Optomechanical tools are disclosed. The optomechanical tools include a body of material having an entrance face, a rake face, a flank face, a rake side face, and a flank side face. The rake side face and the flank side face are connected to the entrance face. The rake side face is connected to the rake face. The flank side face is connected to the flank face. The rake face is connected to the flank face to define a curved cutting edge. The entrance face extends away from the flank side face to define a back-relief angle. The rake face extends away from the rake side face to define a rake angle. The entrance face is configured to direct a light beam toward one or more of the rake face, the flank face, the rake side face, the flank side face, and the curved cutting edge and through one or more of the rake face, the flank face, and the curved cutting edge, causing the light beam to refract onto the workpiece. Systems are also disclosed. Methods for transmitting a light beam through an optomechanical tool are also disclosed.

An F-theta lens includes a diffractive optical element and a plurality of spherical lenses. The diffractive optical element includes multi-level diffractive structure having three or more levels and defined on a surface thereof, and the diffractive optical element is arranged before the spherical lenses on a path of a laser beam.

A beam homogenizer for surface modification comprises: a first lens array configured to split a laser beam, irradiated from a laser beam irradiation unit, into a plurality of beamlets; a second lens array configured to transmit the plurality of beamlets and comprising a plurality of lenslets corresponding to the first lens array; and a focusing lens configured to focus the plurality of beamlets, transmitted through the second lens array, onto a surface of a target. The beam homogenizer further comprises: a plasma generation-preventing unit disposed between the first and second lens arrays and configured to prevent plasma from being generated in the focal zone of the beamlets; or a damage-preventing unit disposed between the focusing lens and the target and configured to prevent the focusing lens from being damaged by energy generated when the plurality of beamlets is irradiated onto the target.

A welding method includes: forming a workpiece by stacking plated sheet members having a plating layer formed on a surface of a base material; disposing the workpiece in an area to be irradiated with laser light; irradiating a surface of the workpiece with a plurality of beams by dispersing positions such that centers of the beams do not overlap with each other within a prescribed area on the surface; while continuing the irradiation, relatively moving the beams and the workpiece and sweeping the beams on the workpiece so as to melt an irradiated part of the workpiece for performing welding; and setting a distance between the beams to be emitted such that weld pools formed in the workpiece by irradiation of each of the beams overlap with each other.

A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the a first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.

The present invention relates to a method for laser-based machining of a planar, crystalline substrate in order to separate the substrate into a plurality of parts, in which the laser beam of a laser is directed, for machining the substrate, onto the latter, in which, with an optical arrangement positioned in the beam path of the laser, a laser beam focal surface which is expanded, viewed both along the beam direction and viewed in precisely a first direction perpendicular to the beam direction, but is not expanded in a second direction which is both perpendicular to the first direction and to the beam direction, is formed from the laser beam radiated onto said arrangement on the beam output side of the optical arrangement, the substrate being positioned relative to the laser beam focal surface such that the laser beam focal surface in the interior of the substrate, along an expanded surface portion of the substrate material, produces an induced absorption by means of which crack formations in the substrate material induced along this expanded surface portion are effected.

Disclosed is a system for efficiently cutting a transparent substrate. The system includes a laser source in optical communication with at least one multi-foci optical system. The laser source outputs at least one optical signal to the optical system. The optical system is positioned between the laser source and the substrate to be cut. The optical system includes at least one housing detachably coupled to at least one base member. One or more plate members having one or more apertures formed therein may be coupled to at least one of the housing, the baser member, or both. The aperture formed on the plate member may be configured to permit the optical signal to enter and exit the optical system. Various optical subassemblies may be positioned within or coupled to the optical system.

A high power laser system for providing laser beams in various laser beam patterns along a laser beam path that is positioned to provide for the in situ laser processing of materials in tubulars, such as pipes in a hydrocarbon producing well. Laser treating for providing flow assurance by direct and indirect laser processing of materials interfering with flow.

An optical arrangement for direct laser interference structuring, a laser beam is directed to a reflecting element with inclined surface and strikes a first beam splitter, is divided into two partial beams and one partial beam is deflected to a focusing optical element. The second partial beam is directed to a first pentamirror and, after multiple reflection and/or refraction, the focusing optical element, or it is directed to a second beam splitter, and it is divided into a first partial beam of the second partial beam and a third partial beam. Said partial beams are directed to the focusing element by the first pentamirror and partial beams are directed by the focusing optical element to the surface to be structured interfering with each other. The reflecting element is moved in a translational manner, maintaining a 45 angle, parallel to the optical axis of the laser beam emitted by the laser beam source, influencing the interference period A.

A laser processing device configured to emit laser light on an object to perform laser processing of the object, the laser processing device including: a laser output unit configured to output the laser light; a spatial light modulator configured to reflect the laser light output from the laser output unit while modulating the laser light in accordance with a phase pattern; and an objective lens configured to converge the laser light from the spatial light modulator toward the object, in which the spatial light modulator includes an entrance surface, a reflective surface, and a modulation layer configured to display the phase pattern to modulate the laser light, and a dielectric multilayer film having a high reflectance region in a plurality of wavelength bands non-contiguous with each other is formed on the reflective surface.