Patent classifications
B23K26/0732
Square pulse laser lift off
A laser lift-off method includes generating a plurality of solid state laser pulses, converting the plurality of solid state laser pulses to an ultraviolet frequency, adjusting the transverse spatial intensity profile of the plurality of laser pulses across perpendicular transverse axes to be rectangular in shape with the shape along each transverse axis corresponds to a super-Gaussian of order eight or higher, and scanning the plurality of laser pulses across the target along a direction parallel to one of the transverse axes in order to produce laser lift-off on the target. Systems for laser lift-off are also disclosed.
LASER IRRADIATION METHOD AND LASER IRRADIATION DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The present invention is characterized in that by laser beam being slantly incident to the convex lens, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the present invention has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.
A Processing Head for a Hybrid Additive/Subtractive Manufacturing Center
A processing head assembly is provided for use with a movable tool holder of a machine tool. The processing head assembly includes an upper processing head coupled to the movable tool holder and having a body defining a socket, and a feed powder/propellant port coupled to the body and operably coupled to a feed powder/propellant supply. The processing head assembly further includes a lower processing head having a base configured to be releasably coupled to the socket, and a nozzle coupled to the base and defining a feed powder/propellant interface configured to detachably couple to the feed powder/propellant port and a nozzle exit orifice.
Laser Shock Peening Method for Obtaining Large-Area Uniform Surface Morphology
Provided is a laser shock peening method for obtaining a large-area uniform surface morphology. Using the relationship between the thickness of an absorption layer and a plastic deformation due to the laser shock peening and using a grid-shaped absorption layer (5) having a staggered distribution in thickness in cooperation with a two-layer interlaced laser shock processing method significantly reduce the height difference between micro-protrusions (10) and micro-pits (12) produced by an impact of a square light spot, and effectively reduce the roughness of the workpiece surface such that a large-area uniform surface morphology is formed on the workpiece surface.
Method of laser irradiation, laser irradiation apparatus, and method of manufacturing a semiconductor device
If an optical path length of an optical system is reduced and a length of a laser light on an irradiation surface is increased, there occurs curvature of field which is a phenomenon that a convergent position deviates depending on an incident angle or incident position of a laser light with respect to a lens. To avoid this phenomenon, an optical element having a negative power such as a concave lens or a concave cylindrical lens is inserted to regulate the optical path length of the laser light and a convergent position is made coincident with a irradiation surface to form an image on the irradiation surface.
Long stand off distance high power laser tools and methods of use
There are provided high power laser cutting tools, optics assembly and laser beam configurations having long stand off distances, which provide high power laser beams, greater than 1 kW, to cut and volumetrically remove targeted materials. There is also provided methods of using these tools using a beam delivery angle that provides for molten material to be removed by flowing out of the targeted material.
Machine Tool System and Method for Additive Manufacturing
Methods and apparatus for performing additive manufacturing processes using a machine tool may include controlling an orientation of a processing head to control the tangential angle of a fabrication energy beam, a feed powder nozzle, or both. The orientation of a non-circular energy beam may be control to more evenly distribute the energy beam across a width of a tool path. Additionally or alternatively, the orientation of the feed powder nozzle may be controlled to project toward a powder target that is spaced from a beam target. The powder target may be directed to a trailing edge of a beam spot formed by the energy beam to increase the amount of powder incorporated into a melt pool formed by the energy beam. Alternatively, the powder target may be directed to a leading edge of the beam spot to provide a self-correcting feature to address thickness errors formed in previous layers of added material.
Laser processing apparatus and method for processing workpiece
A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system configured to shape laser light in such a way that a laser light irradiated region of a mask configured to block part of the laser light has a rectangular shape having short edges and long edges, a second radiation width of the irradiated region in the direction parallel to the long edges being changeable independently of a first radiation width of the irradiated region in the direction parallel to the short edges, and the irradiated region being movable in the direction parallel to the long edges, a projection optical system configured to project a pattern of the mask on the workpiece placed on the placement base, and a mover configured to be capable of moving the irradiated region in the direction parallel to the short edges.
ADDITIVE MANUFACTURING SYSTEMS AND METHODS
Aspects described herein relate to additive manufacturing systems and related methods. An additive manufacturing system may include two or more laser energy sources and associated optical fibers. An optics assembly may be constructed and arranged to form a rectangular laser energy pixel associated with each laser energy source. Each pixel may have a substantially uniform power density, and the pixels may be arranged to form a linear array of laser energy pixels on a build surface with no spacing between the pixels. Exposure of a portion of a layer of material on the build surface to the linear array of laser energy pixels may melt the portion of the layer.
VARIABLE-PULSE-WIDTH FLAT-TOP LASER DEVICE AND OPERATING METHOD THEREFOR
Provided are a variable pulse width flat-top laser device and an operation method therefor. A variable pulse width flat-top laser device includes a light source unit including first and second laser light sources driven at different times to respectively emit pulse-type first and second laser beams, a beam shaping unit configured to shape the first and second laser beams emitted from the light source unit into flat-top laser beams, a combination/split unit located between the light source unit and the beam shaping unit, and including a first beam combination/split unit configured to combine optical paths of the first and second laser beams and split a combined optical path into at least two optical paths so that the split at least two optical paths are directed to different regions of an incident surface of the beam shaping unit, and an imaging optical system configured to time-sequentially overlay the flat-top laser beams shaped by the beam shaping unit on a target object to form an image.