The present invention is related to a thermal laser evaporation system (10), the thermal laser evaporation system (10) comprising: a laser light source (30) for providing a thermal laser beam (34) for evaporating one or more materials (22) from a source (20); a thermal laser beam shaping system (40) comprising a collimation lens (42) and a focusing lens (44) for directing the thermal laser beam (34) onto the source (20); a vacuum chamber (12); a vacuum window (14) for conducting the thermal laser beam (34) into the vacuum chamber (12); and an aperture (16) arranged within the vacuum chamber (12) between the vacuum window (14) and the source (20).

Further, the present invention is related to a method of providing a thermal laser beam (34) at a source (20) in order to evaporate one or more materials (22) from the source (20); the method comprising the steps of: providing a thermal laser beam (34); directing the thermal laser beam (34) via a thermal laser beam shaping system (40) comprising a collimation lens (42), a shaping device (60) and a focusing lens (44) into a vacuum chamber (12) comprising a vacuum window (12) for conducting the thermal laser beam (34) into the vacuum chamber (12) and through an aperture (16) arranged within the vacuum chamber (12) at the source (20).

A processing apparatus is a processing apparatus that processes an object by a processing light from a processing light source, includes a first optical system that condenses the processing light from the processing light source on a condensed plane; and a second optical system that condenses the processing light from the first optical system to irradiate the object with it, a position in the condensed plane through which the processing light passes is changeable, a propagating direction of the processing light propagating from the first optical system to the second optical system changes depending on the position in the condensed plane through which the processing light passes.

Systems and methods for cutting objects within a subterranean well include a laser system having a laser drilling head located at a terminal downhole end of a laser tool body directing a head laser beam in a direction downhole. A laser scanner assembly located within the laser tool body has a scanner head directing a scanner laser beam and can move both axially along a length of the laser tool body and rotate around a central axis of the laser tool body. A laser cutter assembly located within the laser tool body has a cutter head directing a cutter laser beam and can rotate around the central axis of the laser tool body. A cable bundle formed of a plurality of fiber optic cables extends from an uphole end of the laser tool body to each of the laser drilling head, the laser scanner assembly, and the laser cutter assembly.

A manufacturing device for additive manufacturing of component parts from a powder material includes a beam producing device, a scanner device configured to displace an energy beam to a plurality of irradiation positions, a deflection device configured to displace the energy beam at an irradiation position to a plurality of beam positions, and a control device configured to control the deflection device and to produce a specific intensity profile in the beam region. The control device does this by dividing and displacing the energy beam to at least two beam positions separated by a distance that is variably settable and/or by displacing the energy beam and by specifying at least one operating parameter of the deflection, such as a residence time at a beam position, a beam position density distribution, a frequency distribution, and an intensity influencing parameter of the energy beam deflected to the beam positions.

A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generating, based on analysis of the conductor layer, classification of the circuits, inputting, to the machine, shot numbers for forming the openings determined based on the classification, and executing the machine based on the positions and shot numbers such that the openings are formed. The circuits include power supply, ground, and signal circuits, the classification includes stratifying such that the power supply and ground circuits belong to the first category and the signal circuits belong to the second category, and the inputting includes setting the shot number for the openings belonging to the first category is smaller than the shot number for the openings belonging to the second category.

A controlled thermal coefficient product manufacturing system and method is disclosed. The disclosed product relates to the manufacture of metallic material product (MMP) having a thermal expansion coefficient (TEC) in a predetermined range. The disclosed system and method provides for a first material deformation (FMD) of the MMP that comprises at least some of a first material phase (FMP) wherein the FMP comprises martensite randomly oriented and a first thermal expansion coefficient (FTC). In response to the FMD at least some of the FMP is oriented in at least one predetermined orientation. Subsequent to deformation, the MMP comprises a second thermal expansion coefficient (STC) that is within a predetermined range and wherein the thermal expansion of the MMP is in at least one predetermined direction. The MMP may be comprised of a second material phase (SMP) that may or may not transform to the FMP in response to the FMD.

An optical device may include a fiber to provide a beam. The optical device may include a graded-index element to expand or magnify the beam. An input facet of the graded-index element may be adhered to an output facet of the fiber. The optical device may include an optical transformation element to transform the beam after the beam is expanded or magnified by the graded-index element. An input facet of the optical transformation element may be adhered to an output facet of the graded-index element.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

A method using femtosecond laser for nano precision preparation. Initial damage nanoholes formed by using femtosecond laser multiphoton excitation are used as a seed structure, and the energy and polarization state of subsequent laser pulses are adjusted in real time, such that uniform and directional optical near-field enhancement is generated near the seed structure and finally the high-precision removal of machined materials is realized. Benefiting from the high localization of near-field spot energy in space, the method uses femtosecond laser pulses having the wavelength of 800 nm to achieve a machining accuracy having the minimum linewidth of only 18 nm, and the linewidth resolution reaches 1/40 of the wavelength; and the method using femtosecond laser for nano precision preparation does not need a vacuum environment, having good air/solution machining compatibility.