A method of additively manufacturing includes determining a track for manufacturing a layer of a component with a powder blend; traversing the track with a conditioning energy beam to cause sintering of powder particles along a denuded region within the powder blend; and traversing the track with a melting energy beam subsequent to the conditioning energy beam to from the layer of the component. An additive manufacturing system includes a build chamber that contains a powder blend; a controller operable to determine a track for manufacturing a layer of a component with the powder blend in the build chamber; a conditioning energy beam directed along the track by the controller to cause sintering of powder particles along a denuded region within the powder blend; and a melting energy beam directed along the track by the controller subsequent to the conditioning energy beam to form the layer of the component.

A method for preparing a workpiece for separation is provided that includes providing a workpiece that is transparent for light of a pulsed laser beam, splitting the laser beam into two partial beams using an optical system, directing both partial beams onto the workpiece, and moving the workpiece and the partial beams relative to one another. The partial beams are directed onto the workpiece incident at different angles to the normal of the irradiated surface and superimposed inside the workpiece such that the partial beams interfere with one another to form a sequence of intensity maxima inside the workpiece. The intensity at the intensity maxima is sufficiently high to modify the material of the workpiece so that a chain-like periodic pattern of material modifications is formed along a path defining a separation line.

Systems and methods for additive manufacturing, and, in particular, such methods and apparatus as employ pulsed lasers or other heating arrangements to create metal droplets from donor metal micro wires, which droplets, when solidified in the aggregate, form 3D structures. A supply of metal micro wire is arranged so as to be fed towards a nozzle area by a piezo translator. Near the nozzle, an end portion of the metal micro wire is heated (e.g., by a laser pulse or an electric heater element), thereby causing the end portion of the metal micro wire near the nozzle area to form a droplet of metal. A receiving substrate is positioned to receive the droplet of metal jetted from the nozzle area.

An aluminum alloy precursor composition and method for fusion processing is provided which reduces hot cracking, improves compositional control, reduces porosity, and/or enhances the mechanical properties of the fusion processed article. The precursor material and fusion process using the same may be utilized for forming an article that meets compositional specifications for aluminum 6061 alloy, while minimizing defects and meeting desired strength and ductility requirements. The fusion process may include a leading energy beam for liquefying the precursor material to form a melt pool, and a trailing energy beam directed toward a trailing region of the melt pool. The trailing energy beam may be configured to enhance agitation and/or redistribution of liquid in the melt pool to prevent hot cracking, reduce porosity, or improve other characteristics of the solidified part. The method also may improve processing parameters, such as adjusting vacuum level to prevent volatilization of alloying elements.

A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a plurality of processing lights; and a first change apparatus that changes an intensity distribution of the plurality of processing lights from the light irradiation apparatus on the surface of the object, the processing apparatus changes a thickness of a part of the object by irradiating the surface of the object with the plurality of processing lights.

A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a measurement apparatus that measures a position of an irradiation area, which is formed on the surface of the object by the light irradiation apparatus, relative to the object.

An adjustment of the amount of energy in at least one specific applying unit is executed when energy is applied to a cylindrical member pair in which another cylindrical member is inserted inside a cylindrical member to melt and weld the cylindrical member pair in a circumferential direction. The adjustment is executed in association with a rotation angle to satisfy a relationship of Pd+Pw>, wherein Pd is an output decease rotation angle that decreases the energy amount from a steady energy amount HP applied from the specific applying unit in a welding end process, Pw is an overlap rotation angle at which the irradiation parts around the cylindrical member pair overlap with the steady energy amount HP, and is a separation angle between the specific applying unit and another applying unit adjacent to each other in a rotation direction around the axis.

A laser welding method includes preliminarily heating an entire welding path by irradiating the entire welding path with a heating laser beam for a first predetermined time, the welding path being closed loop-shaped and formed at a boundary between two workpieces as welding objects, and performing scanning with a welding laser beam along the welding path while continuously performing the irradiation with the heating laser beam after the preliminary heating and terminating the irradiation with the welding laser beam after the welding laser beam goes around the welding path.

A laser processing method for a wafer that is segmented by plural planned dividing lines set on a surface in a lattice manner uses a laser processing apparatus including a laser beam irradiation unit that irradiates, through a collecting lens, the wafer held by a chuck table, with plural laser beams formed by being oscillated by a laser beam oscillator and being split by a laser beam splitting unit. The method includes a processed groove forming step of irradiating the wafer with the plural laser beams along the planned dividing lines and forming a processed groove along the planned dividing lines. The plural laser beams split by the laser beam splitting unit are arranged in a line manner along a direction that is non-parallel to an extension direction of the planned dividing line irradiated with the plural laser beams.

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , an effective spot size w.sub.o,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range Z.sub.Rx,min in an x-direction and a minimum Rayleigh range Z.sub.Ry,min in a y-direction. Further, the smaller of Z.sub.Rx,min and Z.sub.Ry,min is greater than F.sub.Dw.sub.0,eff.sup.2/, where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.