B23K26/066

Jig for spot welding

A spot welding jig is provided. The spot welding jig presses electrode leads of battery cells to be closely adhered onto a bus bar when spot welding is performed to the electrode leads interposed on the bus bar along a width direction of the electrode leads. The spot welding jig includes a passing portion through which a welding laser passes, and a predetermined number of barriers configured to vertically partition an inner space of the passing portion.

Protective film forming agent and method for producing semiconductor chip
11407063 · 2022-08-09 · ·

A protective film forming agent for dicing of semiconductor wafers for forming a protective film on the surface of the semiconductor wafers and capable of forming a protective film of high absorbance index, and a production method of semiconductor chips using the protective film forming agent. In a protective film forming agent containing a water-soluble resin, light absorber and solvent, a compound having a specific structure is used as the light absorber. The content of the light absorber in the protective film forming agent is 0.1% by mass or more and 10% by mass or less.

Protective film forming agent and method for producing semiconductor chip
11407063 · 2022-08-09 · ·

A protective film forming agent for dicing of semiconductor wafers for forming a protective film on the surface of the semiconductor wafers and capable of forming a protective film of high absorbance index, and a production method of semiconductor chips using the protective film forming agent. In a protective film forming agent containing a water-soluble resin, light absorber and solvent, a compound having a specific structure is used as the light absorber. The content of the light absorber in the protective film forming agent is 0.1% by mass or more and 10% by mass or less.

Laser Marking System and Method

A laser marking system including a spatial light modulator (SLM) with a multi-pixel, linear array of is microelectromechanical systems (MEMS) based diffractors, and methods of operating the same are disclosed. Generally, the system includes, in addition to the SLM, a laser operable to illuminate the SLM; imaging optics operable to focus a substantially linear swath of modulated light onto a surface of a workpiece, the linear swath including light from multiple pixels of the SLM, and a controller operable to control the SLM, laser and imaging optics to mark the surface of the workpiece to record a two-dimensional image thereon. In one embodiment, the diffractors include a number of electrostatically deflectable ribbons suspended over a substrate. In another, each diffractor is two-dimensional including an electrostatically deflectable first reflective operable to brought into optical interference with light reflected from a second reflective surface on a faceplate, or an adjacent diffractor.

METHODS FOR ESTABLISHING HYDROPHILIC AND HYDROPHOBIC AREAS ON A SURFACE OF A SUBSTRATE OR FILM AND ASSOCIATED MICROFLUIDIC DEVICES

Embodiments of the present disclosure are directed to methods, systems and devices, for precise and reduced spot-size capabilities using a laser to alter surfaces without chemical treatment, chemical waste, or chemical residues is provided for microfluidic systems (e.g., lab-on-a-disk, for example). In some embodiments, hydrophobic and super-hydrophilic areas can be created on surfaces in the same material at different areas and positions merely by using different laser settings (e.g., spot size, wavelength, spacing, and/or pulse duration). Accordingly, capillary forces that are a recurrent issue in a microfluidic devices (e.g., a centrifugal microfluidic disk) can be controlled for practical applications, including, for example when users handle the disks and insert a sample, the moment the substrate/device (e.g., disk) is placed in a system (e.g., a centrifugal system), capillary forces can take place and move the fluids, which becomes a problem for sequential bioassays taking place in substrate/device (e.g., disk). Thus, in some embodiments, the systems, devices and methods increase fluid control in microfluidic devices.

METHODS FOR ESTABLISHING HYDROPHILIC AND HYDROPHOBIC AREAS ON A SURFACE OF A SUBSTRATE OR FILM AND ASSOCIATED MICROFLUIDIC DEVICES

Embodiments of the present disclosure are directed to methods, systems and devices, for precise and reduced spot-size capabilities using a laser to alter surfaces without chemical treatment, chemical waste, or chemical residues is provided for microfluidic systems (e.g., lab-on-a-disk, for example). In some embodiments, hydrophobic and super-hydrophilic areas can be created on surfaces in the same material at different areas and positions merely by using different laser settings (e.g., spot size, wavelength, spacing, and/or pulse duration). Accordingly, capillary forces that are a recurrent issue in a microfluidic devices (e.g., a centrifugal microfluidic disk) can be controlled for practical applications, including, for example when users handle the disks and insert a sample, the moment the substrate/device (e.g., disk) is placed in a system (e.g., a centrifugal system), capillary forces can take place and move the fluids, which becomes a problem for sequential bioassays taking place in substrate/device (e.g., disk). Thus, in some embodiments, the systems, devices and methods increase fluid control in microfluidic devices.

Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beam

A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beam

A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

Second surface laser ablation

A laser ablated product exhibits a diffraction severity of less than about 5. The product may include a substrate that is at least partially transparent to visible light, and a periodic structure formed on at least one surface of the substrate by laser ablation. The periodic structure has a period in at least one direction of at least about 4,500 nm to at most about 850,000 nm, and the periodic structure has a peak-to-valley dimension of less than about 25 nm. The product may be employed in an electrochromic device, such as a vehicle rearview mirror assembly.

Second surface laser ablation

A laser ablated product exhibits a diffraction severity of less than about 5. The product may include a substrate that is at least partially transparent to visible light, and a periodic structure formed on at least one surface of the substrate by laser ablation. The periodic structure has a period in at least one direction of at least about 4,500 nm to at most about 850,000 nm, and the periodic structure has a peak-to-valley dimension of less than about 25 nm. The product may be employed in an electrochromic device, such as a vehicle rearview mirror assembly.