputs laser light, a measurement light source that outputs measurement light, a converging unit that converges the laser light toward an object to be processed to form a first converging point and converges the measurement light toward the object to be processed to form a second converging point, a measurement part for measuring displacement of an entrance surface according to reflected light of the measurement light on the entrance surface of the laser light and the measurement light in the object to be processed, and an adjustment unit that adjusts a position of the first converging point in a direction intersecting the entrance surface according to a measurement result of the displacement of the entrance surface.

A laser processing device which irradiates a workpiece while scanning focused laser light and forms molten region on a surface of workpiece includes first optical sensor which has a function of detecting light generated from molten region during irradiation with the laser light, the detecting is performed for first measurement region on the surface of workpiece as a detection target, and second optical sensor which has a function of detecting light generated from molten region during irradiation with the laser light, the detecting is performed for second measurement region narrower than first measurement region on the surface of workpiece as a detection target.

A method of laser processing of a metallic material is described. Furthermore, disclosed herein are aspects of a machine for laser processing of a metallic material arranged to implement the laser processing method, and a computer program comprising one or more code modules for implementing the aforementioned method when the program is executed by electronic processing means.

A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.

The invention relates to a device for roughening cylinder bores using a beam tool and offering a very high level of process reliability even for a large quantity.

A laser cutting head with movable mirrors may be used to move a beam, for example, to provide beam alignment and/or to provide different wobble patterns for cutting with different kerf widths. The laser cutting head includes a cutting nozzle for directing the laser beam together with a gas to a workpiece for cutting. The movable mirrors provide a wobbling movement of the beam within a relatively small field of view, for example, within an aperture of the cutting nozzle. The movable mirrors may be galvanometer mirrors that are controllable by a control system including a galvo controller. The control system may also be used to control the fiber laser, for example, in response to the position of the beams relative to the workpiece and/or a sensed condition in the cutting head such as a thermal condition proximate one of the mirrors.

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

A substrate processing system includes a laser processing apparatus including a holder and a radiation unit, the holder being configured to hold a substrate including a base substrate, an irregularity pattern formed on a main surface of the base substrate, and an irregularity layer formed along the irregularity pattern, the radiation unit being configured to radiate a laser beam to a protrusion of the irregularity layer to flatten the irregularity layer by removing the protrusion in a state that the substrate is held by the holder; a controller configured to control a position of an irradiation point of the laser beam; and a polishing apparatus configured to polish the irregularity layer in which the protrusion is removed with the laser beam to be flattened.

There are provided a laser irradiation apparatus, a laser irradiation method, and a semiconductor device manufacturing method that reduce irradiation unevenness of a laser beam.

A laser irradiation apparatus includes a waveform shaping device (20). The waveform shaping device (20) includes a laser beam source (11), a first waveform shaping unit (30) that shapes the pulse waveform of a pulse laser beam by applying a delay according to an optical path length difference between two light beams (L11 and L12) branched by a first beam splitter (31), a wave plate that changes the polarization state of the pulse laser beam from the first waveform shaping unit (30), and a second waveform shaping unit (40) that shapes the pulse waveform of the pulse laser beam by applying a delay according to an optical path length difference between two light beams (L15 and L16) branched by a second beam splitter (41).