A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.

An optical system that relays light to a machining lens to be used for machining on a workpiece includes a spatial light modulator and a second lens arranged between the spatial light modulator and the machining lens, a distance D from the second lens to a machining lens pupil is D = f.sub.2 - Mf.sub.2, and a distance D1 from the spatial light modulator to the second lens is D1 = f.sub.2 - f.sub.2/M, and the spatial light modulator has a conjugate relation with the machining lens pupil of the machining lens, where f.sub.2 is a focal length of the second lens, and M is a projection magnification from the spatial light modulator to the machining lens pupil of the machining lens.

An alignment adjuster includes a first holder made of a first material and configured to support an optical element, a first adjuster including a first expandable/contractable section made of a second material different from the first material and configured to rotate the first holder and the optical element around a first axis by adjusting the length of the first expandable/contractable section with the first expandable/contractable section being in contact with the first holder, and a first support member made of the second material and configured to support the first adjuster, and the first adjuster is configured to be capable of adjusting the position where the first expandable/contractable section and the first holder are in contact with each other to be located in a first plane containing a first end section of the first support member and the first axis.

A method is proposed for producing a packaging, having a method step of microperforation of a flexible material as a packaging film, comprising: provision of the flexible material as a packaging film, transport of the flexible material over a transport section, provision of a laser in order to generate a perforation of the flexible material with its beam. For a packaging with improved gas exchange, a laser system with a wavelength in the range of from 150 nm to 1064 nm, preferably from 355 nm to 532 nm, is used for the laser, and the perforation with the laser is carried out during the movement of the flexible material of the packaging film during the transport.

A method for determining a depth of a vapor capillary during laser machining includes: irradiating a machining laser beam onto a workpiece to form the capillary, the beam deflected by a first deflection device along a machining path within a first scan field, irradiating an optical measuring beam onto the workpiece, the measuring beam deflected by a second deflection device relative to the machining laser beam along a scanning path within a scanning area and then together with the machining laser beam by the first deflecting device, acquiring measured distance values along the path based on part of the measuring beam reflected by the workpiece, determining a depth/position of the capillary based on the acquired measured distance values. The scanning area size is based on a position of the laser beam and/or deflection of the laser beam by the first deflection device. A corresponding laser machining system is also provided.

A method for displacing a continuous energy beam includes emitting a continuous energy beam in a direction of a powder material and displacing the energy beam by overlaying an optical deflection of the energy beam using of a deflection device and a mechanical deflection of the energy beam using of a scanner device. The mechanical deflection is configured to position the energy beam at a plurality of irradiation positions, and the optical deflection is configured to deflect the energy beam around each of the irradiation positions within a beam region of the deflection device onto at least one beam position in a sequence of beam positions. The optical deflection and the mechanical deflection are controlled such that the energy beam successively scans subsequences with an abrupt change of the optical deflection such that two spatially separated subsequences are successively adopted by the energy beam.

A laser tool, in particular for the structuring of cylinder running surfaces, that offers the possibility of guiding the laser beam of the laser tool with high process reliability, it is provided that the laser tool has a laser source for producing laser beams that are passed through a lens tube located in a hollow shaft, wherein a lens through which the laser beams are passed is attached to the lens tube, wherein the hollow shaft is designed to be rotatable as a hollow-shaft motor, wherein a spindle, to which is attached an optical device for deflecting the laser beam onto a workpiece surface, is attached to the hollow shaft, wherein the hollow shaft is rotatable independently of the lens.

A device is provided for determining an orientation of an optical device of a coherence tomograph. The device has an optical reference geometry, a deflection optics configured to direct an optical measuring beam reflected by the optical device onto the optical reference geometry, and an evaluation unit configured to determine a distance between a first reference plane and at least one second reference plane of the optical reference geometry in order to determine the orientation of the optical device.

A machining head emits a laser beam for cutting sheet metal of stainless steel. A moving mechanism moves the machining head relatively to a surface of the sheet metal. A beam vibrating mechanism vibrates a laser beam in a parallel direction with a cutting advancing direction of the sheet metal. In a machining condition database, a single specific vibration frequency at which cutting of the sheet metal is possible is set to a maximum moving velocity at which cutting of the sheet metal is possible, and a plurality of vibration frequencies from a maximum frequency to a minimum frequency at which cutting of the sheet metal is possible are set to a moving velocity more than or equal to a minimum moving velocity and less than the maximum moving velocity at which cutting of the sheet metal is possible.

A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.