B23K26/0732

Immersion laser fabrication method and system
20200061741 · 2020-02-27 ·

The present invention discloses an immersion laser fabrication method and system, the method comprises providing a substrate with a first shape; disposing the substrate in a carrier, and a liquid is injected into the carrier; providing a laser source to generate a laser beam; cutting the substrate along a second shape by the laser beam based on an application program in order to separate the substrate into a main substrate and a sub-substrate, the sub-substrate is detached from the substrate and sinks to the bottom of the carrier, or the substrate is drilled by the laser beam based on the application program in order to form a hole and a derivative in the substrate, the derivative is detached from the substrate and sinks to the bottom of the carrier; and obtaining the main substrate, the substrate with the hole, or the main substrate with the hole.

LASER KEYHOLE WELDING STRUCTURE OF ALUMINUM MATERIAL AND LASER KEYHOLE WELDING METHOD
20200047282 · 2020-02-13 ·

Disclosed is a laser keyhole welding structure and a keyhole welding method of an aluminum material which stably suppress the generation of sputtering to ensure a reliable electrical connection and obtain a mechanically strong connection. To achieve this, a laser keyhole welding structure of an aluminum material is formed by welding an aluminum material element constituting an electronic component by irradiating a laser beam to the electronic component, in which a tapered portion spread angle () of an upper portion of a welding nugget to be formed is 45 or less. Also disclosed is a laser keyhole welding structure of an aluminum material.

Method for laser beam heat treatment of press hardened components and press hardened components
10533234 · 2020-01-14 · ·

Methods for manufacturing hot-stamped components are described. The method includes providing a hot-stamped component by hot forming die quenching, and selecting a first and a second portion of the hot-stamped component, wherein the first portion has a different width than the second portion. A laser system, wherein the laser system includes one or more optical elements and a laser source for generating a laser beam. The laser system is moved along a length of the component. Finally, the laser beam is applied in a single pass onto the selected first and second portions using the laser system, wherein a laser beam spot size is adjusted during the application of the laser beam and is adapted to the widths of the first and second portions, and wherein a power of the laser beam is regulated based on the temperature measured in the hot-stamped component. The disclosure further relates to components obtained using such methods.

Gas permeable window and method of fabricating the same

A gas permeable glass window, suitable for use with liquid interface additive manufacturing, has an optically transparent glass article greater than about 0.5 millimeters in thickness defining a first surface and a second surface. A plurality of gas channels are disposed through the article from the first surface to the second surface. The gas channels occupy less than about 1.0% of a surface area of the article and are configured such that the article has a gas permeability between about 10 barrers and about 2000 barrers.

Laser shock peening method for obtaining large-area uniform surface morphology
10512987 · 2019-12-24 · ·

Provided is a laser shock peening method for obtaining a large-area uniform surface morphology. Using the relationship between the thickness of an absorption layer and a plastic deformation due to the laser shock peening and using a grid-shaped absorption layer (5) having a staggered distribution in thickness in cooperation with a two-layer interlaced laser shock processing method significantly reduce the height difference between micro-protrusions (10) and micro-pits (12) produced by an impact of a square light spot, and effectively reduce the roughness of the workpiece surface such that a large-area uniform surface morphology is formed on the workpiece surface.

LASER PROCESSING SYSTEMS AND METHODS FOR BEAM DITHERING AND SKIVING
20190381606 · 2019-12-19 ·

A system includes a laser source, a galvanometer mirror system, an f-theta scan lens and an acousto-optic deflector (AOD) system. The AOD system is operated to deflect a beam path along which a laser beam propagates in a manner that corrects for scan field distortion induced by one or both of the f-theta lens and galvanometer mirror system.

Method for processing superfine blade edge using femtosecond laser
11938568 · 2024-03-26 · ·

Proposed is a method of processing a superfine blade edge using a femtosecond laser, the method including primarily grinding a blade edge portion by using a grinding wheel, the blade edge being primarily ground in a direction vertical to a rotational direction of the grinding wheel; and secondarily grinding at least a part of the blade edge portion by emitting a femtosecond laser to the ground blade edge portion in a lengthwise direction, wherein the secondarily grinding includes: oscillating the femtosecond laser; modifying the energy distribution of the femtosecond laser; aligning a central portion of the energy distribution of the femtosecond laser to an end portion of the blade edge portion; changing an advancing direction of the femtosecond laser; and emitting the femtosecond laser to the blade edge portion while moving, in the lengthwise direction of the blade, a stage on which the blade is placed.

Annealing apparatus using two wavelengths of radiation

A thermal processing apparatus and method in which a first laser source, for example, a CO.sub.2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO.sub.2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Method of laser irradiation, laser irradiation apparatus, and method of manufacturing a semiconductor device

If an optical path length of an optical system is reduced and a length of a laser light on an irradiation surface is increased, there occurs curvature of field which is a phenomenon that a convergent position deviates depending on an incident angle or incident position of a laser light with respect to a lens. To avoid this phenomenon, an optical element having a negative power such as a concave lens or a concave cylindrical lens is inserted to regulate the optical path length of the laser light and a convergent position is made coincident with a irradiation surface to form an image on the irradiation surface.

LASER IRRADIATION METHOD AND LASER IRRADIATION DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present invention is characterized in that by laser beam being slantly incident to the convex lens, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the present invention has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.