Patent classifications
B23K26/0738
Modular laser apparatus
A laser apparatus includes a plurality of laser modules each generating a laser line in a working plane. The laser modules are juxtaposed so that the laser lines generated by the modules combine into a single laser line. Each of the laser modules includes at least one laser line generator. The laser line generator includes two linear arrays of strips of laser diodes each emitting a focused laser beam. The two linear arrays are arranged parallel to each other so that the strips are staggered. The two sets of parallel laser beams generated by the two linear arrays of strips, respectively, are merged into a single laser line by a set of mirrors. The linear arrays of strips of laser diodes and the mirrors are arranged so that the two sets of laser beams trace optical paths of the same length before being merged into a single laser line.
LASER WELDING APPARATUS CAPABLE OF PERFORMING BELLOWS WELDING
A laser welding apparatus includes a laser head for irradiating laser beams transferred through a plurality of transferring optical fibers to a processing target connected thereto via a connector, wherein the laser head includes an optical fiber block having an accommodating space for accommodating the plurality of transferring optical fibers to be arranged along a first direction, and an optical system disposed in front of the optical fiber block and irradiating the laser beams transferred through the plurality of transferring optical fibers to the processing target.
LASER MACHINING SYSTEM
A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.
LASER ANNEALING DEVICE AND LASER ANNEALING METHOD
To provide a laser annealing apparatus which is high efficiency of irradiation energy and capable of achieving uniformity in density of irradiation energy in a region irradiated with a laser beam.
SOLVING MEANS
Scheduled treatment regions of a treatment film are each defined in the form of a strip extending in a scanning direction. Irradiation surface areas of line beams are oriented to be inclined relative to the scanning direction within respective scheduled treatment regions.
PHASE-MODIFIED QUASI-NON-DIFFRACTING LASER BEAMS FOR HIGH ANGLE LASER PROCESSING OF TRANSPARENT WORKPIECES
A method for processing a transparent workpiece including directing a laser beam in a first orientation along a first beam pathway where a first portion of the laser beam includes a first laser beam focal line and generates an induced absorption to produce a first defect segment within the transparent workpiece. The method further includes adjusting the laser beam to a second orientation along a second beam pathway where a second portion of the laser beam includes a second laser beam focal line and generates the induced absorption to produce a second defect segment within the transparent workpiece. Each of the first and second laser beam focal lines include a circular angular spectrum within the transparent workpiece; and at least one of the laser beam focal lines include an internal focal line angle of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.
LASER PROCESSING SYSTEM AND METHOD FOR GLASS WORKPIECE
A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.
EDGE POSITION DETECTING APPARATUS
An edge position detecting apparatus for detecting a position of an edge of a disk-shaped workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a laser displacement gage having a laser applying unit including a light source, for applying a linear laser beam shaped into a linear shape perpendicular to a direction of travel from the light source toward the holding surface, across the edge of the workpiece, and a beam detecting unit including a plurality of photoelectric transducers arrayed at predetermined spaced intervals along a direction for detecting a reflection of the linear laser beam, a moving mechanism for moving the laser displacement gage and the chuck table relatively to each other along the longitudinal direction, and a calculating unit for calculating the position of the edge on the basis of information of a change in an amount of the detected reflection.
Laser treatment device rectifier device and laser treatment device
A laser treatment device performing treatment by irradiating a target object having a plate surface with laser light, including: a light-transmitting region transmitting laser light emitted onto the target object; a rectifier that has a rectifier surface separated from the target object and extending along the plate surface of the target object and outward from the end of the light-transmitting region; a gas supply unit that feeds a gas to a gap between one side of the rectifier surface and the light-transmitting region, in a position separated from the light-transmitting region; and a gas exhaust unit that exhausts, on the other side that is on the other side of the light-transmitting region from the one side, the gas present in a gap between the rectifier surface and the target object from the gap, in a position separated from the light-transmitting region, thereby generating a stable local gas atmosphere.
Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
A laser irradiation apparatus (1) according to one embodiment includes a laser generating device (14) that generates a laser beam, a flotation unit (10) that causes a workpiece (16) that is to be irradiated with the laser beam to float, and a conveying unit (11) that conveys the floating workpiece (16). The conveying unit (11) conveys the workpiece (16) with the conveying unit (11) holding the workpiece (16) at a position where the conveying unit (11) does not overlap an irradiation position (15) of the laser beam. The laser irradiation apparatus (1) according to one embodiment makes it possible to suppress uneven irradiation with a laser beam.
Method and device for the laser-based machining of sheet-like substrates
A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.