Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam. The mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam. The mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

A maintenance management method for a lithography system according to a viewpoint of the present disclosure includes organizing and saving operating information for each of lithography cells that are each an apparatus group formed of a set of apparatuses and form the lithography system, organizing and saving maintenance information on consumables for each of the lithography cells, calculating a standard maintenance timing for each of the consumables for each of the lithography cells based on the operating information and the maintenance information on the consumable for each of the lithography cells, creating a maintenance schedule plan for each of the lithography cells or for each of manufacturing lines based on the standard maintenance timing, information on a downtime, and information on a loss cost due to the downtime for each of the lithography cells or for each of the manufacturing lines, and outputting the result of the creation of the maintenance schedule plan.

A method for processing a transparent workpiece includes generating a beam of radiation and forming a defect in or on an object. The beam is a quasi-non-diffracting beam and has a focal volume. Forming the defect includes directing the beam onto the object and positioning the focal volume partially or fully within the object. Generating the beam includes partially blocking the beam upstream of the focal volume to adjust an axial symmetry of the freeform energy distribution with respect to an optical axis of the beam using an adjustable blocking element and/or spatially modulating a phase of the beam upstream of the focal volume to adjust a geometry of the freeform energy distribution using a phase mask. The freeform energy distribution has energy sufficient to induce multi-photon absorption in a region of the object that is co-located with the focal volume. The induced multi-photon absorption produces the defect.

A laser processing device for generating a plurality of grooves in a surface comprises an optical diffraction arrangement adapted to receive a laser radiation and to generate an output radiation hereupon, the output radiation having a plurality of intensity maxima. An actuator arrangement is provided for generating a relative movement between the output radiation and the surface, wherein each intensity maximum generates a groove of the plurality of grooves.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A laser reflow method includes a preparation step of preparing a workpiece including a board and semiconductor chips that each have bumps formed on one surface thereof and are placed on the board with the bumps interposed therebetween and a laser beam irradiation step of irradiating the semiconductor chips with a laser beam from a side of another surface opposite to the one surface, thereby reflowing bumps formed within an irradiated area of the workpiece. In the laser beam irradiation step, the irradiation with the laser beam is carried out while an irradiation range of the laser beam is changed in stages from a region including an outer peripheral portion of the irradiated area toward a region including a central portion of the irradiated area.

Embodiments of the present disclosure are directed to methods, systems and devices, for precise and reduced spot-size capabilities using a laser to alter surfaces without chemical treatment, chemical waste, or chemical residues is provided for microfluidic systems (e.g., lab-on-a-disk, for example). In some embodiments, hydrophobic and super-hydrophilic areas can be created on surfaces in the same material at different areas and positions merely by using different laser settings (e.g., spot size, wavelength, spacing, and/or pulse duration). Accordingly, capillary forces that are a recurrent issue in a microfluidic devices (e.g., a centrifugal microfluidic disk) can be controlled for practical applications, including, for example when users handle the disks and insert a sample, the moment the substrate/device (e.g., disk) is placed in a system (e.g., a centrifugal system), capillary forces can take place and move the fluids, which becomes a problem for sequential bioassays taking place in substrate/device (e.g., disk). Thus, in some embodiments, the systems, devices and methods increase fluid control in microfluidic devices.

Embodiments of the present disclosure are directed to methods, systems and devices, for precise and reduced spot-size capabilities using a laser to alter surfaces without chemical treatment, chemical waste, or chemical residues is provided for microfluidic systems (e.g., lab-on-a-disk, for example). In some embodiments, hydrophobic and super-hydrophilic areas can be created on surfaces in the same material at different areas and positions merely by using different laser settings (e.g., spot size, wavelength, spacing, and/or pulse duration). Accordingly, capillary forces that are a recurrent issue in a microfluidic devices (e.g., a centrifugal microfluidic disk) can be controlled for practical applications, including, for example when users handle the disks and insert a sample, the moment the substrate/device (e.g., disk) is placed in a system (e.g., a centrifugal system), capillary forces can take place and move the fluids, which becomes a problem for sequential bioassays taking place in substrate/device (e.g., disk). Thus, in some embodiments, the systems, devices and methods increase fluid control in microfluidic devices.