A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

A substrate manufacturing method of manufacturing a substrate from a workpiece is disclosed. A laser beam is first split and condensed to form a plurality of focal points aligned side by side along a first direction, and with the focal points positioned inside the workpiece, the focal points and the workpiece are moved relative to each other along a second direction orthogonal to the first direction such that a separation layer is formed. A region of the focal points and the workpiece are then moved relative to each other along the first direction. These relative movements are alternately and repeatedly performed. The splitting and condensation of the laser beam are performed such that a volume expansion of the workpiece associated with the formation of the modified regions is relatively small in the vicinity of at least one focal point formed on a center side.

A laser tool, in particular for the structuring of cylinder running surfaces, that offers the possibility of guiding the laser beam of the laser tool with high process reliability, it is provided that the laser tool has a laser source for producing laser beams that are passed through a lens tube located in a hollow shaft, wherein a lens through which the laser beams are passed is attached to the lens tube, wherein the hollow shaft is designed to be rotatable as a hollow-shaft motor, wherein a spindle, to which is attached an optical device for deflecting the laser beam onto a workpiece surface, is attached to the hollow shaft, wherein the hollow shaft is rotatable independently of the lens.

An arrangement in which an angular prism is formed with two triangular part prisms which are connected to one another by a layer having properties splitting at least one laser beam into part beams. The two part prisms have two identical acute angles α. The laser beam is directed onto an outward-facing surface of one of the two part prisms. The at least one laser beam is split into two part beams by the reflection of a part of the radiation by the layer and transmission of a further part of the radiation through the layer. The part beams are each incident on an outward-facing surface, are reflected there and exit from the part prisms and are incident on at least one optical element and are aligned such that they interfere with one another in a region of a component in which a structural pattern is intended to be formed.

A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.

A processing apparatus is a processing apparatus that processes an object by a processing light from a processing light source, includes a first optical system that condenses the processing light from the processing light source on a condensed plane; and a second optical system that condenses the processing light from the first optical system to irradiate the object with it, a position in the condensed plane through which the processing light passes is changeable, a propagating direction of the processing light propagating from the first optical system to the second optical system changes depending on the position in the condensed plane through which the processing light passes.

A manufacturing device for additive manufacturing of component parts from a powder material includes a beam producing device, a scanner device configured to displace an energy beam to a plurality of irradiation positions, a deflection device configured to displace the energy beam at an irradiation position to a plurality of beam positions, and a control device configured to control the deflection device and to produce a specific intensity profile in the beam region. The control device does this by dividing and displacing the energy beam to at least two beam positions separated by a distance that is variably settable and/or by displacing the energy beam and by specifying at least one operating parameter of the deflection, such as a residence time at a beam position, a beam position density distribution, a frequency distribution, and an intensity influencing parameter of the energy beam deflected to the beam positions.

A method using femtosecond laser for nano precision preparation. Initial damage nanoholes formed by using femtosecond laser multiphoton excitation are used as a seed structure, and the energy and polarization state of subsequent laser pulses are adjusted in real time, such that uniform and directional optical near-field enhancement is generated near the seed structure and finally the high-precision removal of machined materials is realized. Benefiting from the high localization of near-field spot energy in space, the method uses femtosecond laser pulses having the wavelength of 800 nm to achieve a machining accuracy having the minimum linewidth of only 18 nm, and the linewidth resolution reaches 1/40 of the wavelength; and the method using femtosecond laser for nano precision preparation does not need a vacuum environment, having good air/solution machining compatibility.

A device for machining material by means of laser radiation, including a focusing optics for focusing a laser beam onto a workpiece and an adjusting optics for adjusting the intensity distribution comprising at least two plate-shaped optical elements which are arranged one behind the other in the beam path of the laser beam, which are rotatable relative to one another in the circumferential direction, and which each have a surface with a circular pattern of sector-shaped facets which, in the circumferential direction, are alternately inclined with respect to the respective plate plane.

Systems, devices, and techniques for creating blind annular vias for metallized vias are described. For example, a vortex beam may be applied to an optically transmissive substrate, where the vortex beam may modify a portion of the substrate in an annular shape. The annular shape may extend from a surface of the substrate to a depth that is less than a thickness of the substrate, and the annular shape may have an annular width (e.g., a ring width) that is the same for various diameters of the annular shape. A blind annular via may be formed by etching the modified portion of the substrate, where the blind annular via may include a pillar comprising the same material as the surrounding substrate. In addition, a metallized annular via may be created by filling the blind annular via with a conductive material, and removing a portion of the substrate opposite the surface.