Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

The present invention relates to a positioning device for rotatably and rectilinearly positioning a card with respect to a treatment unit having an axis of treatment. The positioning device comprises a card holder for holding a card in a fixed position, wherein the card holder defines a virtual card surface plane coincident with the surface of a card facing the treatment unit once the card is placed in the card holder, and wherein the card holder defines a virtual card center point coincident with the intersection point of the axis of treatment and the virtual card surface plane. The positioning device further comprises a manipulator to which the card holder is attached, wherein the manipulator comprises: a cardanic element with a first axis of rotation and a second axis of rotation; and a virtual pivot point being the intersection of the first and the second axis of rotation.

The invention relates to a sensor device for scanning laser processing of a workpiece by means of a laser beam deflected about a pivot point, said device comprising a holding device and at least two sensors, wherein the holding device is formed by a matrix- or honeycomb-shaped arrangement of sleeves, consisting of individual sleeves whose sleeve axes intersect at a point of intersection (P) outside the holding device, and the at least two sensors each being arranged in one of the sleeves such that their sensor axis coincides with the sleeve axis. The holding device advantageously is a monolithic component produced in a generative manufacturing process.

An additive manufacturing apparatus is an additive manufacturing apparatus that performs an additive manufacturing process by depositing a molten fabrication material at a working position while moving the working position on a workpiece, and forms a manufactured product by repeating the additive manufacturing process. The apparatus includes a height measurement unit that outputs a measurement result representing the height of the manufactured product having already been formed on the workpiece at a measurement position, and a control unit that controls a machining condition to be used when new deposition is made at the measurement position, in accordance with the measurement result.

The present disclosure discloses a method and apparatus for manufacturing a microfluidic chip with a femtosecond plasma grating. The method is characterized in that two or more beams of femtosecond pulse laser act on quartz glass together at a certain included angle and converge in the quartz glass, and when pulses achieve synchronization in time domain, the two optical pulses interfere; Benefited by constraint of an interference field, only one optical filament is formed in one interference period; and numbers of optical filaments are arranged equidistantly in space to form the plasma grating. The apparatus for manufacturing the microfluidic chip includes a plasma grating optical path, a microchannel processing platform, and a hydrofluoric acid ultrasonic cell.

Provided is a wafer processing method for dividing a wafer having devices formed on a front side thereof into individual device chips, the front side being partitioned by a plurality of crossing division lines having a testing metal pattern formed in part thereof into a plurality of regions where the respective devices are formed. The method includes a first modified layer forming step of applying a laser beam of a wavelength having a transmitting property to the wafer with a focal point of the laser beam positioned inside the wafer at a first depth from the back side, thereby forming a first modified layer along a division line, and a second modified layer forming step of applying the laser beam with the focal point positioned at a second depth shallower than the first depth, thereby forming a second modified layer along the same division line.

A build plate-clamping assembly may include a work station having a build plate-receiving surface and a lock-pin extending from the build plate-receiving surface of the work station. The lock-pin may include a hollow pin body, a piston disposed within the hollow pin body, with the piston axially movable from a retracted position to an actuated position, and a plurality of detents, with the plurality of detents radially extensible through respective ones of a plurality of detent-apertures in the hollow pin body responsive to the piston having been axially moved to the actuated position. A methods of working on workpieces may include lockingly engaging a build plate at a first work station, performing a first work-step, releasing the build plate from the first work station, lockingly engaging the build plate at a second work station, and performing a second work-step. An additive manufacturing system may include a vision system with a first build plate-receiving surface and an additive manufacturing machine with a second build plate-receiving surface.

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

A processing system has: a housing in which an object is housed and that has a part through which light is allowed to pass; an irradiation apparatus that emits a processing beam for processing the object; a first member which an energy beam from the irradiation apparatus that propagates toward an outside of the housing through the part enters; and a second member which the energy beam through the first member enters, the first member reduces an intensity of the energy beam that enter the first member, the second member reduces an intensity of the energy beam that enters the second member from the first member.