B23K26/0861

Systems and methods for laser trimming dental aligners

Systems and methods for laser trimming dental aligners include a model positioning system, an orientation determination system, and a laser trimming system. The model positioning system receives a physical dental model with a material thermoformed thereto. The dental model includes an orientation feature. The model positioning system moves the dental model to a position where the orientation feature is viewable by a camera. The camera captures an image of the orientation feature. The orientation determination system identifies an offset of the dental model by determining an actual orientation of the dental model based on the image of the orientation feature. The laser trimming system cuts the material from the dental model along a trim line while the fixture plate is moved about at least two axes relative to the laser trimming system.

LASER MACHINING SYSTEM
20200114467 · 2020-04-16 · ·

A laser machining system includes: a laser irradiation device that irradiates a workpiece with a laser beam; a workpiece moving device that moves the workpiece; a laser irradiation controller that controls the laser irradiation device to control an irradiation position of the laser beam; and a workpiece move controller that controls the workpiece moving device to control at least one of the position and the posture of the workpiece. The workpiece move controller transmits information about at least one of the position and the posture of the workpiece to the laser irradiation controller. The laser irradiation controller compensates for the irradiation position of the laser beam based on the information received from the workpiece move controller.

Laser working method, laser working apparatus, and its manufacturing method

An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.

PROCESSING DATA CREATION METHOD, LASER PROCESSING METHOD, PROCESSING DATA CREATION SYSTEM, PROCESSING SYSTEM, PROCESSING DATA CREATION PROGRAM, AND PROCESSING PROGRAM
20200110384 · 2020-04-09 ·

A processing data creation method of creating processing data to be used when a target object is formed inside a material by laser processing includes setting an impingement path for a laser beam inside the material in accordance with shape data indicating a shape of the target object, and creating the processing data by adjusting a location of the impingement path in an impingement direction of the laser beam in accordance with a refractive index of the material.

X-RAY TOPOGRAPHIC APPARATUS AND SUBSTRATE PROCESSING SYSTEM USING THE APPARATUS
20200083124 · 2020-03-12 ·

A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.

Laser machining apparatus that machines surface of workpiece by irradiating laser beam thereon

In a laser machining apparatus, a scanner is configured to scan a laser beam emitted from a laser beam emission device. A first part of a workpiece is exposed through an opening formed in the workpiece. A controller is configured to perform: acquiring shape data indicative of a shape of the workpiece; acquiring machining pattern data indicative of a machining pattern to be machined on the first part; acquiring a length of the machining pattern based on the machining pattern data; calculating an unmachinable position on a setting surface using the length and the shape data, the unmachinable position resulting from a second part of the workpiece hindering the laser beam reaching the first part, at least a part of the machining pattern being unmachinable on the first part in a state where the workpiece is set on the unmachinable position; and displaying the unmachinable position on a display.

METHOD FOR ADDITIVE MANUFACTURING NACELLE INLET LIPSKINS
20200061748 · 2020-02-27 · ·

An apparatus for fabricating a part, comprising a curved shaft; a build plate connected to the curved shaft; a motor; and a transmission connecting the motor and the curved shaft. The build plate moves along a curved path having a radius of curvature originating on an axis when the transmission transfers power from the motor to the curved shaft. Material deposited on the build plate along the curved path forms the part comprising a solid of revolution around the axis. In one or more examples, the part is an aircraft engine inlet.

Applications, methods and systems for materials processing with visible raman laser
10562132 · 2020-02-18 · ·

Laser additive manufacturing systems and apparatus using laser wavelengths below 800 nm. Raman laser modules having laser pump sources in the blue wavelength range. Matching functional laser beam wavelength with maximum absorption wavelengths of starting materials.

Wafer perforating device

A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.

Sensor Device for Scanning Laser Processing of a Workpiece by Means of a Laser Beam Deflected About a Pivot Point
20200016689 · 2020-01-16 ·

The invention relates to a sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point, said device comprising a holding device and at least two sensors, wherein the holding device is formed by a matrix- or honeycomb-shaped arrangement of sleeves, consisting of individual sleeves whose sleeve axes intersect at a point of intersection (P) outside the holding device, and the at least two sensors each being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis. The holding device advantageously is a monolithic component produced in a generative manufacturing process.