A processing apparatus is a processing apparatus that performs a process for irradiating an object with an energy beam, the processing apparatus is provided with: an energy beam irradiation apparatus that irradiates at least a part of a surface of the object with the energy beam; and a position change apparatus that changes an irradiation position of the energy beam at the surface of the object, the processing apparatus controls the irradiation position of the energy beam by using a shape information relating to a shape of the object.

Provided is a wafer processing method for dividing a wafer having devices formed on a front side thereof into individual device chips, the front side being partitioned by a plurality of crossing division lines having a testing metal pattern formed in part thereof into a plurality of regions where the respective devices are formed. The method includes a first modified layer forming step of applying a laser beam of a wavelength having a transmitting property to the wafer with a focal point of the laser beam positioned inside the wafer at a first depth from the back side, thereby forming a first modified layer along a division line, and a second modified layer forming step of applying the laser beam with the focal point positioned at a second depth shallower than the first depth, thereby forming a second modified layer along the same division line.

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

The invention provides a method and apparatus for forming a freeform metal structure by wire feed additive manufacturing. In accordance with the method, a holding structure is moved in at least one moving direction, the holding structure holding the metal structure. A metal wire end is fed along an area of deposition on the metal structure in the at least one moving direction. The metal wire end is heated to a melting temperature using a heat source, with the metal wire end as melted being deposited on the metal structure as a metallic build-up material. The metallic build-up material after heating and during the cooling is subjected in the at least one moving direction behind the area of deposition to at least one pulsed magnetic field using a magnetic coil arranged after the heat source, the at least one pulsed magnetic field effecting plastic deformation of the build-up material.

An apparatus for orienting and positioning a workpiece (4) relative to a laser beam (3) of a laser processing machine is proposed. The apparatus is equipped with an apparatus base (5), with a workpiece locating device (6) which receives the workpiece (4) to be machined and with a movement device (7) exhibiting at least three axes which moves the workpiece locating device (6) relative to the apparatus base (5). The movement device (7) is equipped with a rigid body (12) and with a first rotary drive which generates a torque around an axis of rotation B and drives the rigid body (12) to rotate around the axis of rotation B relative to the machine base (5). On the rigid body (12) is arranged a first linear drive which displaces a first carriage (13) on the rigid body (12) along the axis Xw. On the first carriage (13) is arranged a second rotary drive (14) which generates a torque around an axis of rotation C which is different from the axis of rotation B and which drives the workpiece locating device (6) to rotate around the axis of rotation C.

Apparatus (1) for additively manufacturing of three-dimensional objects by means of successive layerwise selective irradiation and consolidation of layers of a build material which can be consolidated by means of an energy beam, with a carrier device (2) with at least one carrier element (3) for carrying build material and/or at least one object to be built and a driving unit (4) configured to drive the at least one carrier element (3), wherein the driving unit (4) is coupled with the carrier element (3) via at least one coupling means (5), wherein at least one securing unit (10) is provided that is configured to secure the coupling of the carrier element (3) with the at least one coupling means (5), wherein the securing unit (10) is configured to apply a securing force directed axially on the coupling means (5).

The invention relates to a laser processing machine for removing material from a workpiece, comprising a first station, at which a laser processing tool is provided and at which the workpiece is processed by means of the laser processing tool, at least a second station, at which the workpiece is measured and/or processed, and a transport device for moving the workpiece between the first station and the second station, the transport device having at least two transport units which can be moved independently of one another in two different spatial directions (x, y) in such a way that the transport units can be moved past one another in a first spatial direction (x) along which the first and second stations (III, II) are arranged.

This invention provides a method for manufacturing a decorated part having a dynamic visual effect of a design that is drawn onto the surface of a work, thus reducing the manufacturing cost. The decorated part is manufactured by a laser-irradiating process, which involves irradiating a laser onto a decorative surface 4, thus forming a design 20 having many laser-processed linear grooves 21 closely aligned in a specific direction F1 on said decorative surface. Also, in the laser-irradiating process, said design 20 is formed such that the angle θ2 that is made by the specific direction F1 and by the direction F2 in which the laser-processed linear grooves 21 are extending is gradually changing into the direction in which such laser-processed linear grooves are aligned.

Method and devices using lasers to reduce reflection of transparent solids in the optical spectrum, coatings and devices employing transparent solids are disclosed. The lasers are used to shape surfaces of the transparent solid materials by raising the temperature of the material to around the melting temperature, and thereby generate desired target nanostructure two-dimensional antireflection flection pattern arrays on the surfaces. The laser fluence value, wavelength, repetition rate, pulse duraction and number of consecutive laser pulses per focus spot are selected, and a desired focus spot distribution on the surface of the transparent solid material is identified. The transparent solid material is relatively translated to generate the desired nanostructure two-dimensional pattern array.

A substrate manufacturing method capable of easily obtaining a thin magnesium oxide single crystal substrate is provided. A first step is performed which disposes a condenser for condensing a laser beam on an irradiated surface of a magnesium oxide single crystal member in a non-contact manner. A second step is performed which forms processing mark lines in parallel by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate relative to each other in a two-dimensional manner. A third step is performed which forms new processing mark lines between the adjacent irradiation lines in the second step to allow planar separation, by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate 20 relative to each other in a two-dimensional manner.