A laser processing device for generating a plurality of grooves in a surface comprises an optical diffraction arrangement adapted to receive a laser radiation and to generate an output radiation hereupon, the output radiation having a plurality of intensity maxima. An actuator arrangement is provided for generating a relative movement between the output radiation and the surface, wherein each intensity maximum generates a groove of the plurality of grooves.

An optical device that is intended for laser treatment of internal surfaces of a covering part of the leading-edge type, including a collimator that is intended to be connected to a laser source via an optical fibre to produce a laser beam having a collimated and flat spatial pulse profile, a cylindrical lens that is configured to focus the laser beam along a spatial line that is transverse to the propagation of the laser beam thus forming a line-laser-beam, a reflecting optical component that is configured to be able to be introduced into the interior of the covering part and to uniformly reflect the line-laser-beam onto at least one internal surface of the covering part and in directions of incidence that are almost normal to at least one internal surface.

The present disclosure provides a device and a method for laser-based separation of a transparent, brittle workpiece, comprising a laser that emits a laser beam having an intensity (I.sub.L) along an optical axis (P), and an optical device. The optical device has at least one one-piece double axicon. The double axicon has an entrance surface and the optical device has an exit surface. The entrance surface is such that in the double axicon, a ring beam is formed. The intensity (I.sub.L) in the double axicon is lower than the threshold intensity (I.sub.S) of the material of the double axicon. The exit surface is such that a line focus having a maximum intensity (I.sub.max) and a length (L.sub.T) is generated in the direction of the laser beam behind the exit.

A method for processing a transparent workpiece that includes directing a laser beam the transparent workpiece. The laser beam incident to the impingement surface has an oblong angular spectrum and portion of the laser beam directed into the transparent workpiece is a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size w.sub.o, a Rayleigh range Z.sub.R that is greater than $F_D\frac{\pi w_o^2}{\lambda },$
where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater, and an internal beam angle of greater than 10° relative to a plane orthogonal to an impingement surface at an impingement location, such that the defect has a defect angle within the transparent workpiece of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

A laser system is configured for providing a laser line in a working plane for line illumination of an object. The laser line extends in a first direction over a significant length and in a second direction over a small extent. The laser system comprises a laser source for providing a laser beam as basis for an elongated input laser beam propagating along a propagation direction, and a homogenization and focussing unit for homogenizing the elongated laser beam to form the laser line. The laser system is in particular suitable for providing a laser line that can be stitched to another laser line of a respective further laser system.

A line beam irradiation apparatus (1000) includes a work stage (200), a line beam source (100) for irradiating a work (300) placed on the work stage (200) with a line beam; and a transporting device (250) for moving at least one of the work stage (200) and the line beam source (100) such that an irradiation position of the line beam on the work moves in a direction transverse to the line beam. The line beam source includes a plurality of semiconductor laser devices and a support for supporting the plurality of semiconductor laser devices. The plurality of semiconductor laser devices are arranged along a same line extending in a fast axis direction, and the laser light emitted from emission regions of respective ones of the semiconductor laser devices diverge parallel to the same line to form the line beam.

An apparatus includes a beam source, beam forming optics, a first focusing lens having a focal length, a second focusing lens having a focal length similar to the focal length of the first lens, and a lens translator configured to move the second lens transversely relative to the beam forming optics and to the first lens, and thereby move the elongated focus transversely. In some embodiments, the beam forming optics are positioned between the beam source and the first focusing lens, the first focusing lens is positioned between the beam forming optics and the second focusing lens, and the beam forming optics, the first focusing lens, and the second focusing lens are arranged to receive a beam of laser radiation from the beam source and to form the beam into an elongated focus.

A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

A panel-shaped glass element is provided that includes vitreous material having a thermal expansion coefficient of less than 10×10.sup.-6 K.sup.-1 as well as two opposing surfaces. The glass element furthermore has at least one recess which runs through the glass of the glass element and has a recess wall which runs around the recess and adjoins the two opposing surfaces. The recess wall has a structure with a multiplicity of mutually adjacent rounded dome-shaped depressions. A roughness of the recess wall is formed by these depressions as well as the ridges enclosing the depressions. The recess wall has a mean roughness value (Ra) which is less than 5 .Math.m.