A mask repairing apparatus may include a stage, a stereoscopic imaging unit to measure a stereoscopic image of a mask on the stage, a control unit to compare the stereoscopic image with a normal image of the mask and to produce a defect image of the mask, and a laser unit to irradiate a laser beam onto a deficient part of the mask, under control of the control unit. The control unit may control the laser unit, based on the defect image, such that the laser beam is sequentially irradiated onto m multiple layers of the deficient part while repeatedly moving in a first direction and a second direction crossing each other.

A mask repairing apparatus may include a stage, a stereoscopic imaging unit to measure a stereoscopic image of a mask on the stage, a control unit to compare the stereoscopic image with a normal image of the mask and to produce a defect image of the mask, and a laser unit to irradiate a laser beam onto a deficient part of the mask, under control of the control unit. The control unit may control the laser unit, based on the defect image, such that the laser beam is sequentially irradiated onto m multiple layers of the deficient part while repeatedly moving in a first direction and a second direction crossing each other.

An apparatus and a method for forming alignment marks are disclosed. The method for forming alignment marks is a photolithography-free process and includes the following operations. A laser beam is provided. The laser beam is divided into a plurality of laser beams separated from each other. The plurality of laser beams is shaped into a plurality of patterned beams, so that the plurality of patterned beams is shaped with patterns corresponding to alignment marks. The plurality of patterned beams is projected onto a semiconductor wafer.

A diffractive optical beam shaping element for imposing a phase distribution on a laser beam that is intended for laser processing of a material includes a phase mask that is shaped as an area and is configured for imposing a plurality of beam shaping phase distributions on the laser beam incident on to the phase mask. A virtual optical image is attributed to at least one of the plurality of beam shaping phase distributions, wherein the virtual image can be imaged into an elongated focus zone for creating a modification in the material to be processed. Multiple such elongated focus zones can spatially add up and interfere with each other, to modify an intensity distribution in the material and, for example, generate an asymmetric modification zone.

A diffractive optical beam shaping element for imposing a phase distribution on a laser beam that is intended for laser processing of a material includes a phase mask that is shaped as an area and is configured for imposing a plurality of beam shaping phase distributions on the laser beam incident on to the phase mask. A virtual optical image is attributed to at least one of the plurality of beam shaping phase distributions, wherein the virtual image can be imaged into an elongated focus zone for creating a modification in the material to be processed. Multiple such elongated focus zones can spatially add up and interfere with each other, to modify an intensity distribution in the material and, for example, generate an asymmetric modification zone.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.