Patent classifications
B23K26/0648
Systems and methods for laser systems with variable beam parameter product utilizing thermo-optic effects
In various embodiments, a beam-parameter adjustment system and focusing system alters a spatial power distribution of a radiation beam, via thermo-optic effects, before the beam is coupled into an optical fiber or delivered to a workpiece.
Laser oscillator, laser machining device in which same is used, and laser oscillation method
A laser oscillator includes a plurality of laser modules, beam coupler (12) that couples a plurality of laser beams (LB1 to LB4) emitted from the plurality of laser modules to form a coupled laser beam, beam coupler (12) emitting the coupled laser beam, and a condensing lens unit having a condensing lens, the condensing lens unit condensing the coupled laser beam to have a given beam diameter and guiding the condensed coupled laser beam to a transmission fiber. Beam coupler (12) has optical members (OC1 to OC4) configured to change optical paths of laser beams (LB1 to LB4). By changing the optical paths of laser beams (LB1 to LB4) by optical members (OC1 to OC4,) a beam profile of the coupled laser beam emitted from the transmission fiber is changed without adjusting a position of the condensing lens.
Laser processing apparatus and laser processing method
A laser processing apparatus includes: a chuck table for holding a single-crystal SiC ingot on a holding surface thereof; a laser beam applying unit for applying a laser beam to the single-crystal SiC ingot held on the holding surface of the chuck table; and a camera unit configured to capture an image of the single-crystal SiC ingot held on the holding surface of the chuck table. The chuck table includes a porous material making up the holding surface and a glass frame made of a non-porous material and having a recess defined therein and receiving the porous material fitted therein, and a negative pressure transfer path for transferring a negative pressure to the porous material fitted in the recess.
Laser processing head, laser processing device, and method for adjusting laser processing head
A laser processing head includes a laser irradiation part, a collimating optical system for collimating laser light from the laser irradiation part, and a collecting optical system for collecting the laser light after passing through the collimating optical system. An optical system including the collimating optical system and the collecting optical system is configured such that the laser light after passing through the collecting optical system has coma aberration. The laser processing head further includes a first moving part for moving at least one of the laser irradiation part or the collimating optical system so as to change a relative position of the collimating optical system with respect to the laser irradiation part, in a first direction orthogonal to a center axis of the laser irradiation part or the collimating optical system, and a second moving part for moving the collecting optical system so as to change a relative position of the collecting optical system with respect to the collimating optical system, in a second direction orthogonal to a center axis of the collecting optical system.
Rotating light source utilized to modify substrates
A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.
Mask-free photolithography using metastable undercooled metal particles
Various embodiments relate to forming particles using undercooled metal particles in response to focused low power laser light. Particle growth can be initiated by utilizing the metastable and liquid nature of the particles, allowing for surface instability promoted by the laser light to induce liquid flow to translate to a neighboring particle. This event can cascade radially leading to accumulation of the liquid metal at the epicenter. The grown solidified particle size can be varied by using different power, exposure time, or working distance. Once the liquid has accumulated into a single region, it eventually solidifies either through homogeneous or heterogeneous nucleation to give a solid particle of larger size than the original. Such a method can be used to print patterns on a surface in four dimensions, where the fourth dimension (4D) is attained through gradient in size of the particles made. Additional systems and methods are disclosed.
MODULE FOR ADDITIVE MANUFACTURING APPARATUS
This invention concerns a module for insertion into an additive manufacturing apparatus. The module comprising a frame mountable in a fixed position in the additive manufacturing apparatus, the frame defining a build chamber and a dosing chamber. A build platform is movable in the build chamber for supporting a powder bed during additive manufacturing of a part. A dosing piston is movable in the dosing chamber to push powder from the dosing chamber. A mechanism mechanically links the build platform to the dosing piston such that downward movement of the build platform in the build chamber results in upward movement of the dosing piston in the dosing chamber.
LASER PROCESSOR, LASER PROCESSING SYSTEM, AND METHOD FOR MOUNTING CARTRIDGE
A laser processor includes a machining head and a cartridge configured to be inserted in the machining head. The machining head includes an optical path of a laser beam, a pressing member, and a stopper surface. The cartridge is configured to be pressed along the optical path toward the stopper surface by the pressing member when the cartridge is in the machining head. The cartridge includes an optical component configured to be positioned in the optical path when the cartridge is in the machining head. The optical component has a first surface and a second surface opposite to the first surface along the optical path, a first member configured to contact the first surface of the optical component and the pressing member, and a second member configured to contact the second surface of the optical component and the stopper surface.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object, and a control unit configured to control at least the irradiation unit and the image capturing part. A plurality of lines is set in the object. The control unit performs a first process of irradiating the object with the laser light for each of the plurality of lines by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object.
HANDHELD LASER MACHINING APPARATUS FOR MACHINING A WORKPIECE, AND FUNNEL FOR A HANDHELD LASER MACHINING APPARATUS
The invention relates to a handheld laser machining apparatus for machining a workpiece. The laser machining apparatus comprises a handheld apparatus (100) comprising an optical device for deflecting laser beams onto the workpiece, a supply unit (3) for open-loop or closed-loop control of the handheld device and/or for supplying power/fluid to the handheld device and a funnel (4) for coupling the handheld device to the workpiece. The invention also relates to a funnel (4) for a corresponding laser machining apparatus.