An electrode welding method includes a laser irradiation apparatus preparation step of preparing a laser irradiation apparatus including a laser oscillator that emits a laser beam with a wavelength having absorbability with respect to a semiconductor chip and a spatial light modulator that adjusts the energy distribution of the laser beam emitted by the laser oscillator, an electrode positioning step of positioning, corresponding to electrodes of a wiring substrate, bump electrodes of a device, and an electrode welding step of irradiating the back surface of the semiconductor chip with the laser beam and welding the bump electrodes to the electrodes of the wiring substrate.

An apparatus for structuring a roller surface is proposed, wherein the apparatus has a laser source and an optical system, wherein the laser source is designed for generating laser pulses, wherein the optical system has at least one beam shaper, at least one beam splitter, and a focusing unit, wherein the combination of beam shaper and beam splitter is arranged between the laser source and the focusing unit.

A method for processing a transparent workpiece including directing a laser beam in a first orientation along a first beam pathway where a first portion of the laser beam includes a first laser beam focal line and generates an induced absorption to produce a first defect segment within the transparent workpiece. The method further includes adjusting the laser beam to a second orientation along a second beam pathway where a second portion of the laser beam includes a second laser beam focal line and generates the induced absorption to produce a second defect segment within the transparent workpiece. Each of the first and second laser beam focal lines include a circular angular spectrum within the transparent workpiece; and at least one of the laser beam focal lines include an internal focal line angle of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

Systems and methods for laser processing systems and associated methods for using and manufacturing such systems are disclosed herein. In some embodiments, a laser processing system includes a controller, a laser source, a material support, and a beam delivery subsystem operably coupled to the controller. The beam delivery subsystem comprises an optical carriage assembly configured to receive and modify a laser beam from the laser source, and direct the laser beam toward a material to be processed carried by the material support. The optical carriage assembly is further configured to focus the laser beam within a material processing field to obtain an adjustable power density within a material processing plane and achieve an optimal selected condition for the material to be processed.

The present disclosure relates to a method of modifying a surface of a material, in situ, while the material is being used to at least one of form or modify a portion of a part to remove flaws layer-by-layer and improve a part from a layerwise built, or a coating. The method may involve generating first, second and third beams. The third beam may act on a surface of a material to heat a portion of the surface of the material into a flowable state to thus modify a surface characteristic of the material. The first beam may control an optically addressable light valve (OALV) which modifies an energy of the third beam. The second beam may control an optically addressable electric field modulator (OAEFM) to generate an electric field in a vicinity of the surface and to influence a movement of the portion of material while the portion of material is in the flowable state. The beams are modulated based on a sensing element feedback loop.

A processing apparatus has: a light irradiation apparatus configured to irradiate a coat formed on a base member with a processing light; and a controlling apparatus configured to control the light irradiation apparatus. The processing apparatus is configured to change a thickness of at least a part of the coat by irradiating the coat with the processing light so that the base member is not exposed from the coat.

A processing apparatus is a processing apparatus that irradiates a surface of an object with processing light to process an object and is provided with: a light irradiation apparatus that emits first processing light to form a first irradiation area on the surface and emits second processing light to form a second irradiation area, at least a part of which overlaps with the first irradiation area, on the surface, and has a change member that is configured to change a state of an overlap between the first and second irradiation areas.

A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.

The present disclosure discloses a method and apparatus for manufacturing a microfluidic chip with a femtosecond plasma grating. The method is characterized in that two or more beams of femtosecond pulse laser act on quartz glass together at a certain included angle and converge in the quartz glass, and when pulses achieve synchronization in time domain, the two optical pulses interfere; Benefited by constraint of an interference field, only one optical filament is formed in one interference period; and numbers of optical filaments are arranged equidistantly in space to form the plasma grating. The apparatus for manufacturing the microfluidic chip includes a plasma grating optical path, a microchannel processing platform, and a hydrofluoric acid ultrasonic cell.

A method of manufacturing a deposition mask includes: a splitting process in which a laser beam irradiated from a light source is split into a plurality of laser beams; a scanning process in which the plurality of laser beams are simultaneously scanned onto the mask substrate; and a tuning process in which irradiation states of the plurality of laser beams are finely changed to correspond to shapes of the plurality of pattern holes while the plurality of laser beams are scanned.