Patent classifications
B23K26/0676
SUBSTRATE MANUFACTURING METHOD
A substrate manufacturing method of manufacturing a substrate from a workpiece is disclosed. A laser beam is first split and condensed to form a plurality of focal points aligned side by side along a first direction, and with the focal points positioned inside the workpiece, the focal points and the workpiece are moved relative to each other along a second direction orthogonal to the first direction such that a separation layer is formed. A region of the focal points and the workpiece are then moved relative to each other along the first direction. These relative movements are alternately and repeatedly performed. The splitting and condensation of the laser beam are performed such that a volume expansion of the workpiece associated with the formation of the modified regions is relatively small in the vicinity of at least one focal point formed on a center side.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part. The controller controls the spatial light modulator so that a converging point of the 0th-order light in the Z direction is located on an opposite side of a converging point of non-modulated light of the laser light with respect to an ideal converging point of the 0th-order light.
LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD
A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in the X direction.
METHOD FOR CUTTING A GLASS ELEMENT AND CUTTING SYSTEM
A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first processing step as a perforation laser, with which a perforation (12) is produced in the glass element (2) along an intended cutting line (8), whereby the processing laser (4) is operated in a second processing step with a modified laser beam (14) as a separating laser, with which a splitting of the filaments (6) forming the perforation (12) is effected.
ARRANGEMENT OF OPTICAL ELEMENTS AND METHOD FOR FORMING STRUCTURAL PATTERNS
An arrangement in which an angular prism is formed with two triangular part prisms which are connected to one another by a layer having properties splitting at least one laser beam into part beams. The two part prisms have two identical acute angles α. The laser beam is directed onto an outward-facing surface of one of the two part prisms. The at least one laser beam is split into two part beams by the reflection of a part of the radiation by the layer and transmission of a further part of the radiation through the layer. The part beams are each incident on an outward-facing surface, are reflected there and exit from the part prisms and are incident on at least one optical element and are aligned such that they interfere with one another in a region of a component in which a structural pattern is intended to be formed.
Rotary beam symmetrizer
An optical device may include a polarization splitter to split a unidirectional rotary optical beam into a first rotary optical beam having a first polarization state and a second rotary optical beam having a second polarization state. The unidirectional rotary optical beam and the second rotary optical beam may have optical power with a first direction of spatial rotation. The optical device may include a reflective element to reverse a parity of the first rotary optical beam in association with causing optical power of the first rotary optical beam to have a second direction of spatial rotation. The optical device may include a polarization combiner to, after reversal of the parity of the first rotary optical beam, combine the first rotary optical beam and the second rotary optical beam to create a bi-directional rotary optical beam having the first polarization state and the second polarization state.
PROCESS FOR MANUFACTURING A DISTRIBUTION PARTITION
Method for manufacturing a spray partition pierced with a network of holes through which a fluid product passes under pressure so as to be broken into fine droplets, the process comprising the following steps: a) providing a laser source (S) able to produce a laser beam (F), b) forming the laser beam (F) into an array of parallel partial laser beams (Fp), c) directing the array of parallel partial laser beams (Fp) so as to strike a membrane (P0), d) letting the array of parallel partial laser beams (Fp) strike the membrane (P0) with a view to piercing a network of holes into it (O1), so as to obtain a spray partition pierced with a network of holes,
characterised in that the entirety of the holes of the spray partition are pierced, consecutively, by a plurality of arrays of partial laser beams.
PROCESSING APPARATUS USING LASER, METHOD OF PROCESSING A SUBSTRATE USING LASER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other.
APPARATUS AND METHOD FOR HARDENING A TRANSPARENT MATERIAL
A method for hardening a transparent material includes the steps of introducing a material modification to the transparent material using a laser beam of ultrashort laser pulses of an ultrashort pulse laser so as to harden at least a portion of the transparent material.
MANUFACTURING DEVICE AND METHOD FOR THE ADDITIVE MANUFACTURING OF A COMPONENT PART FROM A POWDER MATERIAL, AND METHOD FOR PRODUCING A SPECIFIC INTENSITY PROFILE OF AN ENERGY BEAM
A manufacturing device for additive manufacturing of component parts from a powder material includes a beam producing device, a scanner device configured to displace an energy beam to a plurality of irradiation positions, a deflection device configured to displace the energy beam at an irradiation position to a plurality of beam positions, and a control device configured to control the deflection device and to produce a specific intensity profile in the beam region. The control device does this by dividing and displacing the energy beam to at least two beam positions separated by a distance that is variably settable and/or by displacing the energy beam and by specifying at least one operating parameter of the deflection, such as a residence time at a beam position, a beam position density distribution, a frequency distribution, and an intensity influencing parameter of the energy beam deflected to the beam positions.