Detectors are situated along a tilted optical axis to receive optical radiation from a work surface. Variations in the received optical power are used to estimate a work surface positional along a work surface axis. The received optical power can be emitted from the work surface and an estimated temperature of the work surface used to adjust the received optical power. One or two single element detectors or a linear detector can be used. A position of a focused spot produced from the received optical power at the linear detector can be used to assess work surface axial position.

The present disclosure discloses a method and apparatus for manufacturing a microfluidic chip with a femtosecond plasma grating. The method is characterized in that two or more beams of femtosecond pulse laser act on quartz glass together at a certain included angle and converge in the quartz glass, and when pulses achieve synchronization in time domain, the two optical pulses interfere; Benefited by constraint of an interference field, only one optical filament is formed in one interference period; and numbers of optical filaments are arranged equidistantly in space to form the plasma grating. The apparatus for manufacturing the microfluidic chip includes a plasma grating optical path, a microchannel processing platform, and a hydrofluoric acid ultrasonic cell.

A chuck table holding a frame unit including a workpiece is securely placed in an opening of an annular frame by a tape. A transparent holder having a holding surface holds the workpiece with the tape interposed therebetween. A frame body is erected around and surrounding the holder, the frame body having a plurality of suction holes that are open in an inner circumferential surface of the frame body. The frame body has an inside diameter equal to or smaller than an inside diameter of the annular frame. While an opening of the frame body is being covered by the tape, a suction force is transmitted through the suction holes into the frame body, discharging air from between the tape and the holding surface to bring the tape into intimate contact with the holding surface thereby securing the workpiece of the frame unit to the holding surface.

The invention relates to methods for creating and detecting images inside diamonds that carry information for various purposes, for example, an identification code, marks identifying diamonds. A method for creating an optically permeable image inside a diamond is disclosed, in which image consists of a given set of optically permeable elements of micron or submicron size, which elements are disturbances in the periodicity of the diamond crystal structure. The image created in the diamond is a mark consisting of the given set of optically permeable elements of micron or submicron size. The elements are disturbances in the periodicity of the diamond crystal structure with the participation of chemical elements of impurities formed at vacancies and interstitials in the volume of micron or submicron size. Methods and systems for detecting optically permeable images inside diamonds are also disclosed.

Laser processing systems and methods are capable of moving a laser beam while maintaining consistent laser beam characteristics at processing locations. The laser processing systems generate a collimated laser beam having a consistent Z axis power density along at least a portion of a length of the laser beam and dither the collimated laser beam along one of the X and Y axes. The dithering of the collimated laser beam facilitates consistent laser processing on a three-dimensional surface, for example, to provide consistent deposition of a coating in a laser cladding process. A laser processing system may include a beam delivery system that provides both the collimation and the dithering of the collimated laser as well as an adjustment of the beam diameter of the collimated beam.

A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.

The realization of arrays of antennas for specific applications through the use of diffraction optics to create patterns that will allow for parallel writing of arrays.

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

The invention relates to an apparatus 100 for 3D shaping of a workpiece 101 by material ablation with a laser beam 102. The apparatus 100 comprises a machining unit 103, which is configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 into the fluid jet 104 towards the workpiece 101. Further, the apparatus 100 includes a motion controller 105 configured to set an x-y-z-position of the workpiece 101 relative to the machining unit 103. It also includes a measuring unit 107 configured to measure a z-position of the point of incidence 108 of the pressurized fluid jet 104 on the workpiece 101 in the z-direction.

A method that makes it possible to produce actual cutting contours on tubes with only rough tolerances, to which contours others of the tubes can be joined and welded, wherein, as a result of the actual cutting contours being modified, the rough shape tolerance of the tubes does not enter the tolerance chain, or enters the latter only a little, for the tubes to be fully welded to form a tubular frame. It also allows the automated reception of only pre-oriented tubes by a gripping arm and the infeed thereof to a laser cutting device.