A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in the X direction.

A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

Laser device (100) includes first and second laser oscillators (1), (2) that respectively emit first and second laser lights (LB1), (LB2) having first and second wavelengths, and first and second optical systems (10), (20). First optical system (10) is configured to couple first and second laser lights (LB1), (LB2) to transmit the first and second laser lights to second optical system (20), and second optical system (20) is configured to condense first laser light (LB1) at first condensing position (FP1) and second laser light (LB2) at second condensing position (FP2). A maximum angle formed by an optical axis and an outermost component of first laser light (LB1) emitted from first optical system (10) is different from a maximum angle formed by an optical axis and an outermost component of the second laser light (LB2).

A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first processing step as a perforation laser, with which a perforation (12) is produced in the glass element (2) along an intended cutting line (8), whereby the processing laser (4) is operated in a second processing step with a modified laser beam (14) as a separating laser, with which a splitting of the filaments (6) forming the perforation (12) is effected.

The present application relates to an apparatus (10) for laser processing, comprising at least two laser sources, which are different from one another and are configured for supplying respective laser beams having wavelengths different from one another, a laser head (20), which can be operated as end tool of a laser machine tool (90) that can be configured for carrying out at least one type of laser processing operation that can be selected from a set of types of laser processing operations, and a set of orientable optical components (16) so as to provide a set of selectable optical paths for directing a laser beam supplied by a laser source of said at least two laser sources, and a control unit (30) coupled to the at least two laser sources, to the set of orientable optical components (16), and to the laser head (20) and configured for controlling the at least two laser sources, the set of orientable optical components (16), and the laser head (20) according to the type of laser processing operation selected from the set of types of laser processing operations, i.e., so as to supply and direct a laser beam associated to the respective type of processing operation onto a region of a work surface (110). The laser head (20) comprises a set of nozzles (40, 42, 44, 46) configured for directing at least one processing material onto the working region (110), which comprises at least one nozzle (40) configured for directing jets of powder of at least one material, preferably powder of metal material (in brief metal powder), as well as comprising at least one of the following: a) a first nozzle (42) configured for directing a metal wire onto the working region, preferably metal wire for laser welding; and b) a second nozzle (46) configured for directing an assist gas onto the working region, preferably an assist gas for laser welding, and wherein the control unit (30) is coupled to the set of nozzles and is configured for controlling at least one nozzle of said set of nozzles (40, 42, 44, 46) according to the type of associated and selected laser processing operation so as to control said at least one nozzle so that it will direct respective processing materials onto the working region (110) simultaneously with direction of the laser beam (L) associated to the type of laser processing operation selected.

A laser module includes a laser source and at least one air knife. The laser source is configured to be coupled to a robotic arm of a robotic device, and emit a laser beam for processing a workpiece having a workpiece surface. The air knife is configured to be coupled to the robotic arm, and discharge an airflow sheet in a direction toward a laser spot where the laser beam impinges the workpiece surface, for clearing contaminants generated by impingement of the laser beam.

A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.

Provided is a laser processing device for forming a modified region by irradiating an object with laser light. The device includes a support portion configured to support the object, a laser irradiation unit configured to irradiate the object supported by the support portion with the laser light, a moving mechanism that moves at least one of the support portion and the laser irradiation unit such that a converging point of the laser light relatively moves with respect to the object, and a control unit that controls the laser irradiation unit and the moving mechanism. A first line extending along a first direction and a second line extending along a second direction intersecting the first direction and extending beyond the first line when viewed from a direction intersecting an incident surface of the laser light are set in the object.

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.