A device for cutting human or animal tissue including a femtosecond laser that can emit a L.A.S.E.R. beam in the form of impulses. The device directs and focuses the beam onto or into the tissue for the cutting thereof. The device further includes and element to shape the L.A.S.E.R. beam, positioned in the trajectory of the beam, and to modulate the energy distribution of the L.A.S.E.R. beam in the focal plane thereof, corresponding to the cutting plane.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

A laser processing apparatus has a laser beam applying unit for applying a laser beam to a workpiece held on a chuck table. The laser beam applying unit includes an elliptical spot forming member for changing the spot shape of a pulsed laser beam into an elliptical shape and making the major axis of the elliptical beam spot parallel to a feeding direction, a diffractive optical element for branching the pulsed laser beam having the elliptical beam spot obtained by the elliptical spot forming member, into a plurality of pulsed laser beams each having an elliptical beam spot whose major axis extends in the feeding direction, and a condensing lens for condensing each of the pulsed laser beams branched by the diffractive optical element to the workpiece in such a manner that the major axes of the elliptical beam spots of the pulsed laser beams branched are partially overlapped.

Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. A method includes emitting a laser beam providing the laser beam to a lenslet array including a plurality of lenslets, and generating, from the laser beam, a plurality of laser sub-beams using the lenslet array. Each one of the plurality of laser sub-beams is generated by a corresponding one of the plurality of lenslets. Each lenslet of the plurality of lenslets has the same shape.

Disclosed is a laser keyhole welding structure and a keyhole welding method of an aluminum material which stably suppress the generation of sputtering to ensure a reliable electrical connection and obtain a mechanically strong connection. To achieve this, a laser keyhole welding structure of an aluminum material is formed by welding an aluminum material element constituting an electronic component by irradiating a laser beam to the electronic component, in which a tapered portion spread angle (θ) of an upper portion of a welding nugget to be formed is 45° or less. Also disclosed is a laser keyhole welding structure of an aluminum material.

A laser processing device for generating a plurality of grooves in a surface comprises an optical diffraction arrangement adapted to receive a laser radiation and to generate an output radiation hereupon, the output radiation having a plurality of intensity maxima. An actuator arrangement is provided for generating a relative movement between the output radiation and the surface, wherein each intensity maximum generates a groove of the plurality of grooves.

The present invention relates to a laser apparatus using optical fibers for stable laser welding and a laser welding method using same. Hybrid ring mode-shaped laser beams, in which a central beam using fiber laser is positioned at the center of outer beams using diode laser, are used to perform welding by irradiating a to-be-welded portion of an object with the outer beams, the central beam, and the outer beams in this order. Thus, since the welding is performed using the central beam as a heat source in a state in which the to-be-welded portion of the object has been heated with a sufficient amount of heat input, the temperature gradient of the to-be-welded portion is low and solidification cracking does not occur. Also, problems such as spatter and voids can be minimized, and the laser welding is stable, and thus a quality of welding that is uniform and stable overall can be obtained.

A branching element configured to branch a second laser light into a plurality of beams of branch light along a machining feed direction, and a second condenser lens configured to focus the plurality of beams of branch light branched by a branching element onto a street to be machined are provided, and a time period τ is expressed as τ=L/V, where L is a branch distance, which corresponds to spacing between adjacent leading and trailing spots for each of branch lights focused on the street by the second condenser lens, V is a machining speed, which corresponds to a speed of relative movement, and τ is the time period taken until the trailing spot overlaps a machining position of the leading spot, and τ>τ1 is satisfied, where τ1 is a threshold value of the time period when deterioration of the machining quality of the second groove occurs.

A method of additively manufacturing includes determining a track for manufacturing a layer of a component with a powder blend; traversing the track with a conditioning energy beam to cause sintering of powder particles along a denuded region within the powder blend; and traversing the track with a melting energy beam subsequent to the conditioning energy beam to from the layer of the component. An additive manufacturing system includes a build chamber that contains a powder blend; a controller operable to determine a track for manufacturing a layer of a component with the powder blend in the build chamber; a conditioning energy beam directed along the track by the controller to cause sintering of powder particles along a denuded region within the powder blend; and a melting energy beam directed along the track by the controller subsequent to the conditioning energy beam to form the layer of the component.