A device for processing microstructure arrays of polystyrene-graphene nanocomposites, including a laser generator, a vacuum chamber, an object stage, an ultraviolet filter and a gas flow control unit. The object stage is detachably fixed to a bottom of the vacuum chamber with a passage that can be opened or closed. The ultraviolet filter is provided in the vacuum chamber. A laser light emitted by the laser generator arrives at the object stage through the ultraviolet filter. The object stage is configured to place a sample to be processed. The gas flow control unit is communicated with the vacuum chamber and is configured to control the flow of the gas entering the vacuum chamber. The vacuum chamber is fixed on a three-axis precision positioning platform via a vacuum chamber clamp. The device disclosed herein aims to solve the existing difficulty in processing microstructure arrays of polystyrene-graphene nanocomposites.

A laser processing system includes a wavelength tunable laser apparatus capable of changing the wavelength of pulsed laser light to be outputted, an optical system irradiating a workpiece with the pulsed laser light, a reference wavelength acquisition section acquiring a reference wavelength corresponding to photon absorption according to the material of the workpiece, a laser processing controller controlling the wavelength tunable laser apparatus to perform preprocessing before final processing performed on the workpiece, changes the wavelength of the pulsed laser light over a predetermined range containing the reference wavelength, and performs wavelength search preprocessing at a plurality of wavelengths, a processed state measurer measuring a processed state on a wavelength basis achieved by the wavelength search preprocessing performed at the plurality of wavelengths, and an optimum wavelength determination section assessing the processed state on a wavelength basis to determine an optimum wavelength used in the final processing.

A process to produce a workpiece surface or a groove inner surface on a rod-shaped, especially cylindrical workpiece. From the workpiece, a rotary tool is supposed to be produced. The material removal is done using laser beam pulses, which are directed through a deflection device onto points of incidence within a pulse area with a specified outside contour on the workpiece. Multiple machine axis drives position the workpiece and the deflection device relative to one another so that the pulse area is oriented essentially at right angles to the emission direction of the laser beam pulses and at right angles to the section of the tool surface that has already been produced and that borders the pulse area. While the material is being removed, the at least one machine axis drive moves the pulse area relative to the workpiece along a specified path of motion while maintaining the orientation.

The application relates to a machining robot (1) for machining workpieces using a laser beam (2), in particular a machining robot (1) having six axes, wherein the laser beam (2) is to be directed, especially by deflecting means, substantially along a longitudinal axis (3) of the machining robot (1) via an articulated coupling means (14) into an inlet (4) into a central machining robot shaft (5) and to a machining robot head (6) comprising a laser machining tool, in particular a jet nozzle means (19) around an output region (8) of the laser beam (2); the machining laser (9) for generating the laser beam (2) is integrated into a machining robot arm (10) which is part of the central machining robot shaft (5) and which essentially comprises a carbon housing (11), in particular consists of a carbon housing (11).

Laser additive manufacturing systems and apparatus using laser wavelengths below 800 nm. Raman laser modules having laser pump sources in the blue wavelength range. Matching functional laser beam wavelength with maximum absorption wavelengths of starting materials.

Laser additive manufacturing systems and apparatus using laser wavelengths below 800 nm. Raman laser modules having laser pump sources in the blue wavelength range. Matching functional laser beam wavelength with maximum absorption wavelengths of starting materials.

To realize a laser irradiation apparatus by using which accuracy in processing a substrate can be improved. A laser irradiation apparatus according to an embodiment includes a laser irradiation unit configured to apply laser light to a substrate, a base part, and a conveyance stage configured to convey the substrate. The conveyance stage includes a stage configured to be movable over the base part, a base flange fixed over the stage, a substrate stage fixed to an upper end part of the base flange and configured so that the substrate is placed thereover, and a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

An apparatus for orienting and positioning a workpiece (4) relative to a laser beam (3) of a laser processing machine is proposed. The apparatus is equipped with an apparatus base (5), with a workpiece locating device (6) which receives the workpiece (4) to be machined and with a movement device (7) exhibiting at least three axes which moves the workpiece locating device (6) relative to the apparatus base (5). The movement device (7) is equipped with a rigid body (12) and with a first rotary drive which generates a torque around an axis of rotation B and drives the rigid body (12) to rotate around the axis of rotation B relative to the machine base (5). On the rigid body (12) is arranged a first linear drive which displaces a first carriage (13) on the rigid body (12) along the axis Xw. On the first carriage (13) is arranged a second rotary drive (14) which generates a torque around an axis of rotation C which is different from the axis of rotation B and which drives the workpiece locating device (6) to rotate around the axis of rotation C.

A laser annealing device includes: a CW laser device configured to emit continuous wave laser light caused by continuous oscillation to preheat the amorphous silicon; a pulse laser device configured to emit the pulse laser light toward the preheated amorphous silicon; an optical system configured to guide the continuous wave laser light and the pulse laser light to the amorphous silicon; and a control unit configured to control an irradiation energy density of the continuous wave laser light so as to preheat the amorphous silicon to have a predetermined target temperature less than a melting point thereof, and configured to control at least one of a fluence and a number of pulses of the pulse laser light so as to crystallize the preheated amorphous silicon.