A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system that shapes laser light such that a first laser light irradiated region of a mask blocking part of the laser light has a rectangular shape having short edges and long edges, the beam shaping optical system capable of causing one of a first radiation width of the first irradiated region in the direction parallel to the short edges and a second radiation width of the first irradiated region in the direction parallel to the long edges to be fixed and causing the other to be changed, a projection optical system that projects a pattern on the mask onto the workpiece, and a mover that moves the first irradiated region at least in the direction parallel to the short edges to move a second laser light irradiated region of the workpiece.

A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system that shapes laser light such that a first laser light irradiated region of a mask blocking part of the laser light has a rectangular shape having short edges and long edges, the beam shaping optical system capable of causing one of a first radiation width of the first irradiated region in the direction parallel to the short edges and a second radiation width of the first irradiated region in the direction parallel to the long edges to be fixed and causing the other to be changed, a projection optical system that projects a pattern on the mask onto the workpiece, and a mover that moves the first irradiated region at least in the direction parallel to the short edges to move a second laser light irradiated region of the workpiece.

A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system configured to shape laser light in such a way that a laser light irradiated region of a mask configured to block part of the laser light has a rectangular shape having short edges and long edges, a second radiation width of the irradiated region in the direction parallel to the long edges being changeable independently of a first radiation width of the irradiated region in the direction parallel to the short edges, and the irradiated region being movable in the direction parallel to the long edges, a projection optical system configured to project a pattern of the mask on the workpiece placed on the placement base, and a mover configured to be capable of moving the irradiated region in the direction parallel to the short edges.

A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system configured to shape laser light in such a way that a laser light irradiated region of a mask configured to block part of the laser light has a rectangular shape having short edges and long edges, a second radiation width of the irradiated region in the direction parallel to the long edges being changeable independently of a first radiation width of the irradiated region in the direction parallel to the short edges, and the irradiated region being movable in the direction parallel to the long edges, a projection optical system configured to project a pattern of the mask on the workpiece placed on the placement base, and a mover configured to be capable of moving the irradiated region in the direction parallel to the short edges.

Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces are described herein. A method includes directing a laser beam in a geometrical pattern at an arcuate surface of a cylindrical target, blocking a portion of the laser beam to prevent a portion of the geometrical pattern from contacting the cylindrical target, and rotating the cylindrical target as the laser beam contacts the arcuate surface so as to ablate the cylindrical target.

Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces are described herein. A method includes directing a laser beam in a geometrical pattern at an arcuate surface of a cylindrical target, blocking a portion of the laser beam to prevent a portion of the geometrical pattern from contacting the cylindrical target, and rotating the cylindrical target as the laser beam contacts the arcuate surface so as to ablate the cylindrical target.

A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.

A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.

To provide a laser annealing device capable of performing annealing whereby electron mobility is different depending on the part, a mask, a thin film transistor, and a laser annealing method. A laser annealing device of the present invention is provided with a mask in which a plurality of openings are formed along the scanning direction, moves a substrate in the scanning direction, and irradiates the substrate with laser light via the openings. The openings respectively have first opening regions, which are aligned in the scanning direction, and which have a same shape, and some of the openings among the openings respectively have second opening regions continuous to the first opening regions in the predetermined direction with respect to the first opening regions.

To provide a laser annealing device capable of performing annealing whereby electron mobility is different depending on the part, a mask, a thin film transistor, and a laser annealing method. A laser annealing device of the present invention is provided with a mask in which a plurality of openings are formed along the scanning direction, moves a substrate in the scanning direction, and irradiates the substrate with laser light via the openings. The openings respectively have first opening regions, which are aligned in the scanning direction, and which have a same shape, and some of the openings among the openings respectively have second opening regions continuous to the first opening regions in the predetermined direction with respect to the first opening regions.