A tool for laser beam processing is provided. The tool includes an upper tool and a lower tool, which are able to be advanced toward one another by way of a press, such that at least one component is able to be fixed in a predefined position between the upper tool and the lower tool. At least one laser beam exit surface, which is part of an inner surface of the upper tool or lower tool, and at least one laser beam guide, into which laser radiation is able to be coupled and is able to be directed through the laser beam exit surface onto a processing location on the component are provided. A control device, which enables and/or disables the coupling of laser radiation into the at least one laser beam guide depending on the advancing movement between upper tool and lower tool is provided. Furthermore, a laser beam processing apparatus and a method for laser beam processing are also provided.

A laser processing system includes a laser oscillator, a laser beam emitting tool connected to the laser oscillator and supported by a first robot, the laser beam emitting tool emitting a laser beam supplied by the laser oscillator, and a laser processing tool which is supported by a second robot and which receives the laser beam emitted by the laser beam emitting tool and emits the laser beam toward a predetermined processing position.

A laser processing apparatus includes: a scanner configured to adjust a path of at least one of a first laser beam and a second laser beam; and a lens unit configured to condense the first laser beam and the second laser beam received from the scanner. The scanner may include a first reflection member for providing the first laser beam to the lens unit and a second reflection member for providing the second laser beam to the first reflection member.

A three dimensional printing system includes a laser system, a beam splitter, a pinhole, a sensor, and a controller. The laser system emits a light beam of varying diameter carrying at least 100 watts of optical power along an optical path. The laser has an imaging plane along the optical path which can be coincident or close to a focal plane at which the beam has a minimum diameter. The beam splitter is positioned along the optical path to receive the beam and to transmit most of the optical power and to reflect remaining optical power. The pinhole is positioned along the optical path at the imaging plane to receive the reflected beam having a minimal diameter. The controller is configured to analyze a signal from the sensor to determine intensity and distribution parameters for the light beam.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a spatially multi-focused laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a spatially multi-focused laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

A laser annealing apparatus, a fabrication method of a polysilicon thin film, and a fabrication method of a thin film transistor are provided. The laser annealing apparatus includes: a laser generator, an optical system and an annealing chamber. The laser generator is configured to emit a laser beam, and the laser beam is guided to the annealing chamber via the optical system. The optical system includes a beam splitter, the beam splitter decomposes the laser beam into a first beam and a second beam, an energy density of the first beam is greater than an energy density of the second beam, and the first beam and the second beam are guided into the annealing chamber for laser annealing.

The present disclosure relates to the field of display technology, and in particular relates to a light shielding structure and a laser device. The light shielding structure comprises a first light shielding plate group and a second light shielding plate group, each of the first light shielding plate group and the second light shielding plate group comprises at least one light shielding plate, and the at least one light shielding plate can be moved relatively for forming at least two light transmitting regions. The light shielding structure can realize partial scanning of multiple target regions at a time, thereby saving production time, increasing production efficiency, saving water and electricity and other resources, and prolonging the laser lifetime.

An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

The invention relates to a device and a method for generating a multiple spot during laser material processing. According to the present invention, the power distribution is selected by pushing at least a first mirror into the laser beam. The light beam always falls on only one side of the mirror, so that the mirror can be produced easily and economically.