B23K26/0732

Optimized-coverage selective laser ablation systems and methods

Optimized-coverage selective laser ablation systems and methods may be utilized to prepare (ablate) a three-dimensional surface. Methods comprise receiving a 3D virtual model of the surface to be ablated, generating a preliminary ablation path, and optimizing the preliminary ablation path to produce an adapted ablation path. Methods may comprise ablating the surface according to the adapted ablation path. The preliminary ablation path may be based on scanning a laser sheet across a two-dimensional projection of the surface. The optimization may adjust one or more waypoints of the preliminary ablation path to achieve complete coverage of the surface at acceptable levels of ablation, with little to no ablation outside the surface, and with acceptable (e.g., at least locally minimal) time to ablate the surface.

LASER RADIATION SYSTEM

A laser radiation optical system for laser doping and post-annealing, the laser radiation system including A. a laser apparatus configured to generate pulsed laser light that belongs to an ultraviolet region, B. a stage configured to move a radiation receiving object in an at least one scan direction, the radiation receiving object being an impurity source film containing at least an impurity element as a dopant and formed on a semiconductor substrate, and C. an optical system including a beam homogenizer configured to shape the beam shape of the pulsed laser light into a rectangular shape and generate a beam for laser doping and a beam for post-annealing that differ from each other in terms of a first beam width in the scan direction but have the same second beam width perpendicular to the scan direction.

LASER ETCHING APPARATUS AND LASER ETCHING METHOD USING THE SAME
20200230740 · 2020-07-23 ·

A laser etching apparatus includes a light source to emit a first laser beam having a first energy profile; and a scanner to radiate a second laser beam upon an object along a circular path, the second laser beam having a second energy profile different from the first energy profile.

LASER PROCESSING MACHINE

A profile selector includes at least one beam-forming lens refracting a laser beam to be incident so as to convert a beam profile and emits a laser beam having a beam profile selected from a plurality of beam profiles. A collimating lens converts a laser beam of a divergent beam to be incident into collimated light. A focusing lens focuses the collimated light emitted from the collimating lens and irradiates the focused beam to a sheet metal of a processing target. A moving mechanism moves the collimating lens along an optical axis such that a deviation of a focal point is reduced caused when the beam profile of the focused beam emitted from the focusing lens is selected by the profile selector.

LASER IRRADIATION DEVICE, METHOD OF MANUFACTURING THIN FILM TRANSISTOR, PROGRAM, AND PROJECTION MASK
20200171601 · 2020-06-04 ·

A laser irradiation device includes a light source for generating a laser beam, a projection lens for irradiating a prescribed region of an amorphous silicon thin film deposited on a substrate with the laser beam, and a projection mask pattern that is disposed on the projection lens and that includes a rectangular transmission region for transmitting the laser beam in a prescribed projection pattern; and is characterized in that a short side of the rectangular transmission region has a length that causes the irradiation energy of the laser beam passing through the projection mask pattern to become substantially uniform in the prescribed region.

LASER ANNEALING DEVICE AND LASER ANNEALING METHOD
20200171602 · 2020-06-04 ·

A laser annealing device includes a light source that generates laser light; a fly-eye lens that makes an intensity distribution of the laser light uniform; a projection mask that masks the laser light having passed through the fly-eye lens; and a projection lens that forms a laser beam that irradiates a predetermined range of a substrate with the laser light having passed through the projection mask, wherein an arrangement orientation of the fly-eye lens is rotated by a predetermined angle with respect to an arrangement of a mask pattern of the projection mask to reduce moire that may be generated by interference fringes generated when the laser light passes through the projection mask passing through the fly-eye lens.

Fiber-coupled laser with time varying beam characteristics

Methods, apparatus, and systems comprising a fiber-coupled laser and time-varying beam characteristics. A laser may generate an optical beam that is launched into one or more lengths of fiber, at least one of which comprises a confinement region that is optically coupled to an output. A perturbation device may modulate, through action upon the one or more lengths of fiber, a beam characteristic over a time period during which the laser is energized. A controller may cause the perturbation device to act upon the one or more lengths of fiber to impart a time-averaged beam characteristic and/or to induce a continuous variation in one or more beam characteristics during system use. A process monitor may sense a metric external to the optical system, and a feedback signal from the process monitor may be coupled into the controller. Dynamic beam characteristics may be modulated based on the feedback signal.

Additive manufacturing systems and methods for the same
10661342 · 2020-05-26 · ·

Additive manufacturing systems and methods for fabricating an article are provided. The additive manufacturing system may include a substrate and a layering device configured to fabricate a first layer of the article on the substrate. The layering device may include an optical beam source configured to generate an optical beam and a variable beam characteristics (VBC) fiber operably coupled with the optical beam source and configured to modify one or more beam characteristics, such as a wavelength, of the optical beam.

Laser irradiation apparatus, method for manufacturing semiconductor device, and method for operating laser irradiation apparatus

A laser annealing apparatus (1) according to an embodiment includes a laser oscillator (4) configured to generate a laser beam (L), a floating-type conveying stage (3) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler (7) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage (3) includes a conveying surface (3a) opposed to the workpiece (W), and a bottom surface (3b) on the side opposite to the conveying surface (3a). The beam profiler (7) is positioned below the bottom surface (3b) of the floating-type conveying stage (3). The floating-type conveying stage (3) includes a detachable part (12) in a part of it. An opening (S) is formed by detaching the detachable part (12) from the floating-type conveying stage (3), the opening (3) extending from the conveying surface (3a) to the bottom surface (3b). The beam profiler (7) is configured to measure the beam profile of the laser beam (L) through the opening (S).

Multi-function semiconductor and electronics processing

A method of tailoring beam characteristics of a laser beam during fabrication of an electronic device. The method includes: providing a substrate comprising one or more layers; adjusting one or more characteristics of a laser beam; and impinging the laser beam having the adjusted beam characteristics on the substrate to carry out at least one process step for fabricating the electronic device. The adjusting of the laser beam comprises: perturbing the laser beam propagating within a first length of fiber to adjust the one or more beam characteristics of the laser beam in the first length of fiber or a second length of fiber or a combination thereof, the second length of fiber having two or more confinement regions; coupling the perturbed laser beam into the second length of fiber; and emitting the laser beam having the adjusted beam characteristics from the second length of fiber.