A laser apparatus may include a spectrum controller and a spectrum modulator. The spectrum controller may control a center wavelength and/or a bandwidth of a spectrum of a laser beam. The spectrum modulator may modulate the spectrum of the laser beam having the center wavelength and/or the bandwidth controlled by the spectrum controller. Thus, the laser beam may have the spectrum optimal for a semiconductor fabrication process. Particularly, the substrate may be accurately diced using the laser beam having the optimal spectrum.

A functional member includes: a plurality of microneedles on a surface. Further, the microneedles adjacent to each other are spaced apart by a pitch ranging from 1 to 500 m, and the microneedles have a diameter ranging from 0.25 to 250 m and have a height ranging from 5 to 200 m.

A spatial light modulator (SLM) including a two-dimensional (2D) array of n rows of m pixels, and a stacked drive circuit including at least one, one-dimensional (1D) array of n*m drivers monolithically integrated on the same substrate and methods of fabricating and methods of using the same in materials processing applications are provided. Generally, each pixel includes at least one modulator, and is configured to modulate light incident thereon in response to drive signals received from the stacked drive circuit. The 1D array of the stacked drive circuit includes a single row of n*m drivers arranged adjacent to and laterally separated from the 2D array of pixels. Other embodiments are also described.

A system and method for automated laser ablation includes an end effector for performing laser ablation at a location with restricted access. The systems and methods of the present disclosure specifically provide for a miniature laser end effector which may be inserted through a port or bore in order to ablate the surface of an internal component of a complex assembly. In several embodiments of the present subject matter, the end effector is mounted on an automated machine and coupled to a laser system.

Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.

The invention relates to a beam forming lens system for machining material using a laser beam, comprising a two-dimensional axicon array (10) featuring a plurality of microaxicons (11) for creating an annular laser beam intensity profile, the microaxicons (11) being provided with curved lateral surfaces (113). The invention also relates to an apparatus for machining material using a laser beam, comprising a beam forming lens system of said type and a focusing lens system (15) for focusing the laser beam onto a workpiece (18). The beam forming lens system is designed to create the annular laser beam intensity profile in a focal plane (F) of the focusing lens system (15).

A profile selector includes at least one beam-forming lens refracting a laser beam to be incident so as to convert a beam profile and emits a laser beam having a beam profile selected from a plurality of beam profiles. A collimating lens converts a laser beam of a divergent beam to be incident into collimated light. A focusing lens focuses the collimated light emitted from the collimating lens and irradiates the focused beam to a sheet metal of a processing target. A moving mechanism moves the collimating lens along an optical axis such that a deviation of a focal point is reduced caused when the beam profile of the focused beam emitted from the focusing lens is selected by the profile selector.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

A laser apparatus may include a laser generator generating at least one a laser beam, which is used as an input light, an optical system converting the input light, which is provided from the laser generator, into a plurality of pattern lights, and a stage, on which a target object is loaded. The output light may be irradiated onto the target object. The optical system may divide the input light into a plurality of divided lights, and the pattern lights may be produced by constructive interference of the plurality of divided lights. A diameter of each of the pattern lights may be smaller than a diameter of the input light.